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Actalent

Microelectronics Packaging Design Engineer

Ottawa, ON, Canada
Kanata, ON, Canada

$110,000 to $160,000 CAD / year · Full-time

Apply About employer

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Job details

Pay: $110,000 to $160,000 CAD / year
Job type: Full-time
Apply by: Nov 25, 2026
Experience: Minimum of 12 years of relevant industry experience in electronic hardware design and semiconductor advanced packaging.
Posting language: English · French
Posted: Oct 26, 2026

Original job description

English section of this bilingual listing.

Job Title: Microelectronics Packaging Design Engineer in Ottawa

Job Description

The Microelectronics Packaging Design Engineer leads the development of advanced microelectronic and packaging solutions within a multidisciplinary environment that includes RF, optical, reliability, and process engineering. This role focuses on designing and engineering microelectronic packages and modules, integrating material selection, substrate layout, thermal and mechanical analysis, and design for manufacturing. The engineer evaluates industry trends to define microelectronic technologies and design concepts that meet customer requirements and align with emerging market standards, while overseeing supplier specifications, documentation, and lifecycle management. The position also provides technical mentorship, interfaces directly with customers and stakeholders, and supports business development through technical proposals and quotations for innovative engineering solutions.

Responsibilities

Provide technical leadership for microelectronic and advanced packaging solutions within a multidisciplinary team that includes RF, optical, reliability, and process engineering experts.
Engineer microelectronic packages and modules by integrating material selection, substrate layout, thermal and mechanical analysis, and design for manufacturing principles.
Evaluate industry trends and emerging technologies to select appropriate microelectronic solutions and define design concepts that align with specific customer requirements and market standards.
Define detailed specifications for custom outsourced components and manage the complete documentation lifecycle, including bills of materials (BOMs), assembly drawings, and Engineering Change Orders (ECO).
Lead and mentor junior members of the microelectronics design team, providing technical oversight, guidance, and support in day-to-day engineering activities.
Interface directly with customers, internal leadership, and project stakeholders to communicate technical development updates, address issues, and report project status.
Support business development efforts by engaging with prospective customers, preparing technical proposals, and drafting quotations for novel microelectronic and packaging engineering solutions.
Collaborate across the full product lifecycle, from concept and design through prototyping and high-volume manufacturing, ensuring robust and manufacturable package designs.
Apply design for manufacturing (DFM) best practices and reliability considerations to ensure that microelectronic packages meet performance, quality, and production requirements.
Utilize CAD tools such as AutoCAD and SolidWorks, along with FEA and packaging design software, to create, analyze, and optimize microelectronic package designs.
Contribute to documentation and communication by distilling complex technical data into clear, concise updates for stakeholders and customers.

Essential Skills

Bachelors degree in Mechanical Engineering, Physics, or a related technical discipline.
Minimum of 12 years of relevant industry experience in electronic hardware design and semiconductor advanced packaging.
Extensive experience in microelectronic and advanced packaging technologies, materials, components, and manufacturing methods.
Proven track record of technical leadership in end-to-end product development programs, from prototype through volume manufacturing.
Expert-level proficiency in AutoCAD and SolidWorks for mechanical and packaging design.
Experience using commercial Finite Element Analysis (FEA) tools for thermal and mechanical analysis of microelectronic packages.
Strong knowledge of microelectronics and advanced chip packaging, including flip chip, organic packages, and wafer-level technologies.
Experience applying design for manufacturing (DFM) principles to microelectronic packages and modules.
Ability to create and manage detailed technical documentation, including BOMs, assembly drawings, and ECOs.
Exceptional verbal and written communication skills, with the ability to distill complex technical information into concise updates for stakeholders and customers.
Ability to manage multiple high-priority programs simultaneously while maintaining quality and meeting deadlines.

Additional Skills & Qualifications

Experience with Cadence Allegro Package Designer Plus or similar packaging design software is an asset.
Familiarity with optical and RF communications, quantum computing, medical devices, automotive sensing, and datacenter connectivity applications.
Experience working with reliability testing, MEMS, and optical technologies in the context of microelectronic packaging.
Experience collaborating within multidisciplinary teams that include RF, optical, reliability, and process engineering.
Demonstrated ability to support business development activities through technical proposals and quotations for advanced engineering solutions.

Job Type & Location

This is a Permanent position based out of Kanata, ON.

Pay And Benefits

The pay range for this position is $110000.00 - $160000.00/yr.

Individual compensation offered for this position within this range will depend on many factors, including qualifications, skills, relevant experience, job knowledge, geographic location, internal equity, and other pertinent job-related factors.

Job Type & Location

This is a Permanent position based out of Kanata, ON.

Workplace Type

This is a fully onsite position in Kanata,ON.

À propos d'Actalent

About Actalent

Actalent is a global leader in engineering and sciences services and talent solutions. We help visionary companies advance their engineering and science initiatives through access to specialized experts who drive scale, innovation and speed to market. With a network of almost 20,000 consultants and 5,000 clients across the U.S., Canada, Asia and Europe, Actalent serves many of the Fortune 500. We are proud to be an Engineering News-Record (ENR) Top 500 Design Firm for our engineering design services and a ClearlyRated Best of Staffing® winner for both client and talent service.

