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ES
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AB · Calgary, AB
- Full-time
Manage smaller engineering projects along with the technical lead
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Project Manager - PL#72904
Peter Lucas Project Management Inc.
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- $110,000 to $130,000 CAD / year
- Full-time
…projects from initiation through completion, ensuring successful delivery within established scope, schedule, budget, and quality requirements. This role involves leading multidisciplinary…
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Project Manager - PL#72904
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- $110,000 to $130,000 CAD / year
- Full-time
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OCS Design Delivery - Senior Manager
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Conventional Signalling Director
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Service Design Lead
PLATO
Remote, Canada
- $95 to $110 CAD / hour
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Fidus Systems

Signal Integrity and Power Integrity Designer

Canada

Annual base salary ranges from $105,000 to $155,000. · Full-time

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Job details

Pay: Annual base salary ranges from $105,000 to $155,000.
Job type: Full-time
Posting language: English
Posted: Sep 13, 2026

Original job description

Fidus is a global high-tech design firm headquartered in Ottawa, with additional design centres in Kitchener-Waterloo and San Jose. We specialize in leading-edge electronic product development, with hardware, embedded software, FPGA/ASIC, and signal integrity teams working together to design and deliver next-generation products for clients in emerging technology markets.

Position Overview/Mandate:

The Senior Signal Integrity and Power Integrity Specialist plays a critical role in ensuring the performance, reliability, and compliance of high-speed electronic systems designed by Fidus. You will lead and support SI/PI analysis from early architecture through final validation, working closely with hardware designers, PCB layout, FPGA, and system teams to optimize signal quality and power distribution.

This role is ideal for someone who thrives on solving complex high-speed challenges, enjoys working across multiple industries, and takes pride in delivering robust, production-ready designs backed by strong analytical and lab validation skills.

You'll contribute to projects ranging from evaluation boards and reference designs to high-speed backplanes and systems involving DDR memory interfaces and SERDES, engaging from early concept and stack-up definition through simulation, layout guidance, lab validation, and final product release.

Make an Impact with US:

At Fidus, you'll work on high-speed, high-complexity electronic systems, often using emerging technologies before they reach the broader market. You'll collaborate across FPGA/DSP, hardware, embedded software, verification, SI/PI, PCB layout, and mechanical/thermal design as part of cross-functional teams delivering real products for our clients.

In practice, that means contributing to projects across Communications, Aerospace & Defence, Space & Satellite, Industrial Automation, Automotive, Life Sciences & Medical Devices, and Semiconductor engagements. You won't be limited to a single product or industry - your work will follow the technology, not just one roadmap.

What You'll Be Doing:

Lead PCB layer stack-up design and optimization
Perform waveform integrity, crosstalk, timing, eye diagram, and jitter analysis
Conduct power integrity analysis including DC IR drop and decoupling strategy optimization
Model insertion and return loss and support EMC analysis
Use industry tools such as Cadence Sigrity, HSPICE, ADS, HFSS, and Hyperlynx for simulation and analysis
Support and execute lab validation using TDR, vector network analyzers, spectrum analyzers, and high-speed oscilloscopes
Estimate turnkey projects and execute work from concept through development, lab testing, and final product delivery
Collaborate with cross-functional teams including hardware, layout, FPGA, and system engineers to ensure SI/PI best practices are embedded early in the design cycle

Who You are:

MS or PhD in Electrical/Electronics Engineering
Minimum five (5) years of experience designing and analyzing high-speed circuits or RF structures
Strong background in signal integrity, power integrity, electromagnetics, RF, antennas, or EMC
Hands-on experience with high-speed interfaces such as DDR memory and SERDES
Proficiency with SI/PI simulation and analysis tools such as Cadence Sigrity, HSPICE, ADS, HFSS, and Hyperlynx
Solid lab validation experience using tools such as TDR, vector network analyzers, spectrum analyzers, and high-speed oscilloscopes
Strong communication skills with the ability to interact effectively with customers and cross-functional teams
Comfortable adapting to new technologies and working across diverse industries
Committed to disciplined engineering practices and delivering high-quality designs
Embraces AI as part of a modern engineering toolkit

This role is being posted to fill an existing vacancy

Annual base salary ranges from $105,000 to $155,000. The final offer within this range takes into account the variations in knowledge, skills, experience, and market conditions, and with consideration to internal equity.

