Senior Mechanical Design Engineer
- Ottawa, ON, Canada
Pay Range: $88,700 - $141,700. · Full-time
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Job details
- Pay
- Pay Range: $88,700 - $141,700.
- Job type
- Full-time
- Education
- Bachelor’s degree
- Experience
- Experience: 10+ years of mechanical engineering design experience in telecom, datacom or electro-optics
- Posting language
- English
- Posted
Original job description
As the global leader in high-speed connectivity, Ciena is committed to a people-first approach. Our teams enjoy a culture focused on prioritizing a flexible work environment that empowers individual growth, well-being, and belonging. We’re a technology company that leads with our humanity - driving our business priorities alongside meaningful social, community, and societal impact.
This Senior Mechanical Engineer contributes to the development of high-performance, physical design solutions for leading edge circuit packs and optical plugs on various Ciena platforms. The platform portfolio consists of 6500-S/D, 6500-PTS, 6500-R, 6500-T, 5400, 8700, Z-series, and Waveserver.
How you will make an impact:
Develop mechanical designs for leading edge circuit packs and optical plugs incorporating advanced technologies with high-density and thermal constraints
Create mechanical part and assembly designs, engineering documentation, and maintain design databases
Collaborate with systems, hardware, operations, and product line management to deliver products aligned to project timelines and processes
Build cross-functional relationships through technical communication and delivery of quality engineering outputs by considering all requirements
Present technical design reviews to ensure designs are aligned with project requirements, architecture, timelines, and risk identification needs
Apply DFMA methodologies to improve manufacturability and assembly in partnership with operations and manufacturing
Evaluate prototypes and first samples, including development of First Piece Evaluation reports
Address sustaining needs for newly released and mature circuit packs and optical plugs to address customer and/or manufacturing issues and design improvements
Work with electrical hardware teams and operations to support mechanical platform cost reduction activities
Work with customer response teams to assess field issues (as needed) and with supplier for root cause analysis of failed or poor-quality components.
The must haves:
Education: Bachelor’s degree in Mechanical Engineering required
Experience: 10+ years of mechanical engineering design experience in telecom, datacom or electro-optics
Utilization of CAD software, preferably Creo Parametric
Demonstrated analytical problem solving using structured and methodical approaches
Project management skills applied to engineering development activities
Background in design of plastic components including injection moulding and metal components including sheet metal, machined, and die cast
Application of mechanical and hardware development processes and experience managing design databases
Demonstrated commitment to product and process improvement
Application of interpersonal and communication skills to collaborate across engineering disciplines
Attention to detail in engineering design and documentation
Nice to haves:
Master’s degree in Mechanical Engineering
Pay Range: $88,700 - $141,700.
Pay ranges at Ciena are designed to accommodate variations in knowledge, skills, experience, market conditions, and locations, reflecting our diverse products, industries, and lines of business. Please note that the pay range information provided in this posting pertains specifically to the primary location, which is the top location listed in case multiple locations are available.
Non-Sales employees may be eligible for a discretionary incentive bonus, while Sales employees may be eligible for a sales commission. In addition to competitive compensation, Ciena offers a comprehensive benefits package, including medical, dental, and vision plans, participation in 401(K) (USA) & DCPP (Canada) with company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company-paid holidays, paid sick leave, and vacation time. We also comply with all applicable laws regarding Paid Family Leave and other leaves of absence.
At Ciena, we are committed to building and fostering an environment in which our employees feel respected, valued, and heard. Ciena values the diversity of its workforce and respects its employees as individuals. We do not tolerate any form of discrimination.
Ciena is an Equal Opportunity Employer, including disability and protected veteran status.
If contacted in relation to a job opportunity, please advise Ciena of any accommodation measures you may require.
More about this job
Responsibilities
Develop high-performance mechanical designs for circuit packs and optical plugs while managing thermal and density constraints. Collaborate with cross-functional teams to deliver quality engineering documentation and support product improvements through DFMA and prototype evaluation.
Requirements
Requires a Bachelor's degree in Mechanical Engineering and over 10 years of design experience in telecom, datacom, or electro-optics. Proficiency in Creo Parametric and expertise in plastic and metal component design are essential.
Skills
- Mechanical Design
- Creo Parametric
- DFMA
- Injection Moulding
- Sheet Metal Design
- Die Casting
- Thermal Management
- Project Management
- Analytical Problem Solving
- Technical Communication
- CAD Software
- Prototype Evaluation
Benefits
- Medical plans
- Dental plans
- Vision plans
- 401(K) (USA) with company matching
- DCPP (Canada) with company matching
- Employee Stock Purchase Program (ESPP)
- Employee Assistance Program (EAP)
- Company-paid holidays
- Paid sick leave
- Vacation time
- Paid Family Leave
Visa sponsorship
Not detected in the job text
Categories
- Engineering
- Manufacturing
- Technology
Keywords
- Mechanical Engineering
- Telecom
- Datacom
- Electro-optics
- Creo Parametric
- DFMA
- Injection Moulding
- Sheet Metal
- Die Cast
- Circuit Packs
- Optical Plugs
- Thermal Constraints
- High-density Design
- CAD
- First Piece Evaluation
- Root Cause Analysis
- Product Lifecycle Management
- Hardware Development