The company is an equal opportunity employer and will consider all applications without regard to race, sex, age, color, religion, national origin, veteran status, disability, sexual orientation, gender identity, genetic information or any characteristic protected by law.

If you would like to request a reasonable accommodation, such as the modification or adjustment of the job application process or interviewing process due to a disability, please email actalentaccommodation@actalentservices.com for other accommodation options.

San Francisco Fair Chance Ordinance: Pursuant to the San Francisco Fair Chance Ordinance, for all positions located in the city and county of San Francisco, we will consider for employment qualified applicants with arrest and conviction records.

Use of Artificial Intelligence (AI):We may use Artificial Intelligence (AI) to support parts of our hiring process, including sourcing, screening, and evaluating candidates. AI helps assess applications and qualifications, but final decisions are made by our hiring team. By applying, you acknowledge and agree that your application may be reviewed using AI tools.

Read the full bilingual original

Provide technical leadership for microelectronic and advanced packaging solutions within a multidisciplinary team that includes RF, optical, reliability, and process engineering experts.
Engineer microelectronic packages and modules by integrating material selection, substrate layout, thermal and mechanical analysis, and design for manufacturing principles.
Evaluate industry trends and emerging technologies to select appropriate microelectronic solutions and define design concepts that align with specific customer requirements and market standards.
Define detailed specifications for custom outsourced components and manage the complete documentation lifecycle, including bills of materials (BOMs), assembly drawings, and Engineering Change Orders (ECO).
Lead and mentor junior members of the microelectronics design team, providing technical oversight, guidance, and support in day-to-day engineering activities.
Interface directly with customers, internal leadership, and project stakeholders to communicate technical development updates, address issues, and report project status.
Support business development efforts by engaging with prospective customers, preparing technical proposals, and drafting quotations for novel microelectronic and packaging engineering solutions.
Collaborate across the full product lifecycle, from concept and design through prototyping and high-volume manufacturing, ensuring robust and manufacturable package designs.
Apply design for manufacturing (DFM) best practices and reliability considerations to ensure that microelectronic packages meet performance, quality, and production requirements.
Utilize CAD tools such as AutoCAD and SolidWorks, along with FEA and packaging design software, to create, analyze, and optimize microelectronic package designs.
Contribute to documentation and communication by distilling complex technical data into clear, concise updates for stakeholders and customers.

Essential Skills

Bachelors degree in Mechanical Engineering, Physics, or a related technical discipline.
Minimum of 12 years of relevant industry experience in electronic hardware design and semiconductor advanced packaging.
Extensive experience in microelectronic and advanced packaging technologies, materials, components, and manufacturing methods.
Proven track record of technical leadership in end-to-end product development programs, from prototype through volume manufacturing.
Expert-level proficiency in AutoCAD and SolidWorks for mechanical and packaging design.
Experience using commercial Finite Element Analysis (FEA) tools for thermal and mechanical analysis of microelectronic packages.
Strong knowledge of microelectronics and advanced chip packaging, including flip chip, organic packages, and wafer-level technologies.
Experience applying design for manufacturing (DFM) principles to microelectronic packages and modules.
Ability to create and manage detailed technical documentation, including BOMs, assembly drawings, and ECOs.
Exceptional verbal and written communication skills, with the ability to distill complex technical information into concise updates for stakeholders and customers.
Ability to manage multiple high-priority programs simultaneously while maintaining quality and meeting deadlines.

Additional Skills & Qualifications

Experience with Cadence Allegro Package Designer Plus or similar packaging design software is an asset.
Familiarity with optical and RF communications, quantum computing, medical devices, automotive sensing, and datacenter connectivity applications.
Experience working with reliability testing, MEMS, and optical technologies in the context of microelectronic packaging.
Experience collaborating within multidisciplinary teams that include RF, optical, reliability, and process engineering.
Demonstrated ability to support business development activities through technical proposals and quotations for advanced engineering solutions.

Work Environment

This role is fully on-site and offers the opportunity to work hands-on with cutting-edge microelectronic packaging technologies. You will collaborate closely with experts across RF, optical, reliability, and process engineering throughout the full product lifecycle, from concept and design to prototyping and high-volume manufacturing.

Job Type & Location

This is a Permanent position based out of Kanata, ON.

Pay And Benefits

The pay range for this position is $110000.00 - $160000.00/yr.

Individual compensation offered for this position within this range will depend on many factors, including qualifications, skills, relevant experience, job knowledge, geographic location, internal equity, and other pertinent job-related factors.

Job Type & Location

This is a Permanent position based out of Kanata, ON.

Workplace Type

This is a fully onsite position in Kanata,ON.

