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Added 4 days ago
YC
JEE Developer, senior
Yoush Consulting
Toronto, ON
- Full-time
…System and Enrollment and Consent Management / Claims Data Entry…
Added 4 days ago
SH
Senior Metallurgist
SIEL Human Solutions
Thompson, MB
- Full-time
We are currently seeking a Senior Metallurgist to join our Concentrator Technical Services Team in Thompson, Manitoba. This is a permanent position. Relocation to Thompson is required.
Added 4 days ago
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Manager Business Communications Partner (Temporary 6-months)
CN
Montreal, QC · Greater Montreal Metropolitan Area
- Temporary
…(SMEs) by serving as a communications advisor, planner, and developer. The incumbent builds and owns annual communications plans for the function and handles ad-hoc requests and special…
Added 4 days ago
A
Advanced Substrate Design & Process Integration
AMD
Markham, ON
- $180,000 to $270,000 CAD / year
- Full-time
Develop reliability-aware design guidelines for advanced package applications.
Added 4 days ago
UO
Analyst, Financial Reporting
University of Calgary
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- Full-time
…monthly/quarterly/annually financial statements for University Senior Administrations and Ministry of Advanced…
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- Full-time
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Associate or Vice President, Global Markets
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- Full-time
Assist senior staff in the research and resolution of administrative/operational issues
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Senior Program Manager - Global Product Technology
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Vancouver, BC
- Full-time
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.Net Developer (C#, C++) & Application Support (Burnaby)
Added 4 days ago
UO
Communications Specialist
University of British Columbia
Vancouver, BC · UBCV | School of Population & Public Health (SPPH)
- $6,143.67 to $8,830.25 CAD / month
- Full-time
Note: Applications will be accepted until 11:59 PM on the Posting End Date.
Added 4 days ago
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Senior Manager, Applications and Engineering
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Toronto, ON
- Full-time
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Senior Financial Analyst
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Toronto, ON
- $90,000 to $110,000 CAD / year
- Full-time
The Senior Financial Analyst serves as a vital Finance Business Partner to Capital Formation business leaders, driving impactful financial planning, analysis, and strategic decision…
Added 4 days ago
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Senior Java Developer - Vice President
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Mississauga, ON
- Full-time
We are seeking for a “Technology Lead Analyst" to join our team; this is a senior role responsible for overseeing the design and implementation of new or enhanced application systems in…
Added 4 days ago
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Applications Development AI Developer, Assistant Vice President
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Mississauga, ON
- Full-time
The Application Development AI Developer is an intermediate level position responsible for participation in the establishment and implementation of new or revised application systems and…
Added 4 days ago
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Manager, DevSecOps
BCI
Victoria, BC · CA Victoria
- Full-time
BCI is working with an external recruitment firm. Please do not submit your application directly to BCI. Applications submitted through this site will not be reviewed.
Added 4 days ago
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Senior Electrical Engineer
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- Full-time
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Added 4 days ago
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Financial Analyst
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Vancouver, BC
- Full-time
Prepare and coordinate financing applications for loans.
Added 4 days ago
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Vice President, Philanthropy
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Canada
- Full-time
Reporting to President & CEO Mitzie Hunter, and as an integral member of the senior leadership team (SLT), the Vice President, Philanthropy is responsible for the strategic direction,…
Added 4 days ago
TG
Senior Manager, Applications and Engineering
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Toronto, ON
- Full-time
The Senior Manager, Applications and Engineering oversees the end-to-end technical operations, support, and development for core Transfer Agency record-keeping and processing platforms.…
Added 4 days ago
Senior Customer Associate - West Springs Branch, AB (30 hours/week) Contract- September, 2027
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Our Senior Customer Experience Associates are the face, character and heart of our branches. Scotiabank is a place where we put our customers first, and our priority is to help them achieve…
Added 4 days ago
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Added 4 days ago
Senior Project Engineer Linear Infrastructure
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Calgary, AB · Toronto, ON
Mott MacDonald is currently seeking a Senior Project Engineer Linear Infrastructure, based out of our Toronto or Calgary office.
Added 4 days ago
Software Engineer, Backend
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Toronto, ON
…motivated Machine Learning and Software Engineers, learning from senior engineers while shipping production code that impacts systems across the entire…
Added 4 days ago
RT
Conseiller(ère) principal(e), Développement des cadres / Principal Adviser, Executive Development
Rio Tinto
Montreal, QC
- Full-time
Added 4 days ago
RA
Senior Business Analyst – Financial Services / Platform Transformation
Recrute Action
Toronto, ON · Waterloo, Toronto, Ontario
- Contract
…personalized approach. As part of the screening process, some applications may be reviewed using artificial intelligence tools. Only candidates who meet the hiring criteria will be…

AMD

Advanced Substrate Design & Process Integration

Markham, ON, Canada

$180,000 to $270,000 CAD / year · Full-time

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Job details

Pay: $180,000 to $270,000 CAD / year
Job type: Full-time
Apply by: Dec 3, 2026
Posting language: English
Posted: Nov 3, 2026

Original job description

ADVANCE YOUR CAREER. ADVANCE THE WORLD.

At AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future.

