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Added 5 mins ago
F
Gestionnaire de projets / Project Manager
FluksAqua
Montreal, QC
- Full-time
Veolia Group is a global leader in environmental services, operating across all five continents with nearly 218,000 employees. Specializing in water, energy, and waste management, Veolia…
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contribuerez à la production d’un travail de haute qualité répondant aux besoins particuliers des clients.
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Thanks for visiting our Job Board. Please review our open positions and apply to the positions that match your qualifications.
Evertz
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- Full-time
…mount technology (SMT) manufacturing processes used in the production of broadcast and video transmission…
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Added 21 mins ago
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Senior Salesforce Developer
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- Full-time
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…closely with stakeholders and the broader Enterprise Technology team to turn business needs into clean, durable…
Added 35 mins ago
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Superintendent, Mechanical
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Added 35 mins ago
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- Part-time
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Added 35 mins ago
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Chemical Scientist
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Added 36 mins ago
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Sales and Solutions Coordinator
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Added 1 hour ago
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Scientifique De Données
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Added 1 hour ago
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Added 1 hour ago
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Added 1 hour ago
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- $30 to $60 CAD / hour
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Actalent

Microelectronics Process Engineer

Ottawa, ON, Canada
Kanata, ON, Canada

$110,000 to $160,000 CAD / year · Full-time

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Job details

Pay: $110,000 to $160,000 CAD / year
Job type: Full-time
Apply by: Nov 29, 2026
Posting language: English · French
Posted: Oct 30, 2026

Original job description

English section of this bilingual listing.

Job Title: Microelectronics Process Engineer

Job Description

This role focuses on developing and owning advanced microelectronics assembly processes for complex optoelectronic modules and related products. You will combine hands-on process engineering with process architecture responsibilities, translating customer needs into robust manufacturing requirements. Working within an R&D organization that closely collaborates with manufacturing, you will help drive technologies that support data center infrastructure as well as industrial, medical, and aerospace applications.

Responsibilities

Conceptualize and define assembly strategies for complex optoelectronic modules, ensuring alignment with performance, reliability, and manufacturability goals.
Lead hands-on development, optimization, and documentation of critical process recipes for microelectronics assembly.
Own key processes end to end, acting as a process architect by allocating process elements to be developed and maintained across the team.
Procure, evaluate, and qualify capital equipment in accordance with technology roadmaps and process requirements.
Translate customer requirements into clear manufacturing specifications and process guidelines.
Provide design-for-manufacturing and design-for-test (DFx) guidance to optimize yield and reliability prior to prototype builds.
Apply statistical process control and data analysis methods to monitor, control, and improve process performance.
Develop, author, and approve high-level process documentation, qualification plans, and qualification reports.
Mentor junior engineers by providing technical guidance on microelectronics processes, materials interactions, and process control methods.
Collaborate closely with R&D and manufacturing teams to ensure smooth technology transfer and scalable production.

Essential Skills

Bachelors degree or higher in a relevant engineering field.
8+ years of direct experience in microelectronics.
At least 2 years of demonstrable process ownership or process architect experience, including end-to-end responsibility for specific processes.
Expert knowledge of flip-chip assembly processes.
Expert knowledge of wire bonding processes.
Hands-on experience with surface mount technology (SMT).
Experience with reflow soldering and solder interconnect processes.
Experience with electrical interconnect technologies in microelectronics assemblies.
Familiarity with material interaction in microelectronics assemblies and related process control methods.
Experience with statistical process control (SPC) and data analysis for process monitoring and improvement.

Additional Skills & Qualifications

Experience with underfill processes in flip-chip and advanced packaging applications.
Experience in process engineering within R&D environments that interface with manufacturing.
Exposure to optoelectronic modules and optics-related packaging is beneficial.
Experience supporting applications in data centers, industrial systems, medical devices, or aerospace products.
Strong technical communication skills for authoring and approving documentation and qualification reports.
Ability to provide DFx guidance to improve yield and manufacturability before prototype builds.
Demonstrated ability to mentor and support junior engineers in process development activities.

Job Type & Location

This is a Permanent position based out of Kanata, ON.

Pay And Benefits

The pay range for this position is $110000.00 - $160000.00/yr.

Individual compensation offered for this position within this range will depend on many factors, including qualifications, skills, relevant experience, job knowledge, geographic location, internal equity, and other pertinent job-related factors.

Job Type & Location

This is a Permanent position based out of Kanata, ON.

Workplace Type

This is a fully onsite position in Kanata,ON.

À propos d'Actalent

About Actalent

Actalent is a global leader in engineering and sciences services and talent solutions. We help visionary companies advance their engineering and science initiatives through access to specialized experts who drive scale, innovation and speed to market. With a network of almost 20,000 consultants and 5,000 clients across the U.S., Canada, Asia and Europe, Actalent serves many of the Fortune 500. We are proud to be an Engineering News-Record (ENR) Top 500 Design Firm for our engineering design services and a ClearlyRated Best of Staffing® winner for both client and talent service.

