Staff AI Systems Thermal Engineer
- Ottawa, ON, Canada
Full-time
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Job details
- Job type
- Full-time
- Apply by
- Experience
- Experience: Bachelors plus 8+ years of experience or Masters plus 6+ years of experience.
- Posting language
- English
- Posted
Original job description
Job Description:
We are looking for an experienced AI Systems Thermal Engineer to lead the end-to-end thermal design, simulation, optimization, and physical validation of Direct-to-Chip (D2C) liquid cooling solutions for next-generation AI accelerators and high-density compute platforms.
In this role, you will own the thermal-hydraulic performance of custom cold plates, interface materials, and fluid delivery subsystems - ensuring our high-power ASICs operate within safe thermal limits at peak workloads. You will collaborate closely with silicon package designers, board layout teams, mechanical housing engineers, and manufacturing partners from concept through mass production.
Key Responsibilities:
The annual base salary range for this position is USD To USD
As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.
Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, RRSP participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company-paid holidays; and paid sick leave and vacation time. The company follows all applicable laws for leaves of absence.
R027822
We are looking for an experienced AI Systems Thermal Engineer to lead the end-to-end thermal design, simulation, optimization, and physical validation of Direct-to-Chip (D2C) liquid cooling solutions for next-generation AI accelerators and high-density compute platforms.
In this role, you will own the thermal-hydraulic performance of custom cold plates, interface materials, and fluid delivery subsystems - ensuring our high-power ASICs operate within safe thermal limits at peak workloads. You will collaborate closely with silicon package designers, board layout teams, mechanical housing engineers, and manufacturing partners from concept through mass production.
Key Responsibilities:
- Thermal & CFD Modeling: Build and run detailed Computational Fluid Dynamics (CFD) and thermal-resistance network models to evaluate temperature distribution, pressure drop, and flow balancing across cold plates, trays, and racks.
- Advanced Technology Implementation: Research advanced cooling technologies and develop integration and test plans to validate these technologies and convert them into production solutions.
- Cold Plate Design & Optimization: Co-design high-performance liquid cold plates with strategic industry partners to cool high-heat-flux AI processors.
- Thermal Interface Materials (TIM): Specify, select, and qualify thermal interface materials for large, high warpage, devices to minimize contact resistance between silicon dies and cold plates on large devices
- System & Hydraulic Integration: Design coolant flow paths, quick-disconnects (QDs), hoses, and cold-plate retention/loading mechanisms in alignment with server chassis and OCP (Open Compute Project) standards.
- Lab Validation & Testing: Plan and execute physical thermal testing in the lab - including thermocouple instrumentation, pressure/flow mapping, thermal test vehicle (TTV) bring-up, and simulation-to-test correlation.
- Cross-Functional Collaboration: Partner with mechanical, electrical, firmware (thermal control algorithms), and supply chain teams to drive PCBA, tray and system level designs from NPI (New Product Introduction) to high-volume manufacturing.
- Education: Bachelor’s or Master’s degree in Mechanical or Thermal Engineering (M.S. preferred), or equivalent.
- Experience: Bachelors plus 8+ years of experience or Masters plus 6+ years of experience. Hands-on experience in thermal/mechanical design for high-power electronics, AI hardware, servers, or HPC systems.
- Proven, direct experience designing and deploying Direct Liquid Cooling (DLC) systems, specifically liquid cold plates, coolant distribution units (CDUs), and manifold loops.
- Electronics Cooling: Deep understanding of single-phase and/or two-phase heat transfer, fluid dynamics, pressure drop calculations, and electronics packaging interactions. Experience with air cooled systems also an asset.
- Simulation Tools: High proficiency in CFD and thermal analysis software (preferably Flotherm, FloEFD, and MacroFlow.).
- Lab Instrumentation: Experience with thermal data acquisition systems, flow meters, pressure transducers, and lab automation (Python, MATLAB, or LabVIEW).
- CAD & Mechanical Design: Experience with electronics packaging and CAD platforms, preferably CREO, an asset.
The annual base salary range for this position is USD To USD
As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.
Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, RRSP participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company-paid holidays; and paid sick leave and vacation time. The company follows all applicable laws for leaves of absence.
R027822
More about this job
Responsibilities
Lead thermal design, simulation, optimization, and physical validation of direct-to-chip liquid cooling systems for AI accelerators and high-density compute platforms. Develop cold plates and coolant delivery subsystems, validate performance through laboratory testing, and collaborate across engineering and manufacturing teams from concept through mass production.
Requirements
Requires a bachelor's degree or master's degree in mechanical or thermal engineering, or equivalent, with at least 8 years of experience for bachelor's graduates or 6 years for master's graduates. Candidates should have hands-on experience with high-power electronics or AI/server hardware, direct liquid cooling systems, CFD and thermal analysis tools, laboratory instrumentation, and mechanical CAD.
Skills
- Thermal Engineering
- Computational Fluid Dynamics
- Thermal Modeling
- Direct Liquid Cooling
- Cold Plate Design
- Thermal Interface Materials
- Fluid Dynamics
- Pressure Drop Analysis
- Thermal Testing
- Lab Instrumentation
- Thermal Data Acquisition
- Flow and Pressure Mapping
- Simulation-to-Test Correlation
- Electronics Cooling
- CAD
- Python
Benefits
- Medical Insurance
- Dental Insurance
- Vision Insurance
- RRSP With Company Matching
- Employee Stock Purchase Program
- Employee Assistance Program
- Company-Paid Holidays
- Paid Sick Leave
- Paid Vacation
- Discretionary Annual Bonus
- Equity Awards
Visa sponsorship
Not detected in the job text
Categories
- Engineering
- Technology
- Manufacturing
Keywords
- Direct-to-Chip Cooling
- Direct Liquid Cooling
- Computational Fluid Dynamics
- Thermal-Resistance Networks
- Cold Plates
- Thermal Interface Materials
- Coolant Distribution Units
- Manifold Loops
- Single-Phase Heat Transfer
- Two-Phase Heat Transfer
- Pressure Drop
- Flow Balancing
- Flotherm
- FloEFD
- MacroFlow
- Thermal Data Acquisition
- Flow Meters
- Pressure Transducers
- Python
- MATLAB
- LabVIEW
- CREO
- Open Compute Project
- AI Accelerators
- High-Performance Computing
- Thermal Test Vehicles
- New Product Introduction
- High-Volume Manufacturing
- Quick-Disconnects
- Electronics Packaging