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Physical Design PnR Tile Lead

  • Markham, ON, Canada

$155,200 to $232,800 CAD / year · Full-time

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Job details

Pay
$155,200 to $232,800 CAD / year
Job type
Full-time
Posting language
English
Posted

Original job description

ADVANCE YOUR CAREER. ADVANCE THE WORLD.

At AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future.

Whether you’re designing next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger - technology that moves the world forward. Join us and, together, we’ll advance your career.

THE ROLE

AMD is seeking an experienced Tile Place & Route (PnR) Lead to lead the physical implementation and execution of complex SoC designs at advanced process nodes. This role combines deep technical expertise in physical design with leadership responsibilities across multiple programs, engineers, and cross-functional teams.

As a Tile PnR Lead, you will be responsible for driving implementation strategy, execution planning, design quality, schedule adherence, and technical mentorship. You will work closely with Architecture, RTL Design, Timing, CAD, Methodology, Physical Verification, and Full Chip teams to deliver world-class products.

THE PERSON

The ideal candidate is a recognized technical leader with a proven track record of delivering high-quality silicon across multiple successful tape-outs. You are equally comfortable solving challenging technical problems, mentoring engineers, driving execution across global teams, and influencing methodology direction.

You possess strong communication skills and can effectively engage customers, project leadership, methodology teams, and senior management while maintaining focus on execution excellence.

Key Responsibilities

Technical Leadership

  • Lead physical implementation of complex SoC tiles from floorplan through tapeout.
  • Drive overall Tile PnR strategy including floorplanning, placement, CTS, routing, timing closure, congestion management, IR/EM closure, and signoff readiness.
  • Define implementation methodologies and best practices to improve PPA, scalability, and design quality.
  • Drive technical decisions impacting schedule, product quality, and silicon success.
  • Lead root-cause analysis and resolution of complex implementation challenges.


Program Execution

  • Own execution planning, milestones, risk management, and quality metrics for critical IPs and SoC tiles.
  • Coordinate activities across Design, Timing, CAD, Methodology, Full Chip Floorplan, Power, and Verification teams.
  • Drive closure on schedule-critical and tapeout-critical issues.
  • Provide regular status updates to technical and management leadership.


Team Leadership & Mentorship

  • Mentor and develop Tile PnR engineers across multiple experience levels.
  • Conduct technical reviews and provide implementation guidance.
  • Lead training and knowledge-sharing initiatives across the organization.


Innovation

  • Drive adoption of new implementation methodologies, automation, and AI-enabled design solutions.
  • Influence future physical design flows and tool direction.
  • Partner with CAD teams to improve productivity, scalability, and design predictability.


Preferred Qualifications

  • BS/MS in Electrical Engineering, Computer Engineering, or related field.
  • Industry experience in physical design.
  • Demonstrated technical leadership across multiple projects or product families.
  • Multiple successful tape-outs at advanced technology nodes.
  • Proven experience leading critical tiles or IPs.
  • Recognized expert in Tile PnR and physical implementation.
  • Experience leading globally distributed engineering teams.
  • Expertise in congestion analysis, timing architecture, power optimization, and PPA improvement.
  • Experience with AI-assisted implementation methodologies.
  • Familiarity with ICC2, Fusion Compiler, PrimeTime, RedHawk/Totem, Calibre, and related implementation flows.


Location

  • Markham, ON


Benefits offered are described: AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.

This posting is for an existing vacancy.

More about this job

Responsibilities

Lead the physical implementation of complex SoC tiles from floorplan through tapeout, driving strategy for PnR, timing closure, and design quality. Coordinate across cross-functional teams and mentor engineers to ensure schedule adherence and silicon success.

Requirements

Requires a BS/MS in Electrical or Computer Engineering with extensive industry experience in physical design and a proven track record of multiple successful tape-outs at advanced nodes. Must possess strong technical leadership skills and expertise in tools like ICC2, Fusion Compiler, and PrimeTime.

Skills

  • Physical Design
  • Place & Route (PnR)
  • Floorplanning
  • Clock Tree Synthesis (CTS)
  • Timing Closure
  • Congestion Management
  • IR/EM Closure
  • PPA Optimization
  • Technical Leadership
  • Project Management
  • Mentorship
  • SoC Design
  • Physical Verification
  • AI-assisted Implementation
  • Signoff Readiness
  • Root-cause Analysis

Visa sponsorship

Not detected in the job text

Categories

  • Engineering
  • Technology
  • Manufacturing
  • Management & Leadership
  • Science & Research

Keywords

  • Physical Design
  • PnR
  • SoC
  • Advanced Process Nodes
  • Floorplanning
  • CTS
  • Timing Closure
  • IR/EM Closure
  • PPA
  • ICC2
  • Fusion Compiler
  • PrimeTime
  • RedHawk
  • Totem
  • Calibre
  • Tape-out
  • Semiconductor
  • AI-enabled Design
  • Physical Verification
  • Congestion Analysis
  • Timing Architecture
  • Power Optimization
  • Electrical Engineering
  • Computer Engineering
  • Implementation Methodology
  • Silicon Success
  • Technical Mentorship
  • Global Team Leadership
  • CAD
  • RTL Design

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