The company is an equal opportunity employer and will consider all applications without regard to race, sex, age, color, religion, national origin, veteran status, disability, sexual orientation, gender identity, genetic information or any characteristic protected by law.

If you would like to request a reasonable accommodation, such as the modification or adjustment of the job application process or interviewing process due to a disability, please email actalentaccommodation@actalentservices.com for other accommodation options.

San Francisco Fair Chance Ordinance: Pursuant to the San Francisco Fair Chance Ordinance, for all positions located in the city and county of San Francisco, we will consider for employment qualified applicants with arrest and conviction records.

Use of Artificial Intelligence (AI):We may use Artificial Intelligence (AI) to support parts of our hiring process, including sourcing, screening, and evaluating candidates. AI helps assess applications and qualifications, but final decisions are made by our hiring team. By applying, you acknowledge and agree that your application may be reviewed using AI tools.

Read the full bilingual original

Conceptualize and define assembly strategies for complex optoelectronic modules, ensuring alignment with performance, reliability, and manufacturability goals.
Lead hands-on development, optimization, and documentation of critical process recipes for microelectronics assembly.
Own key processes end to end, acting as a process architect by allocating process elements to be developed and maintained across the team.
Procure, evaluate, and qualify capital equipment in accordance with technology roadmaps and process requirements.
Translate customer requirements into clear manufacturing specifications and process guidelines.
Provide design-for-manufacturing and design-for-test (DFx) guidance to optimize yield and reliability prior to prototype builds.
Apply statistical process control and data analysis methods to monitor, control, and improve process performance.
Develop, author, and approve high-level process documentation, qualification plans, and qualification reports.
Mentor junior engineers by providing technical guidance on microelectronics processes, materials interactions, and process control methods.
Collaborate closely with R&D and manufacturing teams to ensure smooth technology transfer and scalable production.

Essential Skills

Bachelors degree or higher in a relevant engineering field.
8+ years of direct experience in microelectronics.
At least 2 years of demonstrable process ownership or process architect experience, including end-to-end responsibility for specific processes.
Expert knowledge of flip-chip assembly processes.
Expert knowledge of wire bonding processes.
Hands-on experience with surface mount technology (SMT).
Experience with reflow soldering and solder interconnect processes.
Experience with electrical interconnect technologies in microelectronics assemblies.
Familiarity with material interaction in microelectronics assemblies and related process control methods.
Experience with statistical process control (SPC) and data analysis for process monitoring and improvement.

Additional Skills & Qualifications

Experience with underfill processes in flip-chip and advanced packaging applications.
Experience in process engineering within R&D environments that interface with manufacturing.
Exposure to optoelectronic modules and optics-related packaging is beneficial.
Experience supporting applications in data centers, industrial systems, medical devices, or aerospace products.
Strong technical communication skills for authoring and approving documentation and qualification reports.
Ability to provide DFx guidance to improve yield and manufacturability before prototype builds.
Demonstrated ability to mentor and support junior engineers in process development activities.

Work Environment

You will work primarily in a laboratory environment that is closely integrated with a manufacturing setting. The role sits within an R&D group that actively collaborates with production teams to industrialize new processes and technologies. The group focuses on solutions that support data center and related infrastructure, with additional design and manufacturing activities for industrial, medical, and aerospace applications. You can expect hands-on work with microelectronics assembly equipment such as SMT lines, reflow tools, flip-chip and wire bonding systems, and related inspection and test equipment. The environment emphasizes process ownership, cross-functional collaboration, and continuous improvement, with appropriate lab attire and safety practices required when working on the production floor or in the lab.

Job Type & Location

This is a Permanent position based out of Kanata, ON.

Pay And Benefits

The pay range for this position is $110000.00 - $160000.00/yr.

Individual compensation offered for this position within this range will depend on many factors, including qualifications, skills, relevant experience, job knowledge, geographic location, internal equity, and other pertinent job-related factors.

Job Type & Location

This is a Permanent position based out of Kanata, ON.

Workplace Type

This is a fully onsite position in Kanata,ON.

À propos d'Actalent

Actalent est un leader mondial dans les services dingénierie et de sciences ainsi que dans les solutions de talents. Nous aidons des entreprises visionnaires à faire progresser leurs initiatives dingénierie et de science grâce à laccès à des experts spécialisés qui favorisent léchelle, linnovation et la rapidité de mise sur le marché. Avec un réseau de près de 20 000 consultants et 5 000 clients à travers les États-Unis, le Canada, lAsie et lEurope, Actalent dessert de nombreuses entreprises du Fortune 500. Nous sommes fiers dêtre lune des 500 meilleures firmes de conception de lEngineering News-Record (ENR) pour nos services de conception en ingénierie et un lauréat du prix ClearlyRated Best of Staffing® tant pour le service client que pour les talents.

