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EXFO

Architecte matériel senior

Greater Montreal Metropolitan Area, QC, Canada

Full-time

Apply About employer

Applications open in a new tab.

Job details

Job type: Full-time
Apply by: Dec 3, 2026
Posting language: English · French
Posted: Nov 3, 2026

Original job description

English section of this bilingual listing.

EXFO is a global leader in intelligent test, monitoring, and analytics solutions for the telecommunications industry. Our technologies support the world's leading communication service providers, network equipment manufacturers, and cloud service providers.

With more than 2,000 employees across 25 countries, EXFO is the global leader in fiber optic testing and the world's largest provider of active service assurance solutions. Our hardware and software solutions help customers accelerate technology transformations related to fiber optics, 5G, virtualization, the Internet of Things (IoT), and advanced analytics.

Position Summary

Reporting to the Hardware Engineering R&D Group Manager, the Senior Hardware Architect will work within a multidisciplinary, multi-site engineering environment developing next-generation hardware solutions for telecommunications network testing.

As a Senior Hardware Architect, you will provide technical leadership for EXFO's high-speed hardware platforms (106.25 Gbps, 224 Gbps and beyond) and embedded systems. You will evaluate emerging technologies, define hardware architectures, and play a key role in strategic technology decisions.

Key Responsibilities

Design the overall hardware architecture of complex systems while balancing performance, reliability, and scalability.
Analyze emerging technologies and recommend innovative hardware solutions.
Lead hardware proof-of-concept (PoC) initiatives to validate new technologies.
Provide technical leadership in solving major architectural and development challenges.
Monitor technology trends by attending international conferences, trade shows, and collaborating with key technology partners.
Support multidisciplinary R&D teams in making critical technical decisions.
Contribute to the evolution of EXFO's next-generation high-speed hardware platforms.
Perform other related duties as required.

Desired Profile

Bachelor's degree in Electrical Engineering or equivalent.
Minimum of 10 years of experience developing high-speed hardware products.
Strong expertise in complex hardware design including electronics, mechanics, FPGA development, signal processing, and signal integrity.
Strong knowledge of the high-speed technology ecosystem including connectors, DSPs, FPGAs, and optical transceivers.
Expertise with embedded systems using CPU/MCU architectures and LCD interfaces.
Experience designing battery management and power circuits.
Strong understanding of high-speed PCB signal integrity.
Knowledge of IEEE 802.3 electrical standards and OIF CEI-224VSR / CEI-112VSR specifications.
Excellent communication skills with the ability to explain complex technical concepts to support strategic decision-making.
Strong leadership, teamwork, documentation, and organizational skills.
Fluent in both English and French (spoken and written).
Canadian citizenship or permanent residency required.
Willingness to travel internationally several times per year, primarily to the United States.

Why Join EXFO?

Join a global leader in telecommunications technology.
Work on innovative products that shape the future of network technologies.
Collaborative, multidisciplinary, and stimulating work environment.
Flexible hybrid work model.
Excellent opportunities for professional growth and career development.
Comprehensive benefits package.

English is required for this position, as the role involves frequent verbal and written communication with customers, partners, suppliers, and colleagues located outside of Quebec.

EXFO is an equal opportunity employer. We celebrate diversity and are committed to creating an inclusive environment for all employees.

Read the full bilingual original

Titre du poste : Architecte matériel sénior

Lieu : Montréal, QC (mode hybride)

Type de poste : Permanent, temps plein

À propos d'EXFO

EXFO est un chef de file mondial en matière de solutions intelligentes de test, de surveillance et d’analyse de réseaux. Nos technologies soutiennent les plus grands fournisseurs de services de télécommunications, fabricants d’équipements réseau et fournisseurs de services Web à travers le monde.

Présente dans plus de 25 pays et comptant plus de 2 000 employés, EXFO est le leader mondial des tests de fibre optique et possède le plus important déploiement de solutions d’assurance de services actifs. Nos solutions matérielles et logicielles permettent à nos clients d’accélérer les transformations technologiques liées à la fibre optique, à la 5G, à la virtualisation, à l’Internet des objets (IoT) et à l’analytique des données.

Sommaire du rôle

Sous la supervision du Chef de groupe R&D d’ingénierie matérielle, vous évoluerez au sein d’un environnement multisite et multidisciplinaire où vous contribuerez au développement de solutions matérielles de pointe destinées à la validation des réseaux de télécommunications.

À titre d’Architecte matériel Sénior, vous assurerez la vigie technologique et proposerez des solutions innovantes pour nos plateformes haute vitesse (106,25 Gbps, 224 Gbps et plus) ainsi que pour nos systèmes embarqués. Vous jouerez un rôle clé dans les décisions technologiques stratégiques qui orienteront les futurs produits d’EXFO.

Responsabilités principales

Concevoir l’architecture matérielle globale de systèmes complexes en optimisant les performances, la fiabilité et l’évolutivité.
Analyser différentes approches technologiques et recommander les meilleures solutions pour le développement de produits innovants.
Définir, planifier et réaliser des preuves de concept (PoC) afin d’évaluer les nouvelles technologies.
Agir comme expert technique lors de la résolution de problèmes architecturaux majeurs durant le cycle de développement.
Assurer une vigie technologique active en participant à des conférences internationales, salons spécialisés et rencontres avec les principaux partenaires technologiques.
Collaborer étroitement avec les équipes de R&D afin de soutenir les décisions techniques stratégiques.
Contribuer à l’évolution des plateformes matérielles haute vitesse d’EXFO.
Effectuer toute autre tâche connexe au besoin.

