Director, Mechanical Engineering
- Coquitlam, BC, Canada
$193,300 to $265,800 CAD / year · Full-time
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Job details
- Pay
- $193,300 to $265,800 CAD / year
- Job type
- Full-time
- Apply by
- Posting language
- English
- Posted
Original job description
Location: British Columbia, Canada (Onsite)
Compensation: CA$193,300 - CA$265,800 / year
Description
Photonic is looking for an experienced, results-driven leader to own the mechanical engineering of our cryogenic sample space and the precision assemblies that surround it. This role covers the mechanical assemblies and quantum modules that transform Photonic’s quantum integrated circuits into operating quantum modules, and the sample space environments inside our existing cryostats where those modules are cooled, aligned, and measured. These assemblies operate at cryogenic temperatures, in high magnetic fields, and must meet customer expectations for data centre reliability.
Photonic is entering a growth phase following a successful fundraising round. In this role you will transform our mechanical engineering organization and development process. You will scale the team to balance a set of experienced project leads while adding foundational mechanical engineering competencies to meet exacting engineering and precision manufacturing requirements.
Please send your resume and a short cover letter in one file. Tell us why this role caught your attention, how you have helped an emerging technology find its market, and what you would bring to Photonic. We are interested in how you think, not in a perfectly polished application.
What We Need You To Do
- Own mechanical design and delivery of the cryogenic sample space in our existing cryostats: chip mount assemblies, thermal links and thermalization, optical and electrical IO interfaces, magnetic field subassemblies, and gas tuning hardware.
- Own the mechanical assemblies that package Photonic's quantum integrated circuits into quantum modules.
- Own the interfaces between the sample space and the cryostat, the optical excitation and RF delivery segments, and upstream chip pre-qualification systems.
- Build and lead the mechanical engineering organization, setting technical direction, the hiring bar, levelling, and delivery objectives as the team grows.
- Lead the team to engineer complex assemblies, in collaboration with external development and manufacturing partners.
- Build and grow mechanical engineering competence across core disciplines, including structures, dynamics, thermal, fluids, materials, cryogenics, automation and robotics, CAD, and Product Lifecycle Management.
- Own the competency framework for the team, identifying skill gaps and driving targeted development plans as the organization scales.
- Set and defend requirements for the sample space, including thermal resistance and cooling budgets, alignment and positioning tolerances, heat load budgets on each cryostat stage, and operation in high magnetic fields.
- Define the requirements, interfaces, and integration strategies that connect mechanical subsystems with the optical, electrical, and cryogenic elements of Photonic’s quantum modules.
- Set the standard for analysis, simulation, and design methodology, and hold the team to it.
- Foster collaboration between mechanical leads, test and assembly leads, suppliers, and project management to drive execution.
- Enhance the design process with a focus on design, build, and test deliverables, underpinned by Requirements definition and management.
- Ensure the design process is supported by design documentation, design reviews, trade studies, and FMEA.
- Lead design choices with a strong focus on long-term product viability; enforce strict DFX methodologies so systems are optimized for scalable volume manufacturing, ease of field maintenance, and robust testability.
- Strengthen project planning discipline, including resource estimation, scheduling, risk management, and make-versus-buy assessment.
- Ensure projects have the necessary resources, infrastructure, and processes to succeed, proactively identifying and removing blockers.
- Enhance design automation workflows and methodologies to accelerate development and meet product cadence.
- Establish key performance indicators to measure and optimize development productivity, schedule adherence, and quality outcomes.
- Collaborate with test and assembly development teams on flows, equipment, and capacity and quality improvements to accelerate yield learning and cycle times.
- Maintain departmental process workflow and refine it with learnings to drive continuous improvement.
- Ensure adherence to departmental workflow and project management practices.
- Stimulate intellectual property development and secure protection.
- Identify high-value digital transformation initiatives to enhance data-driven decision-making and use of AI.
- Lead, mentor, and develop high-performing technical teams.
- Foster a culture of technical curiosity, accountability, collaboration, and continuous improvement.