Whether you’re designing next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger - technology that moves the world forward. Join us and, together, we’ll advance your career.

THE ROLE

Lead the development of next-generation substrate architecture, design rules, and technology platforms that enable AMD's future packaging solutions. This role focuses on substrate design enablement, process integration, design-for-manufacturability (DFM), design-for-yield (DFY), reliability, and electrical performance optimization. This role is for a seasoned engineer to define substrate technology requirements and design methodologies that bridge product needs with manufacturing capabilities. You will work closely with package architects, substrate designers, silicon teams, and manufacturing partners to co-optimize substrate solutions for performance, yield, reliability, and cost.

THE PERSON

The ideal candidate is a technical leader with deep expertise in substrate design architecture, process integration, substrate manufacturing technologies, and package-system co-design. They have developed substrate design rules and technology platforms used in advanced semiconductor products. They understand the tradeoffs between electrical performance, mechanical reliability, manufacturability, and cost, and are skilled at translating product requirements into scalable substrate technologies.

Key Responsibilities

Substrate Architecture & Design Rule Development

Define substrate technology requirements and design roadmaps for future AMD products.
Develop substrate design rules, stack-up methodologies, routing architectures, and technology guidelines.
Establish scalable design infrastructures supporting future substrate technology nodes.
Drive substrate architecture development across line/space scaling, via technologies, and advanced package integration.

Process Integration

Lead design-process co-optimization activities across substrate manufacturing technologies.
Define process-aware design methodologies that improve manufacturability and reduce development risk.
Collaborate with suppliers to establish process windows, design limitations, and technology capabilities.
Drive technology readiness assessments for emerging substrate platforms.

Design for Yield (DFY)

Develop design methodologies that maximize manufacturing yield and process robustness.
Identify systematic design sensitivities impacting supplier yield and manufacturing cost.
Define design guidelines and best practices that improve technology scalability.
Drive design-related yield learning and continuous improvement initiatives.

Reliability Engineering

Lead substrate reliability strategy and design rule development for mechanical and electrical robustness.
Develop reliability-aware design guidelines for advanced package applications.
Partner with reliability teams to understand failure mechanisms and translate learning into improved design requirements.
Drive technology qualification and design robustness assessments.

Performance Optimization

Drive substrate architecture solutions for signal integrity, power integrity, and high-speed package performance.
Collaborate with package and silicon architects to optimize electrical performance across the package system.
Develop technology solutions supporting future AI, HPC, and heterogeneous integration products.
Balance performance requirements with manufacturability, reliability, and cost objectives.

Supplier Technology Leadership

Influence substrate supplier technology roadmaps and capability development.
Evaluate emerging substrate technologies and manufacturing innovations.
Establish design requirements and technical targets for development partners.
Build strategic technology partnerships across the substrate ecosystem.

PREFERRED EXPERIENCE

Experience in advanced packaging, substrate design, or package technology development.
Deep expertise in substrate stack-up architecture, routing technologies, HDI design, and advanced package substrates.
Extensive experience developing substrate design rules for manufacturing and reliability.
Strong understanding of signal integrity, power integrity, and package electrical performance.
Experience with design-for-manufacturability, design-for-yield, and design-process co-optimization.
Strong understanding of substrate manufacturing processes and process integration principles.
Experience supporting advanced package architectures including chiplet, 2.5D, and heterogeneous integration solutions.
Proven ability to influence technical direction across multiple organizations and suppliers.
Demonstrated success presenting strategy and technical roadmaps to senior leadership.

This role is not eligible for visa sponsorship

Benefits offered are described: AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.

This posting is for an existing vacancy.

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More about this job

Responsibilities

Lead substrate architecture, design-rule development, and process integration for future packaging technologies, including design-for-manufacturability, yield, reliability, and electrical performance. Collaborate with internal engineering teams and suppliers to develop scalable substrate platforms and roadmaps for advanced AI, HPC, chiplet, and heterogeneous integration products.

Requirements

The role calls for deep experience in advanced packaging, substrate architecture and manufacturing, design-rule development, process integration, and package electrical performance. Candidates should have experience with HDI, advanced package architectures, yield and reliability methods, supplier collaboration, and influencing technical strategy across organizations.

Skills

Substrate Architecture
Substrate Design Rules
Process Integration
Design For Manufacturability
Design For Yield
Substrate Manufacturing
Package-System Co-Design
Stack-Up Architecture
Routing Technologies
High-Density Interconnect Design
Signal Integrity
Power Integrity
Reliability Engineering
Advanced Packaging
Supplier Technology Leadership

Visa sponsorship

Not detected in the job text

Keywords

Advanced Packaging
Substrate Architecture
Substrate Design Rules
Process Integration
Design For Manufacturability
Design For Yield
Substrate Stack-Up
Routing Architecture
Line/Space Scaling
Via Technologies
High-Density Interconnect
Signal Integrity
Power Integrity
Package Electrical Performance
Reliability Engineering
Technology Qualification
Manufacturing Yield
Process Windows
Supplier Technology Roadmaps
Chiplets
2.5D Integration
Heterogeneous Integration
AI
High-Performance Computing
Package-System Co-Design
Technology Readiness Assessment
Manufacturing Cost
Design Robustness

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