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Added 6 mins ago
IG
Senior Software Engineer
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- Contract
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Senior Mechanical Engineer (Semiconductor Packaging)
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Ottawa, ON · Kanata, ON
- Full-time
We are looking for a Senior Mechanical Engineer who thrives at the intersection of precision design and robust process development to help us bring our optical subassemblies to the global…
Added 1 hour ago
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Inpho

Senior Mechanical Engineer (Semiconductor Packaging)

Ottawa, ON, Canada
Kanata, ON, Canada

Full-time

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Applications open in a new tab.

Job details

Job type: Full-time
Apply by: Apr 7, 2027
Experience: Experience: 7+ years (with a Bachelor’s degree) or 5+ years (with a Master’s degree) of validated industrial development experience in semiconductor industry.
Posting language: English
Posted: Oct 9, 2026

Original job description

About Inpho

Inpho is a fast-growing startup, focused on developing cutting-edge optoelectronic solutions for next-generation communications, and photonic systems. Our multidisciplinary team is pushing the boundaries of innovation in integrated photonics and semiconductor packaging.

Inpho’s new class of electro-photonic chips is poised to revolutionize and disrupt the optical interconnect market. Utilizing this new class of chips enables existing optical interconnect systems to be built at much lower cost; new architectures to be deployed that provide significantly higher price/performance; and a whole new generation of higher speed interconnect to be built that to date have been impossible.

About the Role

We are looking for a Senior Mechanical Engineer who thrives at the intersection of precision design and robust process development to help us bring our optical subassemblies to the global market. You will own the mechanical lifecycle of our optical subassemblies and will be responsible for how our products are built, tested, and scaled. You will bridge the gap between initial optoelectronic design and reliable prototyping and mass production, ensuring our hardware meets the rigorous demands of the telecom and datacom industry.

Key Responsibilities

Mechanical Design: Lead the end-to-end physical design of sophisticated optomechanical components and assemblies using CAD tools (SolidWorks).
Tolerance Budgeting & GD&T: Perform 3D tolerance stack-up analyses and apply Geometric Dimensioning and Tolerancing (GD&T per ASME Y14.5) to define precise models and manufacturing drawings for micro-scale optical assemblies.
Precision Tooling & Fixture Development: Design high-precision custom test setups and assembly fixtures to support R&D lab for prototype build and electro-optical characterizations, as well as production line for high-volume manufacturing.
Semiconductor Packaging: Support Designing and optimizing semiconductor/optoelectronic packaging design, focusing on thermal management, material selection and structural integrity.
Test Automation & Scripting: Develop custom automation scripts and control software (e.g., Python, LabVIEW, or VBA/SOLIDWORKS macros) to automate benchtop test fixtures and electro-optical measurement workflows.
BOM and PDM Management: Manage multi-level Bills of Materials (BOMs) and product configuration structures within Product Data Management (PDM) system, ensuring accuracy throughout the product lifecycle and coordinating with procurement.
Prototyping & Validation: Take a hands-on approach to building, testing, and validating parts and assemblies in the R&D lab.
DFMEA & Failure Analysis (FA): Partner with internal and external reliability and FA experts to conduct DFMEA and perform root-cause analysis on mechanical/packaging failure modes during prototype builds.
Vendor & OSAT Collaboration: Collaborate with machining vendors, tooling suppliers and OSAT partners to oversee component fabrication and qualification and facilitate the seamless transfer of components from R&D to production.
Cross-Functional Collaboration: Partner daily with packaging, electrical, optical, and production engineers as well as operations team to solve complex opto-mechanical design and integration challenges.

