Optical Packaging & Assembly Engineer
- Coquitlam, BC, Canada
On-site
$94,200 to $130,000 CAD / year · Full-time
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Job details
- Pay
- $94,200 to $130,000 CAD / year
- Job type
- Full-time
- Workplace
- On-site
- Experience
- 3+ years of experience with photonic integrated circuit, semiconductor, optoelectronic, fiber optic, or related packaging design & qualification
- Posting language
- English
- Posted
Original job description
Optical Packaging & Assembly Engineers at Photonic are part of a team to realize first-of-their-kind photonic all-integrated circuits for implementing truly scalable quantum technologies. You will be developing, implementing and testing robust and scalable packaging and assembly procedures for a variety of photonic circuits. As an Optical Packaging & Assembly Engineer, you are a specialist in optical alignment and assembly, process development, and NPI (New Product Introduction). You will work in a diverse, fast-paced, and multi-disciplinary team of engineers, scientists and technicians.
Please include a cover letter with your resume (in one file) describing how you would be a great fit at Photonic and what attributes you could bring to our growing team.
ABOUT THE ROLE
- Develop and implement optical packaging and assembly processes for integrated photonic devices, including high-precision active alignment to achieve optimal coupling efficiency and long-term stability
- Design, validate, and optimize alignment methods and tooling to improve accuracy, throughput, and repeatability
- Establish validation plans and characterize optical performance under relevant operating conditions
- Define scalable workflows, SOPs, and process controls to ensure consistent manufacturing outcomes
- Support New Product Introduction by partnering with design, device, test, and manufacturing teams to apply Design for Excellence methodologies like Design for Manufacturability, Design for Test, and Design for Reliability early in the development cycle.
- Develop assembly stations integrating precision motion, optical metrology, and environmental control
- Analyze assembly, process, and test data to identify yield drivers, root causes, failure mechanisms, and opportunities for improved throughput, repeatability, and stability.
- Collaborate across teams to develop robust, manufacturable packaging solutions
- Define qualification criteria and acceptance standards to support product release
ABOUT YOU
- PhD or Master’s degree in physics, applied physics, packaging engineering, electrical engineering, or other relevant discipline
- Knowledge of and hands-on-experience with integrated photonics and optics
- 3+ years of experience with photonic integrated circuit, semiconductor, optoelectronic, fiber optic, or related packaging design & qualification
- Working experience in new product introduction
- Excellent teamwork, interpersonal and written communication skills.
- Good organization, problem solving skills.
- Strong attention to detail
An exceptional candidate will bring:
- Deep hands-on expertise in high-precision optical alignment and packaging for Photonic Integrated Circuits
- Proven ability to translate research-grade photonic assemblies into robust, production-ready assembly processes
- Strong experience in data-driven process optimization including analyzing large datasets to identify yield drivers, diagnose failure mechanisms, and improve process stability
- Demonstrated contribution to New Product Introduction (NPI) and experience in Design for Excellence (DfX) methodologies with focus on Design for Manufacturability (DfM), Design for Test (DfT), and Design for Reliability (DfR)
WHY YOU SHOULD WORK WITH US
- Work closely with some of the brightest innovators in quantum technologies to drive breakthroughs that redefine computing
- Enjoy a fast-paced and fun environment where you can try new things while solving innovative challenges every day
- Inclusive company culture that values collaboration
- Regular social events and fun activities keep our global team connected
- Competitive compensation package including base salary, stock options, and relocation assistance for global talent
- Comprehensive benefits including extended health, dental, life, long term disability, an employee assistance program, parental leave top-ups, and a flexible spending account
The description above is what we think an ideal candidate would look like for this role. At Photonic, we understand that everyone has a different work and life journey. If you feel your experience is close to what we've described, but you might not meet all the requirements, please still apply! All roles listed are for current vacancies. While artificial intelligence (AI) tools may be used to assist in reviewing applicant profiles, they do not determine candidate outcomes. Our hiring decisions are made by people, not algorithms. We are committed to fostering, cultivating, and preserving a culture of equity, diversity, and inclusion. We embrace and encourage our employees’ differences, knowing that these very differences inspire innovation and build better teams. If there are any accommodations our team can make throughout our hiring process, please let us know.
More about this job
Responsibilities
The Optical Packaging & Assembly Engineer at Photonic will build and improve the processes that assemble and align optical chips. They will also analyze test data, write procedures and work with design and manufacturing teams to make products ready for production.
Requirements
Photonic needs candidates with a PhD or Master's in physics, applied physics, packaging or electrical engineering, plus 3+ years of photonics or packaging experience and hands-on optical alignment skills. Experience with New Product Introduction and strong teamwork, communication and attention to detail are also required.
Skills
- Active optical alignment
- Photonic integrated circuit packaging
- Fiber optic packaging
- Optical metrology
- Precision motion control
- Assembly station design
- Process development
- SOP development
- Yield analysis
- Root cause analysis
- Data analysis
- New product introduction
- Design for manufacturability
- Design for test
- Design for reliability
- Optoelectronics
- Semiconductor packaging
- Qualification and validation
- Test and characterization
- Cross-functional collaboration
Benefits
- Stock options
- Relocation assistance
- Extended health insurance
- Dental insurance
- Life insurance
- Long term disability insurance
- Employee assistance program
- Parental leave top-ups
- Flexible spending account
Categories
- Engineering
- Science & Research
- Technology
- Manufacturing
Keywords
- optical packaging
- optical assembly
- active alignment
- photonic integrated circuits
- photonics
- quantum technologies
- fiber optics
- optoelectronics
- new product introduction
- NPI
- design for manufacturability
- design for test
- design for reliability
- process development
- yield analysis
- semiconductor packaging
- optical metrology
- photonics engineer
Seniority
Mid level
Perks
- Flexible hours
- Parental leave
- Relocation support
- Stock or equity
- Wellness program
Languages
- English
Fields of study
- physics
- applied physics
- packaging engineering
- electrical engineering