- Identify training opportunities to enhance employee skills and productivity.
- Conduct regular technical reviews and feedback sessions to promote professional growth.
- Master’s or Ph.D. degree in Mechanical Engineering, Engineering Physics, or a related discipline.
- 10+ years of leadership experience in precision mechanical, integrated circuit test and assembly, or cryogenic systems engineering, preferably within an R&D, technology, or innovation-driven environment.
- Demonstrated ownership of hardware operating in extreme environments: cryogenic temperatures, vacuum, or high magnetic fields.
- Proven track record of leading innovative product development teams resulting in high volume production.
- Strong systems-thinking ability, with experience defining requirements, interfaces, and integration strategies across multi-disciplinary teams.
- Expertise in design process methodologies such as simulation, progressive prototypes, test, documentation, and issue tracking systems like Jira.
- Experience hiring, scaling, and mentoring multidisciplinary engineering teams.
- Knowledge of regulatory requirements and industry certification practices.
- Excellent leadership, communication, and problem-solving skills.
- Hands-on experience with dilution or closed-cycle cryostats, thermal link design, and cryogenic materials selection.
- Familiarity with cryogenic optical alignment, fibre arrays, or RF signal delivery into a sample space.
- Experience managing engineering projects with external development and manufacturing partners.
- Experience working with technology partners, supply chain providers, and customers.
- Experience delivering against government or agency-funded program milestones.
- Familiarity with intellectual property management and technology commercialization.
- Experience in a high-growth or startup environment.
- Work side by side with scientists, engineers, commercial leaders, and executives who are building the technologies, partnerships, and markets that will shape quantum computing.
- Join a team that values good ideas, fast learning, and people who make things happen. You will have room to experiment, try new approaches, and see your work reach the market.
- Bring your perspective. We value people who challenge assumptions, share ideas openly, and make the work better through collaboration.
- Competitive compensation package including base salary, stock options, and comprehensive benefits.
More about this job
Responsibilities
Lead the mechanical engineering organization and own the design, integration, and delivery of cryogenic sample spaces and quantum module assemblies, including their interfaces with cryostats and optical, electrical, and cryogenic systems. Establish engineering standards and development processes, scale and mentor the team, and drive reliable, manufacturable products through planning, testing, supplier collaboration, and continuous improvement.
Requirements
Requires a master's or Ph.D. in Mechanical Engineering, Engineering Physics, or a related discipline, plus 10 or more years of leadership experience in precision mechanical, integrated circuit test and assembly, or cryogenic systems engineering. Candidates should have experience leading multidisciplinary teams and innovative hardware development, defining system requirements and interfaces, and delivering hardware for extreme environments; cryostat, thermal-link, optical alignment, and RF experience are preferred.
Skills
- Mechanical Engineering Leadership
- Precision Mechanical Design
- Cryogenic Systems Engineering
- Thermal Engineering
- Structural Analysis
- Dynamics
- Fluid Mechanics
- Materials Engineering
- Optical Alignment
- RF Signal Delivery
- Requirements Management
- Design for Manufacturing
- Simulation and Prototyping
- Project Planning
- Team Building and Mentoring
Benefits
- Stock Options
- Comprehensive Benefits
Visa sponsorship
Not detected in the job text
Categories
- Engineering
- Management & Leadership
- Manufacturing
- Technology
- Science & Research
Keywords
- Mechanical Engineering
- Cryogenic Systems
- Cryostats
- Quantum Integrated Circuits
- Quantum Modules
- Precision Assemblies
- Thermal Links
- Thermalization
- Optical Alignment
- Fibre Arrays
- RF Signal Delivery
- High Magnetic Fields
- Vacuum
- CAD
- Product Lifecycle Management
- Simulation
- Progressive Prototyping
- Design Reviews
- Trade Studies
- FMEA
- Design for Manufacturing
- Requirements Management
- Jira
- Automation and Robotics
- Make-versus-Buy Assessment
- Intellectual Property
- Technology Commercialization
- High-Volume Production
- Supplier Management
- Dilution Cryostats