Semiconductor Packaging Modeling and Simulation Engineer
- 611 Kumpf Dr, Unit 200, Waterloo, ON, N2V 1K8, Canada
Full-time
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Job details
- Job type
- Full-time
- Posting language
- English
- Posted
Original job description
Job Summary:
ON Semiconductor is seeking a self-driven and motivated professional to join their Corporate R & D modeling and simulation team, located in Waterloo, Ontario N2V 1KB, Canada. As a semiconductor packaging modeling and simulation engineer, you will have the opportunities to support new power module development and new product design, assembly and process, quality and reliability, and customers in worldwide.
Performance Objectives:
The successful candidate will have the opportunity to:
- Do thermal-mech simulation for microelectronic packaging and system, assembly process
such as Ag sintering and Cu sintering
- Analyze existing packages of reliability issues that are induced by thermal problems.
- Do analysis and correlation of thermal mech modeling results to measured data
- Develop and maintain the state of art thermal mech modeling methodology to improve the modeling work efficiency and accuracy
- Setup and maintain the HW/SW environment for thermal modeling
- Provide support to other thermal mech modeling users in the company
- Innovation of new technology through simulation
- Develop the state of art simulation methodology such as Digital Twin, AI and machine learning algorithm, crystal plasticity model, Ag and Cu sintering model, probability and optimization algorithm for component and system level models
Requirements:
- Master or PhD degree in Physics, Mechanical Engineering, Computational Mechanics, Solid Mechanics or Materials
- Knowledge and experience on thermal, mech modeling as well as crystal plasticity, and Cu/Ag sintering process
- Knowledge and experience of CAD concepts and Solidworks
- Familiar with semiconductor packaging
- Familiar with material thermal mech properties
- Strong knowledge of problem analysis and diagnosis technique
- Deep knowledge of non-linear solid mechanics, fracture mechanics and delamination
- Familiar with package test and analysis, quality assurance, and reliability methods
- Ability to perform model correlation to empirical measurement
- Familiar with the Unix/Linux operating system
- Familiar with FEA software ANSYS Mechanical APDL/Work Bench
- Strong English communication capability
- Strong learning capability
- Good team player
ON Semiconductor (Nasdaq: ON) is driving energy efficient innovations, empowering customers to reduce global energy use. The company is a leading supplier of semiconductor-based solutions, offering a comprehensive portfolio of energy efficient power and signal management, logic, standard and custom devices. The company’s products help engineers solve their unique design challenges in automotive, communications, computing, consumer, industrial, medical and military/aerospace applications. ON Semiconductor operates a responsive, reliable, world-class supply chain and quality program, and a network of manufacturing facilities, sales offices and design centers in key markets throughout North America, Europe and the Asia Pacific regions.
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
More details about our company benefits can be found here:
https://www.onsemi.com/careers/career-benefits
We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.
onsemi is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, ethnicity, color, religion, ancestry, national origin, age, marital status, pregnancy, sex, sexual orientation, physical or mental disability, medical condition, genetic information, military or veteran status, gender identity, gender expression, or any other protected category under applicable federal, state, or local laws.
If you are an individual with a disability and require a reasonable accommodation to complete any part of the application process, or are limited in the ability or unable to access or use this online application process and need an alternative method for applying, you may contact Talent.acquisition@onsemi.com for assistance.
More about this job
Responsibilities
The engineer will perform thermal-mechanical simulations for microelectronic packaging and assembly processes to support new product development. They will also develop advanced simulation methodologies, including Digital Twin and machine learning, to improve modeling efficiency and accuracy.
Requirements
Candidates must hold a Master's or PhD in Physics, Mechanical Engineering, or a related field with experience in thermal-mechanical modeling. Proficiency in FEA software like ANSYS and knowledge of semiconductor packaging and material properties are required.
Skills
- Thermal-mech simulation
- Semiconductor packaging
- Solidworks
- ANSYS Mechanical APDL
- Non-linear solid mechanics
- Fracture mechanics
- Delamination analysis
- Crystal plasticity
- Ag sintering
- Cu sintering
- Digital Twin
- Machine learning
- Problem analysis
- Reliability methods
- Unix
- Linux
Benefits
- Career benefits
Visa sponsorship
Not detected in the job text
Categories
- Engineering
- Technology
- Manufacturing
- Science & Research
- Energy
Keywords
- Semiconductor
- Packaging
- Modeling
- Simulation
- Thermal-mechanical
- Microelectronic
- Assembly
- Ag sintering
- Cu sintering
- Reliability
- CAD
- Solidworks
- Non-linear solid mechanics
- Fracture mechanics
- Delamination
- Digital Twin
- AI
- Machine learning
- Crystal plasticity
- Unix
- Linux
- FEA
- ANSYS
- Power module
- Quality assurance
- Physics
- Mechanical Engineering
- Computational Mechanics
- Solid Mechanics
- Materials