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Added 11 mins ago
HT
Manufacturing Engineer (Contract)
Husky Technologies
Bolton, ON
- Full-time
Husky TechnologiesTM offers a wealth of opportunity for personal growth and development. Most importantly, Husky Technologies TM offers an opportunity to work with – and be challenged by –…
Added 11 mins ago
HT
PD Software for Service
Husky Technologies
Bolton, ON
- Full-time
The Service team is a unique team in Development engineering responsible for enhancing the reliability and performance of Husky’s products by resolving systemic service issues. The team is…
Added 11 mins ago
L
AI/ML Engineer
lululemon
Vancouver, BC
- Full-time
As an AI/ML Engineer, you will contribute to the design and implementation of AI/ML systems across the full model lifecycle from dataset curation, feature engineering, and model training…
Added 56 mins ago
SA
Electrical Engineer
Smarter Alloys
Cambridge, ON
- Full-time
Experience in a fast-paced R&D or product development environment
Added 1 hour ago
I
Process/Project Engineer
Innophos
Port Maitland, ON
- $90,000 to $105,000 CAD / year
- Full-time
The Process/Project Engineer is primarily responsible for project development, estimation, planning, and execution. In addition, they are responsible for conducting engineering studies…
Added 1 hour ago
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Continuous Improvement Engineer
Wonderbrands
Toronto, ON · Greater Toronto Area, ON
- Other
Reporting to the Continuous Improvement Leader, the Continuous Improvement Engineer will work on continuous improvement projects related to continually reducing costs and increasing overall…
Added 1 hour ago
Senior Project Engineer - Engineering
Give and Go Prepared Foods
Toronto, ON
…needed to support a wide range of projects across the areas of Product Development, Continuous Improvement and Asset…
Added 2 hours ago
AH
Device Design Engineer
Avalon Holographics
AB · Edmonton, AB
- Full-time
As we advance our display technology, we’re seeking a Device Design Engineer to help design and optimize the thin-film transistor (TFT) pixel and panel architectures at the core of our…
Added 2 hours ago
GA
Solutions Engineer Intern
Geekplus America Inc
Markham, ON
- Internship
…internship, the focus will be on data analysis, CAD layout development, solution modifications, and developing practical AI-enabled tools. As the intern gains experience, we expect them to…
Added 3 hours ago
AM
Civil Project Engineer
Aplin Martin
Nanaimo, BC
- Full-time
The Project Engineer primarily serves as the Engineer-of-Record on projects they are assigned. On some projects they may perform a role of project leader and on others work more…
Added 4 hours ago
QL
Building Code Consultant
QAI Laboratories
Burnaby, BC
- Full-time
Review building codes to identify building product requirements, write test plans, evaluate construction products to code requirements, and write concise evaluation reports.
Added 4 hours ago
TT
Software Architect
trane technologies
Montreal, QC
- Full-time
…driving analytics for greater efficiency, your ideas will help engineer solutions for stronger communities and a sustainable…
Added 4 hours ago
A
Software Engineer (React & TypeScript)
Applicantz
Toronto, ON
- $50 to $55 CAD / hour
- Contract
This role is in the Platform Organization within the Product Design and Manufacturing Solutions (PDMS) division. We are looking for an experienced Software Engineer to join one of our teams…
Added 5 hours ago
S
AI Engineer (Superhuman Mail) - Canada
Superhuman
Remote, Canada
- $128,000 to $210,000 CAD / year
- Full-time
- Remote
…tools people work in, to the personalization that makes the product feel like it knows…
Added 5 hours ago
E
Ingénieur de projet – Développement de produits pour véhicules connectés (Gestion technique de projets) / Project Engineer – Connected Vehicle Product Development (Technical Project Management)
Expleo
Valcourt, QC
- Contract
…www.expleogroup.com._________________________________________________________________________________________________________________________________________________________________________…
Added 5 hours ago
G
Service Sales Engineer
GRUNDFOS
Oakville, ON
- Full-time
As our new Service Sales Engineer in Oakville, ON, you'll be providing technical and commercial aftermarket support to customers - preparing quotations, coordinating service projects, and…
Added 5 hours ago
B
Senior Software Developer
Botpress
Montreal, QC
- Full-time
5+ years of experience as a Software Engineer, ideally in a fast-paced product environment
Added 5 hours ago
Engineer, Test Equipment
Redlen Technologies Inc.
Saanichton, BC
Redlen is seeking a hands-on Engineer, Test Equipment to support the testing and validation of advanced photon-counting X-ray detector products in a high-volume manufacturing environment.…
Added 5 hours ago
SE
Senior Power System Engineer
Schneider Electric
Quebec, QC · UNAVAILABLE, Ontario · Dollard, Quebec
- Full-time
The Power Systems Engineer executes electrical power system network analysis, site reliability and safety audits, performs electrical engineering design and provides solution-based…
Added 5 hours ago
S
Test R&D Engineer, Co-Op
Stryker
Burnaby, BC
- Full-time
The Test R&D Engineer, Co-op will work with the Opto-mechanical Test R&D team to ensure we develop high quality products within Stryker Endoscopy’s product portfolio. Test R&D engineers…
Added 5 hours ago
P
Senior Software Engineer - Java/React
PointClickCare
Mississauga, ON
- Full-time
…significant percentage of our revenue back into research and development, ensuring our employees have the resources to innovate and make a lasting impact. Recognized by Forbes as a top…
Added 5 hours ago
P
Principal Software Engineer
PointClickCare
Mississauga, ON
- Full-time
…significant percentage of our revenue back into research and development, ensuring our employees have the resources to innovate and make a lasting impact. Recognized by Forbes as a top…
Added 6 hours ago
RE
Software Engineer - Marketing
RedBranch Executive Search & Recruitment
Toronto, ON
- $100,000 to $140,000 CAD / year
- Full-time
Our client is an exciting AI technology startup and they are searching for a Software Engineer with strong marketing knowledge. This position will own the system architecture and technical…
Added 6 hours ago
A
Senior Software Developer, Frontend
Autodesk
Toronto, ON
- Full-time
We’re looking for an experienced Senior Frontend Engineer with strong expertise across all aspects of frontend development to join the Autodesk Assistant engineering platform team. Autodesk…
Added 6 hours ago
HT
PD Software for Service
Husky Technologies
Bolton, ON
- Full-time
The Service team is a unique team in Development engineering responsible for enhancing the reliability and performance of Husky’s products by resolving systemic service issues. The team is…