Qualifications

Education: Bachelor’s or Master’s degree in mechanical engineering, engineering physics or materials science and engineering.
Experience: 7+ years (with a Bachelor’s degree) or 5+ years (with a Master’s degree) of validated industrial development experience in semiconductor industry.
CAD Mastery and Tolerance Analysis: Advance proficiency in CAD tools for 3D model design and 2D drawings creation (using SolidWorks or Creo) with demonstrated expertise in GD&T and tolerance analysis.
Precision Fixturing Design and Fabrication: Proven track record designing custom micro-alignment tooling and lab fixtures for small-form-factor optoelectronic/semiconductor assemblies, as well as strong understanding of metal fabrication and machining processes.
BOM and Data Management: Hands-on experience managing BOMs and proven experience with product document management and version control platforms, specifically with SolidWorks PDM.
DFMEA & Reliability Collaboration: Hands-on experience participating in DFMEA risk mitigation and collaborating with failure analysis (FA) teams on material/mechanical defect resolution.
Semiconductor Packaging and Manufacturing Knowledge: Working knowledge of semiconductor packaging design concepts and thermal-mechanical constraints, as well as understanding of manufacturing methods and materials selection specific to the photonics and optoelectronics packaging industry.
Standards: Deep understanding of mechanical design standards (ISO, ANSI) and Datacom/Telecom equipment qualification standards (Telcordia GR468).
Communication: Excellent English verbal and written communication skills; ability to effectively convey complex technical concepts to diverse stakeholders.

Preferred Qualifications

Optical Alignment Systems: Experience with high-precision motion control stages, Thorlabs/PI alignment hardware, or automated optical bench setups.
Test Automation Scripting: Proficiency in programming/scripting languages (Python, LabVIEW, or VBA/macros) for test automation and data acquisition.

Why Join Inpho?

Be part of a mission-driven startup shaping the future of photonics.
Competitive salary, full health benefits and equity packages, flexible work environment, and career growth opportunities.

Come work with a dynamic, high-talent team to build and commercialize the highest performance photonics chips in the world!

Additional Information

This posting is for a newly created position.

The expected compensation range for this position is CAD$150,000 - $200,000 annually. Actual compensation offered for this position will be determined based on a variety of factors, including the candidate’s skills, level, experience, qualifications, and overall fit for the role.

Inpho may use Artificial Intelligence (AI) to support aspects of the recruitment process, including candidate screening and assessment. All final hiring decisions are made by Inpho’s Hiring Team.

Inpho is an equal opportunity employer committed to fostering an inclusive, diverse, and respectful workplace. We provide equal employment opportunities without discrimination based on race, colour, religion, sex, gender identity or expression, sexual orientation, national origin, age, disability, veteran status, or any other characteristic protected by applicable law.

If you require accommodation during the recruitment process, please contact Inpho Human Resources at hr@inpho.io

We thank all candidates for their interest in Inpho. Only those candidates selected for an interview will be contacted.

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More about this job

Responsibilities

Lead the mechanical design and lifecycle of optoelectronic assemblies, including tolerance analysis, semiconductor packaging, precision fixtures, prototyping, and validation. Manage product data and BOMs, automate testing, investigate failures, and coordinate with vendors, OSAT partners, and cross-functional teams to support production scale-up.

Requirements

Requires a bachelor’s or master’s degree in mechanical engineering, engineering physics, or materials science and engineering, plus at least 7 years of relevant industrial development experience with a bachelor’s degree or 5 years with a master’s degree. Candidates should have strong CAD, GD&T, tolerance analysis, precision fixture design, semiconductor packaging, BOM/PDM, DFMEA, and reliability collaboration experience, along with knowledge of relevant design and telecom/datacom standards.

Skills

Mechanical Design
SolidWorks
Creo
GD&T
Tolerance Analysis
Precision Fixturing
Semiconductor Packaging
Thermal Management
Test Automation
Python
LabVIEW
BOM Management
SolidWorks PDM
DFMEA
Failure Analysis
Optical Alignment

Benefits

Health Benefits
Equity
Flexible Work Environment
Career Growth Opportunities

Visa sponsorship

Not detected in the job text

Keywords

Optoelectronics
Integrated Photonics
Semiconductor Packaging
Optomechanical Design
SolidWorks
Creo
GD&T
ASME Y14.5
Tolerance Stack-Up Analysis
Precision Tooling
Assembly Fixtures
Thermal Management
Material Selection
Python
LabVIEW
VBA
Test Automation
Electro-Optical Characterization
Bills Of Materials
SolidWorks PDM
Prototyping
DFMEA
Failure Analysis
OSAT
Telcordia GR468
ISO Standards
ANSI Standards
Optical Alignment Systems
Motion Control Stages
Telecom And Datacom

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