Actalent est un employeur souscrivant au principe de légalité des chances et accepte toutes les candidatures sans tenir compte de la race, du sexe, de lâge, de la couleur, de la religion, des origines nationales, du statut dancien combattant, dun handicap, de lorientation sexuelle, de lidentité sexuelle, des renseignements génétiques ou de toute autre caractéristique protégée par la loi.

Si vous souhaitez faire une demande daccommodement raisonnable, tel que la modification ou lajustement du processus de demande demploi ou dentrevue à cause dun handicap, veuillez envoyer un courriel à actalentaccommodation@actalentservices.com pour connaître dautres options daccommodement.

Ordonnance sur légalité des chances de San Francisco: Conformément à lOrdonnance sur légalité des chances de San Francisco, pour tous les postes situés dans la ville et le comté de San Francisco, nous examinerons les candidatures des personnes qualifiées ayant un casier judiciaire ou des antécédents criminels.

Utilisation de lintelligence artificielle (IA): Nous pouvons utiliser lintelligence artificielle (IA) pour soutenir certaines étapes de notre processus dembauche, notamment la recherche, la présélection et lévaluation des candidatures. LIA aide à analyser les candidatures et les qualifications, mais les décisions finales sont prises par notre équipe de recrutement. En soumettant votre candidature, vous reconnaissez et acceptez que celle-ci puisse être examinée à laide doutils dIA.

About Actalent

Actalent is a global leader in engineering and sciences services and talent solutions. We help visionary companies advance their engineering and science initiatives through access to specialized experts who drive scale, innovation and speed to market. With a network of almost 20,000 consultants and 5,000 clients across the U.S., Canada, Asia and Europe, Actalent serves many of the Fortune 500. We are proud to be an Engineering News-Record (ENR) Top 500 Design Firm for our engineering design services and a ClearlyRated Best of Staffing® winner for both client and talent service.

The company is an equal opportunity employer and will consider all applications without regard to race, sex, age, color, religion, national origin, veteran status, disability, sexual orientation, gender identity, genetic information or any characteristic protected by law.

If you would like to request a reasonable accommodation, such as the modification or adjustment of the job application process or interviewing process due to a disability, please email actalentaccommodation@actalentservices.com for other accommodation options.

San Francisco Fair Chance Ordinance: Pursuant to the San Francisco Fair Chance Ordinance, for all positions located in the city and county of San Francisco, we will consider for employment qualified applicants with arrest and conviction records.

Use of Artificial Intelligence (AI):We may use Artificial Intelligence (AI) to support parts of our hiring process, including sourcing, screening, and evaluating candidates. AI helps assess applications and qualifications, but final decisions are made by our hiring team. By applying, you acknowledge and agree that your application may be reviewed using AI tools.

Apply About employer

More about this job

Responsibilities

Develop, own, optimize, and document microelectronics assembly processes for complex optoelectronic modules, including process architecture, equipment qualification, and manufacturing specifications. Apply process control and data analysis, provide design-for-manufacturing and design-for-test guidance, mentor junior engineers, and collaborate with R&D and manufacturing teams to transfer technologies into scalable production.

Requirements

Requires a bachelor's degree or higher in a relevant engineering field, at least eight years of direct microelectronics experience, and at least two years of demonstrable end-to-end process ownership or process architecture experience. Candidates should have expert knowledge of flip-chip assembly and wire bonding, hands-on SMT experience, and familiarity with soldering, electrical interconnects, materials interactions, and statistical process control.

Skills

Microelectronics Assembly
Flip-Chip Assembly
Wire Bonding
Surface Mount Technology
Reflow Soldering
Solder Interconnects
Electrical Interconnect Technologies
Underfill Processes
Process Engineering
Process Ownership
Statistical Process Control
Data Analysis
Design for Manufacturing
Design for Test
Process Qualification
Optoelectronic Packaging

Visa sponsorship

Not detected in the job text

Keywords

Microelectronics
Optoelectronic Modules
Flip-Chip Assembly
Wire Bonding
Surface Mount Technology
Reflow Soldering
Solder Interconnects
Electrical Interconnects
Underfill
Advanced Packaging
Process Engineering
Process Architecture
Process Ownership
Capital Equipment Qualification
Manufacturing Specifications
Design for Manufacturing
Design for Test
Statistical Process Control
Data Analysis
Process Recipes
Process Documentation
Qualification Plans
Qualification Reports
Materials Interactions
Yield Improvement
Reliability
Technology Transfer
Manufacturing Scale-Up
R&D
Industrialization

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