AMD

Advanced Substrate Design & Process Integration

Markham, ON, Canada

$180,000 to $270,000 USD / year · Full-time

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Job details

Pay: $180,000 to $270,000 USD / year
Job type: Full-time
Apply by: Dec 3, 2026
Posting language: English
Posted: Nov 3, 2026

Original job description

ADVANCE YOUR CAREER. ADVANCE THE WORLD.

At AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future.

Whether you’re designing next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger - technology that moves the world forward. Join us and, together, we’ll advance your career.

THE ROLE

Lead the development of next-generation substrate architecture, design rules, and technology platforms that enable AMD's future packaging solutions. This role focuses on substrate design enablement, process integration, design-for-manufacturability (DFM), design-for-yield (DFY), reliability, and electrical performance optimization. This role is for a seasoned engineer to define substrate technology requirements and design methodologies that bridge product needs with manufacturing capabilities. You will work closely with package architects, substrate designers, silicon teams, and manufacturing partners to co-optimize substrate solutions for performance, yield, reliability, and cost.

THE PERSON

The ideal candidate is a technical leader with deep expertise in substrate design architecture, process integration, substrate manufacturing technologies, and package-system co-design. They have developed substrate design rules and technology platforms used in advanced semiconductor products. They understand the tradeoffs between electrical performance, mechanical reliability, manufacturability, and cost, and are skilled at translating product requirements into scalable substrate technologies.

Key Responsibilities

Substrate Architecture & Design Rule Development

Define substrate technology requirements and design roadmaps for future AMD products.
Develop substrate design rules, stack-up methodologies, routing architectures, and technology guidelines.
Establish scalable design infrastructures supporting future substrate technology nodes.
Drive substrate architecture development across line/space scaling, via technologies, and advanced package integration.

