Layup Operator (2nd Shift)

Overview

OSI Systems companies have a long history of developing innovative solutions to bring a better quality of life to the world. Our OSI Electronics (OSIE) division is a diversified manufacturer of electronic devices and value-added manufacturing services.

We provide our customers with the manufacturing capabilities and purchasing power of a global Electronics Manufacturing Services provider. By delivering regional and personalized support best provided by a smaller company, we strive to build lasting relationships and create close and valued partnerships with our customers. Our singular focus is to help security experts, clinical professionals and high-tech developers solve real-world problems and issues.

PFC Flexible Circuits Limited, a division of OSI Electronics, is seeking a Layup Operator who will be responsible for cover coat and stiffener lay up of circuit boards according to the specifications provided in the production traveler.

This individual will support afternoon shift operations (4:00pm - 12:30am).

• This position offers a $0.75 per hour shift differential for second shift hours of operation (4:00 pm - 12:30 am).***
  
  

Responsibilities

• Panel cleaning for surface preparation (manual scrubbing) using approved solvents, abrasives, and/or pads per process specifications; verify cleanliness (e.g. no residue, oxidation) and handle panels carefully.
• Set up and operate die-cut equipment to cut panels/films to required dimensions; confirm cut quality (e.g. no tearing, burrs, or mis-registration), maintain correct grain/direction as required, and segregate nonconforming material.
• Set up and operate Spartanics punching equipment to add tooling holes/features for registration; verify punch alignment to artwork/tooling targets, perform first-piece verification, and record punch parameters per traveler.
• Perform cover coat layup by selecting correct coverlay/adhesive materials, aligning to tooling holes, controlling wrinkles/air entrapment, and building stacks per work instructions; prepare layups for lamination/press cycles.
• Apply stiffeners using specified adhesives; align to features, maintain required bondline/offset, and ensure correct part orientation and quantity per panel map.
• Laminate dry film photoresist to panels using lamination equipment; set/verify temperature, pressure, speed, and nip/roller condition; check for bubbles, wrinkles, edge lift, and film coverage, and document run settings.
• Uphold the company’s core values of Integrity, Innovation, Accountability, and Teamwork.
• Demonstrate behavior consistent with the company’s Code of Ethics and Conduct.
• It is the responsibility of every employee to report to their manager or a member of senior management any quality problems or defects in order for corrective action to be implemented and to avoid recurrence of the problem.
• Duties may be modified or assigned at any time to meet the needs of the business.
  
  

Qualifications

• High school diploma desired.
• Experience in flexible circuits, PCB, lamination/press, or converting operations (die cutting/punching) desired.
• Must be able to lift up to 25 pounds, without assistance.
• Must be a team player.
• Ability to work independently and in a team environment is essential.
• Positive attitude and strong work ethic are required.
• Excellent communication and interpersonal skills needed, including the ability to speak with all levels of employees, guests, vendors, and team members.
• Must have excellent attention to detail and ability to perform highly repetitive tasks.
• Excellent time management skills and ability to multi-task and prioritize work required.
• Basic computer skills for data entry, reviewing travelers, and completing documentation desired.
• Must be able to read, write and communicate effectively in the business language (English).
  
  

Pay may range from $18.00 to $18.00 hourly

OSI Systems, Inc. has three operating divisions: (a) Security, providing security and inspection systems, turnkey security screening solutions and related services; (b) Healthcare, providing patient monitoring, diagnostic cardiology and anesthesia systems; and (c) Optoelectronics and Manufacturing, providing specialized electronic components and electronic manufacturing services for original equipment manufacturers with applications in the defense, aerospace, medical and industrial markets, among others.