Archived listing. The details below describe a past opening.
About O-HIVE
O-HIVE develops advanced Spatial Vision Intelligence technologies for robotics and industrial automation, combining Visual Language Models (VLMs), 3D perception, spatial intelligence, and edge AI.
We are developing a next-generation Spatial Vision Intelligence Chip designed to enable autonomous machines - including humanoid robots, drones, and industrial robotic systems - to perceive, understand, navigate, and interact with the physical world in real time.
The chip integrates AI vision, spatial perception, 3D understanding, and robotics-oriented workloads into a highly optimized edge computing architecture.
Position Overview
O-HIVE is seeking a Project / Product Manager to lead the development and commercialization of our Spatial Vision Intelligence Chip.
The successful candidate will work at the intersection of semiconductor engineering, AI/VLM development, robotics, embedded systems, and product strategy.
This role will coordinate the complete development lifecycle - from product requirements and system architecture through FPGA validation, RTL development, semiconductor implementation, packaging, evaluation boards, robotics integration, customer validation, and commercialization.
The Project / Product Manager will serve as the primary coordination point between O-HIVE's AI, ASIC, software, robotics, hardware, business development, external design-house, foundry, packaging, and strategic partner teams.
Key ResponsibilitiesProduct Strategy & Requirements
- Define the product roadmap for O-HIVE's Spatial Vision Intelligence Chip.
- Translate robotics and customer requirements into clear semiconductor and system-level product requirements.
- Define target applications, including:
- Humanoid robots
- Autonomous mobile robots
- Industrial robots
- Drones and autonomous systems
- Machine vision and industrial inspection systems
- Develop product specifications covering compute performance, power consumption, package size, interfaces, latency, memory, thermal requirements, and target workloads.
- Establish product positioning and differentiation against GPUs, NPUs, robotics processors, and edge AI accelerators.
- Maintain Product Requirements Documents (PRDs), technical specifications, development roadmaps, and release plans.
Semiconductor Development Program Management
Manage and coordinate major semiconductor development phases, including:
- Algorithm and architecture definition
- AI model optimization
- FPGA implementation and validation
- RTL development and simulation
- IP integration
- Verification
- Synthesis
- Physical design
- DFT
- Tape-out
- Foundry coordination
- Packaging
- Evaluation board development
- Silicon bring-up
- Performance validation
- Reliability testing
- Production readiness
Work closely with ASIC engineers and external semiconductor partners to manage schedules, technical dependencies, deliverables, and development risks.
AI & Spatial Intelligence Integration
Coordinate implementation of key Spatial Vision workloads, including:
- Visual Language Models
- Visual perception
- 2D/3D vision
- Depth estimation
- Object detection and segmentation
- Visual odometry
- SLAM
- Sensor fusion
- Spatial mapping
- Navigation
- Robotics planning
- Closed-loop perception and control
Work with AI engineers to translate software algorithms into architectures optimized for FPGA and ASIC implementation.
Robotics & System Integration
- Coordinate integration of the chip with robotic platforms and embedded systems.
- Define interfaces with cameras, depth sensors, IMUs, motors, robot controllers, and other sensors.
- Coordinate development of SDKs, APIs, firmware, drivers, and reference applications.
- Manage evaluation board and reference platform development.
- Lead validation of the chip using real-world robotics and autonomous-system applications.
Project Management
- Build and maintain detailed development schedules and milestone plans.
- Coordinate activities across AI, ASIC, embedded software, robotics, mechanical, electrical, and business teams.
- Track technical dependencies, critical paths, risks, budgets, and external deliverables.
- Conduct regular technical program reviews.
- Maintain clear documentation of decisions, specifications, milestones, and engineering changes.
- Identify development risks early and coordinate mitigation plans.
- Coordinate external semiconductor design houses, foundries, packaging vendors, board manufacturers, and technology partners.
Product Commercialization
- Develop commercialization plans for the Spatial Vision Intelligence Chip.
- Identify target customers and early design partners.
- Support technical discussions with robotics manufacturers, industrial automation companies, OEMs, and semiconductor partners.
- Coordinate customer evaluation programs and pilot deployments.
- Collect customer requirements and translate market feedback into future product generations.
- Support product pricing, licensing strategy, product packaging, and go-to-market planning.
- Work with business development teams on strategic partnerships and commercial opportunities.
Required Qualifications
- Bachelor's degree or higher in Electrical Engineering, Computer Engineering, Computer Science, Robotics, Semiconductor Engineering, or a related technical discipline.
- 3+ years of experience in technical product management, semiconductor program management, engineering project management, robotics, embedded systems, or related fields.
- Strong understanding of at least several of the following:
- ASIC / SoC development
- FPGA development
- Edge AI
- AI accelerators / NPUs
- Computer vision
- Robotics
- Embedded systems
- Semiconductor manufacturing
- Ability to translate complex engineering requirements into structured product specifications and development plans.
- Strong project management and cross-functional coordination skills.
- Ability to communicate effectively with both engineering teams and business stakeholders.
- Strong analytical, documentation, and problem-solving capabilities.
- Professional proficiency in English.
Preferred Qualifications
Experience with one or more of the following is highly desirable:
- AI accelerator or NPU development
- Robotics SoCs
- Visual Language Models or multimodal AI
- Computer vision accelerators
- 3D perception
- SLAM or Visual-Inertial Odometry
- FPGA-to-ASIC development
- RTL development or verification
- Semiconductor design houses
- Foundry and tape-out processes
- Semiconductor packaging
- Evaluation board development
- NVIDIA Jetson, FPGA, ARM, RISC-V, or similar embedded platforms
- Robotics middleware and communication systems
- ROS / ROS2
- Industrial robotics or autonomous systems
Previous experience taking a semiconductor or embedded computing product from prototype through silicon and commercialization is particularly valuable.
Key Success Metrics
Success in this position will include:
- Achievement of FPGA, RTL, tape-out, silicon bring-up, and commercialization milestones
- Delivery of the chip development program within defined schedule and budget targets
- Successful integration of Spatial Vision and VLM workloads
- Achievement of target compute, power, thermal, latency, and package specifications
- Successful operation on robotics reference platforms
- Completion of customer evaluation programs
- Conversion of early customers and design partners into commercial deployments
- Establishment of a scalable roadmap for subsequent generations of O-HIVE Spatial Vision Intelligence Chips
