Microelectronics Process Engineer

Job#80236

Job Purpose
The Microelectronics Process Engineer will manage, develop and implement new processes to be used in our manufacturing environment - embracing advanced RF, optical and microelectronic components, modules and sub-systems.

Nature of Duties / Responsibilities

• Work directly with RF, optical and microelectronic product design and development teams to provide process engineering solutions in support of new product development, with subsequent NPI and manufacturing support.

• Wafer level assembly experience would be an asset for this position.
• Strong project/customer management skills required.
• Supports new technology research and development pertaining to optical and microelectronic process solutions.
• Manages projects and timelines in order to meet milestones and deliverables of various customer projects.
• Application program on high end automated assembly equipment (dispensers, die bonders, wirebonders, optical aligners, etc.).
• Develops processes related to the assembly of Optical and Microelectronic modules, such as:
  • SMT + flip chip assembly (multi chip modules)
  • Flip chip underfill
  • Epoxy dispensing, high accuracy die bonding
  • Semiconductor die and microelectronic components bonding and interconnection (wirebond)
  • Packaging encapsulation
  • Optical active/passive alignment
• Troubleshoots and analyzes process performance problems. Provides technical guidance to less experienced team members.
• Conducts research into complex engineering problems to develop new operating policies, capabilities, and processes.
• Assists the Process Engineering team to deliver on accountabilities. Takes ownership for processes under his/her control.
• Creates process assembly documentation.
• Tooling and fixture design and procurement.
• Performs qualification on new processes being introduced.
• Implements and suggests engineering changes.
• Researches, procures, and accepts new pieces of equipment for continuously evolving technologies.
• Supports customer NPI builds within tight timelines.
• Provides DFx type feedback to the internal design team as well as external customers to help optimize manufacturability of products as well as increase yields and throughput.
  
  
• Education & Experience
• Requires a University degree in Engineering (Mechanical or Photonics preferred).
• 2+ years' experience in a Process or Manufacturing Engineering support role.
• Experience with Optical and Microelectronic technologies and processes.
• Experience with wafer level processing (wafer level packaging, backend wafer processing) would be preferred.
• Experience with AutoCad/SolidWorks.
• Hands-on build experience would be an asset (handling bare dies or miniature components with tweezers, use of microscopes, camera systems, etc.)
• Experience with equipment programming (auto dispensers, pick and place machines, welders, etc.) would be beneficial.
• Exposure to product design and development phases would be beneficial.
• A background in the execution of "best practice" process control is required.
• Experience with lean manufacturing principles.
• Experience with DFM and FMEA would be an asset.
• Experience with Microsoft Office Suite (Word, Excel, PowerPoint).