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Added 10 days ago
Project Manager, Transit Planning
Halifax Regional Municipality
NS
Halifax Regional Municipality is inviting applications for a permanent full time position of Project Manager, Transit Planning position in the Planning & Customer Engagement division with…
Added 10 days ago
Sales Pursuits and Activation Manager, Deloitte Global Consulting Services
Deloitte
Toronto, ON
The Sales Pursuits and Activation Manager, Global Consulting Services is responsible for working with Global Sales Coaches to guide pursuit teams through all aspects of the pursuit…
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NH
IMAGING INFORMATICS SYSTEMS ADMINISTRATOR, FT
Niagara Health
ON
- $51.02 CAD / hour
…wide level. Reporting to the Imaging Informatics and Business Manager, you will work with the imaging informatics team, DI/Cardiology staff, Radiologists, Cardiologists, Pathologists,…
Added 10 days ago
Talent Acquisition Specialist
Clark Construction Management
Mississauga, ON
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Sales Manager
GLENTEL INC
Edmonton, AB
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Director, PE Business Partner - Mobile
Electronic Arts
Vancouver, BC
This is a hybrid remote/in-office role requiring at least three days per week
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Director, Employee Relations
Autodesk
Remote, Canada
- $144,000 to $211,200 CAD / year
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HR Generalist
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Assistant Store Manager
JD Sports Canada
Richmond, BC
- $43,000 to $50,000 CAD / year
Our Retail team is is looking for an Assistant Store Manager at our Richmond Centre location! Come join our quickly growing and developing team at JD Sports Canada. Main responsibilities…
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Senior Director, People Operations
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General Manager
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Victoria, BC
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Nanaimo, BC
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Accounts Payable
N. Harris Computer Corporation - CAD
ON
- $40,000 to $45,000 CAD / year
We encourage all candidates to apply. Only candidates who meet the required criteria will be contacted, by a Harris manager or a member of the Talent Acquisition team. Please note that…
Added 11 days ago
AI Development Manager
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Richmond, BC · Vancouver, BC
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Gestionnaire de Cas, Bilingue/Bilingual Caseworker
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…reference tool provided for organizational consistency and talent architecture purposes across Cencora. It does not alter actual job duties, responsibilities, reporting lines, working…
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7761 - Seasonal Sales Help
Hat World Inc.
AB
Career development opportunities and professional training programs.
Added 11 days ago
7751 - Seasonal Sales Help
Hat World Inc.
Calgary, AB
Career development opportunities and professional training programs.
Added 11 days ago
7763 - Seasonal Sales Help
Hat World Inc.
Calgary, AB
Career development opportunities and professional training programs.
Added 11 days ago
7754 - Seasonal Sales Help
Hat World Inc.
Calgary, AB
Career development opportunities and professional training programs.
Added 11 days ago
7769 - Seasonal Sales Help
Hat World Inc.
Calgary, AB
Career development opportunities and professional training programs.

AMD, Inc.

Sr. Manager Packaging Engineering

Markham, ON, Canada

Apply on canadacareers-amd.icims.com About employer

Applications open in a new tab.

Job details

Apply by: Oct 9, 2027
Posting language: English
Posted: Oct 9, 2026

Original job description

WHAT YOU DO AT AMD CHANGES EVERYTHING

At AMD, our mission is to build great products that accelerate next-generation computing experiences - from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges - striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career.

Responsibilities

THE ROLE:

Help turn “possibility” into “reality” by leading the design execution of next-generation Data Center GPU and MI programs. This role represents a critical leadership position responsible for delivering high-performance, high-complexity package designs in a fast-paced environment.

In this role you will lead cross-functional teams across design, Signal/Power Integrity, substrate vendors, OSAT partners, and program management to ensure successful execution of multiple concurrent programs. You will drive operational excellence, scale execution using automation and AI-enabled methodologies, and deliver best-in-class package solutions that meet aggressive timelines and technical requirements.

THE PERSON :

The ideal candidate will have excellent program management and leadership skills. Can work with global cross functional teams in a fast paced environment and someone who can excel at influencing.

KEY RESPONSIBILITIES:

Program & Execution Leadership

Lead end-to-end execution of multiple Data Center GPU / MI package design programs, ensuring schedule, quality, and cost targets are consistently met.
Drive execution in fast-paced, dynamic, and high-pressure environments, managing competing priorities across programs.
Establish and maintain robust execution frameworks, including milestone tracking, risk management, and readiness gates.
Interface with senior leadership to provide clear program status, risks, and mitigation strategies.

Team Leadership & Development

Lead, mentor, and grow a high-performing team of package design engineers across geographies.
Foster a culture of accountability, innovation, and continuous improvement aligned with AMD engineering excellence.
Conduct performance reviews, talent development planning, and succession management.

Technical & Cross-Functional Leadership

Collaborate with silicon, SI/PI, thermal, mechanical, and manufacturing teams to ensure design convergence.
Engage with OSAT and substrate vendors to drive design feasibility, manufacturability, and yield optimization.

Process & Methodology Innovation

Define and drive improved design methodologies, workflows, and best practices to enhance execution efficiency.
Champion adoption of AI/ML-enabled tools and automation (e.g., layout optimization, design rule checking, predictive analytics) to improve productivity and decision-making.
Scale digital transformation initiatives within the package design organization.

PREFERRED EXPERIENCE:

Experience in semiconductor package design, with strong focus on high-performance or data center products.
Proven experience leading teams and executing multiple concurrent complex projects in fast-paced environments.
Strong understanding of package layout, high-speed design considerations, and multi-die integration.
Experience with AI/ML applications in engineering workflows (design automation, data analytics, optimization).
Excellent leadership, communication, and stakeholder management skills.
Demonstrated ability to handle ambiguity, drive decisions, and deliver under pressure.
Experience working with OSATs, substrate vendors, and manufacturing partners.
Hands-on experience with industry tools such as Synopsys 3DICC, Cadence SiP / APD or equivalent.
Experience in Data Center GPU, HPC, or advanced packaging technologies (e.g., chiplets, 2.5D/3D integration).

EDUCATION : B.S. or higher in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field.

Qualifications

Benefits offered are described: AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.

This posting is for an existing vacancy.

Apply on canadacareers-amd.icims.com About employer

More about this job

Responsibilities

The Senior Manager of Packaging Engineering at AMD will lead teams and partners to deliver high-performance chip packages on tight schedules. The role also grows the engineering team and improves design methods using automation and AI tools.

Requirements

Candidates need a bachelor's degree or higher in electrical, computer, or mechanical engineering, plus experience leading teams on complex semiconductor package projects. Strong program management, stakeholder communication, and familiarity with high-speed design and advanced packaging are needed.

Skills

Synopsys 3DICC
Cadence SiP
Cadence APD
package layout
high-speed design
signal integrity
power integrity
thermal analysis
design rule checking
multi-die integration
chiplets
2.5D/3D integration
program management
milestone tracking
risk management
team leadership
stakeholder management
vendor management
OSAT coordination
substrate vendor management
AI/ML tools
design automation
yield optimization
design for manufacturability

Keywords

semiconductor package design
advanced packaging
Data Center GPU
MI accelerator
chiplets
2.5D/3D integration
multi-die integration
program management
engineering management
Synopsys 3DICC
Cadence SiP
Cadence APD
OSAT
substrate
signal integrity
power integrity
AI/ML design automation
packaging engineering manager

Seniority

Senior

Tools

Synopsys 3DICC
Cadence SiP
Cadence APD

Languages

English

Fields of study

Electrical Engineering
Computer Engineering
Mechanical Engineering

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