Process Integration

Lead design-process co-optimization activities across substrate manufacturing technologies.
Define process-aware design methodologies that improve manufacturability and reduce development risk.
Collaborate with suppliers to establish process windows, design limitations, and technology capabilities.
Drive technology readiness assessments for emerging substrate platforms.

Design for Yield (DFY)

Develop design methodologies that maximize manufacturing yield and process robustness.
Identify systematic design sensitivities impacting supplier yield and manufacturing cost.
Define design guidelines and best practices that improve technology scalability.
Drive design-related yield learning and continuous improvement initiatives.

Reliability Engineering

Lead substrate reliability strategy and design rule development for mechanical and electrical robustness.
Develop reliability-aware design guidelines for advanced package applications.
Partner with reliability teams to understand failure mechanisms and translate learning into improved design requirements.
Drive technology qualification and design robustness assessments.

Performance Optimization

Drive substrate architecture solutions for signal integrity, power integrity, and high-speed package performance.
Collaborate with package and silicon architects to optimize electrical performance across the package system.
Develop technology solutions supporting future AI, HPC, and heterogeneous integration products.
Balance performance requirements with manufacturability, reliability, and cost objectives.

Supplier Technology Leadership

Influence substrate supplier technology roadmaps and capability development.
Evaluate emerging substrate technologies and manufacturing innovations.
Establish design requirements and technical targets for development partners.
Build strategic technology partnerships across the substrate ecosystem.

PREFERRED EXPERIENCE

Experience in advanced packaging, substrate design, or package technology development.
Deep expertise in substrate stack-up architecture, routing technologies, HDI design, and advanced package substrates.
Extensive experience developing substrate design rules for manufacturing and reliability.
Strong understanding of signal integrity, power integrity, and package electrical performance.
Experience with design-for-manufacturability, design-for-yield, and design-process co-optimization.
Strong understanding of substrate manufacturing processes and process integration principles.
Experience supporting advanced package architectures including chiplet, 2.5D, and heterogeneous integration solutions.
Proven ability to influence technical direction across multiple organizations and suppliers.
Demonstrated success presenting strategy and technical roadmaps to senior leadership.

This role is not eligible for visa sponsorship

Benefits offered are described: AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.

This posting is for an existing vacancy.

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More about this job

Responsibilities

Lead substrate architecture, design-rule development, and process integration for future packaging technologies, including design-for-manufacturability, yield, reliability, and electrical performance. Collaborate with internal engineering teams and suppliers to develop scalable substrate platforms and roadmaps for advanced AI, HPC, chiplet, and heterogeneous integration products.

Requirements

The role calls for deep experience in advanced packaging, substrate architecture and manufacturing, design-rule development, process integration, and package electrical performance. Candidates should have experience with HDI, advanced package architectures, yield and reliability methods, supplier collaboration, and influencing technical strategy across organizations.

Skills

Substrate Architecture
Substrate Design Rules
Process Integration
Design For Manufacturability
Design For Yield
Substrate Manufacturing
Package-System Co-Design
Stack-Up Architecture
Routing Technologies
High-Density Interconnect Design
Signal Integrity
Power Integrity
Reliability Engineering
Advanced Packaging
Supplier Technology Leadership

Visa sponsorship

Not detected in the job text

Keywords

Advanced Packaging
Substrate Architecture
Substrate Design Rules
Process Integration
Design For Manufacturability
Design For Yield
Substrate Stack-Up
Routing Architecture
Line/Space Scaling
Via Technologies
High-Density Interconnect
Signal Integrity
Power Integrity
Package Electrical Performance
Reliability Engineering
Technology Qualification
Manufacturing Yield
Process Windows
Supplier Technology Roadmaps
Chiplets
2.5D Integration
Heterogeneous Integration
AI
High-Performance Computing
Package-System Co-Design
Technology Readiness Assessment
Manufacturing Cost
Design Robustness

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