Profil recherché

Baccalauréat en génie électrique ou l’équivalent.
Minimum de 10 ans d’expérience en développement de produits matériels haute vitesse.
Solide expertise en conception de matériel complexe (électronique, mécanique, FPGA, traitement et intégrité du signal).
Excellente connaissance de l’écosystème technologique haute vitesse (connecteurs, DSP, FPGA, transceivers optiques).
Expertise des systèmes embarqués utilisant des architectures CPU/MCU et interfaces LCD.
Expérience en conception de circuits de gestion d’alimentation et de batteries.
Très bonne compréhension des enjeux d’intégrité de signal dans les PCB haute densité.
Maîtrise des normes IEEE 802.3 (DJ/CK) ainsi que des standards OIF CEI-224VSR et CEI-112VSR.
Excellente capacité à vulgariser des concepts techniques complexes afin de soutenir la prise de décision.
Leadership, esprit d’équipe, rigueur documentaire et excellente capacité à gérer les priorités.
Bilinguisme (français et anglais), à l’oral et à l’écrit.
Citoyenneté canadienne ou résidence permanente au Canada obligatoire.
Disponibilité pour voyager quelques fois par année, principalement aux États-Unis.

Pourquoi joindre EXFO?

Entreprise technologique innovante et reconnue mondialement.
Travaillez sur des produits de très haute technologie qui façonnent les réseaux de demain.
Environnement collaboratif, multidisciplinaire et stimulant.
Mode de travail hybride.
Excellentes possibilités de développement professionnel et d’évolution de carrière.
Gamme complète d’avantages sociaux.

La connaissance de l’anglais est requise pour ce poste, puisque ses responsabilités impliquent des échanges fréquents, tant à l’oral qu’à l’écrit, avec des clients, partenaires, fournisseurs ou collègues situés à l’extérieur du Québec.

-----------------------------------------------------------------------

Job Title: Senior Hardware Architect

Location: Montreal, QC (Hybrid)

Position Type: Permanent, Full-Time

About EXFO

Position Summary

Key Responsibilities

Design the overall hardware architecture of complex systems while balancing performance, reliability, and scalability.
Analyze emerging technologies and recommend innovative hardware solutions.
Lead hardware proof-of-concept (PoC) initiatives to validate new technologies.
Provide technical leadership in solving major architectural and development challenges.
Monitor technology trends by attending international conferences, trade shows, and collaborating with key technology partners.
Support multidisciplinary R&D teams in making critical technical decisions.
Contribute to the evolution of EXFO's next-generation high-speed hardware platforms.
Perform other related duties as required.

Desired Profile

Bachelor's degree in Electrical Engineering or equivalent.
Minimum of 10 years of experience developing high-speed hardware products.
Strong expertise in complex hardware design including electronics, mechanics, FPGA development, signal processing, and signal integrity.
Strong knowledge of the high-speed technology ecosystem including connectors, DSPs, FPGAs, and optical transceivers.
Expertise with embedded systems using CPU/MCU architectures and LCD interfaces.
Experience designing battery management and power circuits.
Strong understanding of high-speed PCB signal integrity.
Knowledge of IEEE 802.3 electrical standards and OIF CEI-224VSR / CEI-112VSR specifications.
Excellent communication skills with the ability to explain complex technical concepts to support strategic decision-making.
Strong leadership, teamwork, documentation, and organizational skills.
Fluent in both English and French (spoken and written).
Canadian citizenship or permanent residency required.
Willingness to travel internationally several times per year, primarily to the United States.

Why Join EXFO?

Join a global leader in telecommunications technology.
Work on innovative products that shape the future of network technologies.
Collaborative, multidisciplinary, and stimulating work environment.
Flexible hybrid work model.
Excellent opportunities for professional growth and career development.
Comprehensive benefits package.

English is required for this position, as the role involves frequent verbal and written communication with customers, partners, suppliers, and colleagues located outside of Quebec.

EXFO is an equal opportunity employer. We celebrate diversity and are committed to creating an inclusive environment for all employees.

Apply About employer

More about this job

Responsibilities

Design and guide the architecture of complex, high-speed hardware and embedded systems, balancing performance, reliability, and scalability. Evaluate emerging technologies, lead proof-of-concept initiatives, resolve major architectural challenges, and support strategic technical decisions across multidisciplinary R&D teams.

Requirements

Requires a bachelor's degree in electrical engineering or equivalent and at least 10 years of experience developing high-speed hardware products. Candidates should have expertise in complex hardware, embedded systems, signal integrity, power and battery circuits, and relevant IEEE and OIF standards, along with bilingual English and French communication skills; Canadian citizenship or permanent residency is required.

Skills

Hardware Architecture
High-Speed Hardware Design
Electrical Engineering
Electronics Design
Mechanical Design
FPGA Development
Signal Processing
Signal Integrity
Embedded Systems
CPU/MCU Architectures
LCD Interfaces
Power Circuit Design
Battery Management
IEEE 802.3 Standards
OIF CEI-224VSR and CEI-112VSR
Proof-of-Concept Development

Visa sponsorship

Not detected in the job text

Keywords

Telecommunications
Hardware Architecture
High-Speed Hardware
106.25 Gbps
224 Gbps
Embedded Systems
Electrical Engineering
Electronics
Mechanical Design
FPGA
Signal Processing
Signal Integrity
High-Density PCBs
Connectors
DSPs
Optical Transceivers
CPU/MCU Architectures
LCD Interfaces
Battery Management
Power Circuits
IEEE 802.3
OIF CEI-224VSR
OIF CEI-112VSR
Proofs of Concept
Technology Evaluation
Fiber Optics
5G
Internet of Things
Data Analytics

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