À propos d'Actalent

Actalent est un leader mondial dans les services dingénierie et de sciences ainsi que dans les solutions de talents. Nous aidons des entreprises visionnaires à faire progresser leurs initiatives dingénierie et de science grâce à laccès à des experts spécialisés qui favorisent léchelle, linnovation et la rapidité de mise sur le marché. Avec un réseau de près de 20 000 consultants et 5 000 clients à travers les États-Unis, le Canada, lAsie et lEurope, Actalent dessert de nombreuses entreprises du Fortune 500. Nous sommes fiers dêtre lune des 500 meilleures firmes de conception de lEngineering News-Record (ENR) pour nos services de conception en ingénierie et un lauréat du prix ClearlyRated Best of Staffing® tant pour le service client que pour les talents.

Actalent est un employeur souscrivant au principe de légalité des chances et accepte toutes les candidatures sans tenir compte de la race, du sexe, de lâge, de la couleur, de la religion, des origines nationales, du statut dancien combattant, dun handicap, de lorientation sexuelle, de lidentité sexuelle, des renseignements génétiques ou de toute autre caractéristique protégée par la loi.

Si vous souhaitez faire une demande daccommodement raisonnable, tel que la modification ou lajustement du processus de demande demploi ou dentrevue à cause dun handicap, veuillez envoyer un courriel à actalentaccommodation@actalentservices.com pour connaître dautres options daccommodement.

Ordonnance sur légalité des chances de San Francisco: Conformément à lOrdonnance sur légalité des chances de San Francisco, pour tous les postes situés dans la ville et le comté de San Francisco, nous examinerons les candidatures des personnes qualifiées ayant un casier judiciaire ou des antécédents criminels.

Utilisation de lintelligence artificielle (IA): Nous pouvons utiliser lintelligence artificielle (IA) pour soutenir certaines étapes de notre processus dembauche, notamment la recherche, la présélection et lévaluation des candidatures. LIA aide à analyser les candidatures et les qualifications, mais les décisions finales sont prises par notre équipe de recrutement. En soumettant votre candidature, vous reconnaissez et acceptez que celle-ci puisse être examinée à laide doutils dIA.

About Actalent

Actalent is a global leader in engineering and sciences services and talent solutions. We help visionary companies advance their engineering and science initiatives through access to specialized experts who drive scale, innovation and speed to market. With a network of almost 20,000 consultants and 5,000 clients across the U.S., Canada, Asia and Europe, Actalent serves many of the Fortune 500. We are proud to be an Engineering News-Record (ENR) Top 500 Design Firm for our engineering design services and a ClearlyRated Best of Staffing® winner for both client and talent service.

The company is an equal opportunity employer and will consider all applications without regard to race, sex, age, color, religion, national origin, veteran status, disability, sexual orientation, gender identity, genetic information or any characteristic protected by law.

If you would like to request a reasonable accommodation, such as the modification or adjustment of the job application process or interviewing process due to a disability, please email actalentaccommodation@actalentservices.com for other accommodation options.

San Francisco Fair Chance Ordinance: Pursuant to the San Francisco Fair Chance Ordinance, for all positions located in the city and county of San Francisco, we will consider for employment qualified applicants with arrest and conviction records.

Use of Artificial Intelligence (AI):We may use Artificial Intelligence (AI) to support parts of our hiring process, including sourcing, screening, and evaluating candidates. AI helps assess applications and qualifications, but final decisions are made by our hiring team. By applying, you acknowledge and agree that your application may be reviewed using AI tools.

Apply About employer

More about this job

Responsibilities

Lead the design and development of microelectronic packages and modules, integrating materials, substrate layouts, thermal and mechanical analysis, reliability, and design-for-manufacturing practices from concept through high-volume production. Provide technical leadership and mentorship, manage specifications and engineering documentation, communicate with customers and stakeholders, and support business development with technical proposals and quotations.

Requirements

Requires a bachelor’s degree in Mechanical Engineering, Physics, or a related technical discipline, plus at least 12 years of relevant experience in electronic hardware design and advanced semiconductor packaging. Candidates should have expert-level AutoCAD and SolidWorks skills, experience with FEA and packaging technologies, a record of leading products from prototype to volume manufacturing, and strong communication and documentation abilities.

Skills

Microelectronics Packaging Design
Advanced Semiconductor Packaging
AutoCAD
SolidWorks
Finite Element Analysis
Thermal Analysis
Mechanical Analysis
Design for Manufacturing
Flip-Chip Packaging
Organic Packages
Wafer-Level Technologies
Packaging Materials Selection
Substrate Layout
Technical Documentation
Technical Leadership
Customer Communication

Visa sponsorship

Not detected in the job text

Keywords

Microelectronics Packaging
Advanced Semiconductor Packaging
Electronic Hardware Design
AutoCAD
SolidWorks
Finite Element Analysis
Flip Chip
Organic Packages
Wafer-Level Technologies
Design for Manufacturing
Thermal Analysis
Mechanical Analysis
Substrate Layout
Bills of Materials
Assembly Drawings
Engineering Change Orders
Reliability Testing
MEMS
Optical Technologies
RF Communications
Quantum Computing
Medical Devices
Automotive Sensing
Datacenter Connectivity
High-Volume Manufacturing
Technical Proposals
Supplier Specifications
Product Lifecycle Management

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