Our competitive compensation package also includes a comprehensive benefits package, including medical, dental, and vision plans, matching GRSP contributions, annual profit-sharing bonus, along with other supplementary benefits.

We also recognize that candidates show interest throughout different career stages and welcome all applications. When there is a great fit, the level of the role may be shifted as applicable.

About Fidus & Why Work Here

Since 2001, Fidus has completed over 4,000 projects for more than 400 customers across industries including Telecom/Datacom, Aerospace & Defence, Consumer, Semiconductors, Industrial/Automotive Controls, and Medical. As a Premier Adaptive Computing Partner for AMD North America, we combine deep technical expertise with industry-leading tools to solve complex design challenges.

Fidus designs high-speed, high-complexity electronic systems using emerging technologies, often well before they reach the broader market. Our teams work across FPGA/DSP, hardware, embedded software, verification, SI/PI, PCB layout, and mechanical/thermal design to deliver real products for our customers.

At Fidus, collaboration is at the core of how we work. We value openness, trust, and shared ownership, and we create an environment where people are encouraged to contribute ideas, learn from one another, and have a meaningful impact through the work they do.

If all of this excites you, has your attention, and you can't wait to join our amazing team and work environment, then we want to hear from you!

Curious what it's actually like to work here? Take a look at our Working at Fidus page.

Fidus has a commitment to ensure a fair and transparent recruitment process. Automated tools (including AI) support our initial screening of applicants against our job posting to identify candidates whose qualifications, experience, and skills align most closely with the position requirements. All further candidate assessments and final selection are conducted by our human recruitment team. AI does not make any final hiring decisions.

Thank you for your interest in Fidus. We welcome and encourage diverse candidates to apply. Accommodations are available upon request for candidates taking part in all aspects of the selection process. Fidus is committed to creating a diverse environment and is proud to be an equal opportunity employer.

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More about this job

Responsibilities

Lead signal- and power-integrity analysis from architecture through product validation, including PCB stack-up design, simulation, layout guidance, and lab testing. Collaborate with hardware, PCB layout, FPGA, and system teams to optimize high-speed designs and deliver production-ready products.

Requirements

Requires a master's or doctoral degree in Electrical or Electronics Engineering and at least five years of experience designing or analyzing high-speed circuits or RF structures. Candidates should have expertise in SI/PI and related fields, experience with DDR and SERDES interfaces, proficiency with simulation tools, and hands-on lab validation skills.

Skills

Signal Integrity
Power Integrity
PCB Stack-Up Design
High-Speed Circuit Analysis
Waveform Integrity Analysis
Crosstalk Analysis
Timing Analysis
Eye Diagram Analysis
Jitter Analysis
DC IR Drop Analysis
Decoupling Strategy
Electromagnetic Analysis
EMC Analysis
DDR Memory Interfaces
SERDES
Lab Validation

Benefits

Medical Insurance
Dental Insurance
Vision Insurance
Annual Profit-Sharing Bonus
Supplementary Benefits

Visa sponsorship

Not detected in the job text

Keywords

Signal Integrity
Power Integrity
PCB Layer Stack-Up
High-Speed Electronics
DDR Memory
SERDES
Electromagnetics
RF Structures
Antennas
EMC
Cadence Sigrity
HSPICE
ADS
HFSS
HyperLynx
TDR
Vector Network Analyzer
Spectrum Analyzer
High-Speed Oscilloscope
Insertion Loss
Return Loss
Crosstalk
Jitter
Eye Diagram
DC IR Drop
Decoupling
Lab Validation
PCB Layout
FPGA
Hardware Design

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