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Research Scientist

  • Kingston, ON, Canada
  • NA-CA-KINGSTON (EL), Canada

Full-time

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Job details

Job type
Full-time
Posting language
English
Posted

Original job description

Are you looking to power the next leap in the exciting world of advanced electronics? Do you want to help solve problems that drive success in the rapidly evolving technology and connectivity landscape? Then bring your problem-solving, passion, and creativity to help us power the next leap in electronics.

At Qnity, we’re more than a global leader in materials and solutions for advanced electronics and high-tech industries – we’re a tight-knit team that is motivated by new possibilities, and always up for a challenge. All our dedicated teams contribute to making cutting-edge technology possible. We value forward-thinking challengers, boundary-pushers, and diverse perspectives across all our departments, because we know we play a critical role in the world enabling faster progress for all. Learn how you can start or jumpstart your career with us.

Research Scientist – Mechanical Engineering (Thermal Materials for Electronics & Semiconductors)

The successful candidate will provide technical leadership in planning and executing a comprehensive research and development program, including scale-up, focused on thermal materials engineering, heat transfer, and mechanical design for advanced electronics and semiconductor applications. This work will be driven by both internal and external customer needs, particularly in high-performance and miniaturized electronic systems.

Working collaboratively within cross-functional project teams, the candidate will contribute to the development of next-generation thermal management solutions, including thermal interface materials (TIMs), heat spreaders, encapsulants, and advanced composite systems aligned with key business objectives.

A core responsibility of this role is to identify and create commercial value in thermally functional materials and systems by leveraging deep expertise in heat transfer, thermal conductivity enhancement, and structure–property–performance relationships in engineered materials.

The candidate will play a critical role in developing and analyzing intellectual property and patent landscapes related to emerging thermal solutions for semiconductor packaging, power electronics, and high-density electronic assemblies, identifying opportunities for innovation and protection of novel technologies.

Strong project management capabilities are essential to ensure that objectives, milestones, and deliverables are achieved on time and within budget, while adhering to the organization’s Foundational Principles.

In addition, the candidate will foster a positive and collaborative work environment by providing technical leadership and mentorship to team members. The role requires a high degree of initiative, with the ability to work independently and drive complex thermal engineering challenges under minimal supervision.

Qualifications

  • Ph.D. in Mechanical Engineering (preferred), Materials Engineering, Chemical Engineering, or closely related discipline with 3–7 years of R&D experience in thermal materials or thermal management technologies.
  • Post-doctoral experience in thermal sciences, electronics cooling, or advanced materials is considered an asset.
  • Strong fundamentals in:
    • Heat transfer (conduction, convection, phase change)
    • Thermal modeling and simulation (e.g., FEM/CFD tools such as ANSYS, COMSOL, or equivalent)
    • Thermal characterization techniques (e.g., laser flash, DSC, TGA, IR thermography)
  • Demonstrated expertise in thermal interface materials (TIMs), gap fillers, phase-change materials, dielectric materials, or thermally conductive composites for electronics applications.
  • Experience with semiconductor packaging, power electronics cooling, or high-performance computing thermal challenges is highly desirable.
  • Knowledge of structure–property relationships in thermally conductive materials, including particle-filled systems, hybrid materials, and anisotropic heat conduction designs.
  • Experience with materials processing and manufacturing techniques such as mixing, dispersion, coating, curing, and interface engineering.
  • Strong desire to translate research into commercial thermal solutions, with a results-oriented mindset.
  • Excellent project management, planning, prioritization, and leadership skills.
  • Strong interpersonal, communication, and presentation skills, with the ability to engage both technical and non-technical stakeholders.
  • Advanced analytical and technical problem-solving skills, including data interpretation and modeling.
  • Demonstrated mentorship or team leadership experience is an asset; familiarity with product development and business processes is beneficial.
  • Ability to work effectively both independently and within interdisciplinary teams, with an unwavering commitment to safety and engineering excellence.
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Qnity is an equal opportunity employer. Qualified applicants will be considered without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability or any other protected class. If you need a reasonable accommodation to search or apply for a position, please visit our Accessibility Page for Contact Information.

Qnity offers a comprehensive pay and benefits package. To learn more visit the Compensation and Benefits page.

This posting is for an existing vacancy.

We use Artificial Intelligence (AI) to enhance our recruitment process.

More about this job

Responsibilities

The Research Scientist will lead the development of thermal management solutions for advanced electronics and semiconductor applications. They will manage research programs, analyze intellectual property landscapes, and collaborate with cross-functional teams to deliver commercial thermal technologies.

Requirements

Candidates must hold a Ph.D. in Mechanical, Materials, or Chemical Engineering with 3–7 years of R&D experience in thermal materials. Strong proficiency in heat transfer, thermal modeling tools, and thermal characterization techniques is required.

Skills

  • Thermal management
  • Heat transfer
  • Mechanical engineering
  • Semiconductor packaging
  • Thermal interface materials
  • Finite element analysis
  • Computational fluid dynamics
  • Thermal modeling
  • Materials engineering
  • Project management
  • Technical leadership
  • Data interpretation
  • Intellectual property
  • Composite systems
  • Electronics cooling

Visa sponsorship

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Categories

  • Science & Research
  • Engineering
  • Technology
  • Manufacturing

Keywords

  • Research Scientist
  • Thermal Materials
  • Semiconductors
  • Mechanical Engineering
  • Heat Transfer
  • Thermal Interface Materials
  • TIMs
  • ANSYS
  • COMSOL
  • FEM
  • CFD
  • Thermal Characterization
  • DSC
  • TGA
  • IR Thermography
  • Semiconductor Packaging
  • Power Electronics
  • High-performance Computing
  • Composite Systems
  • Intellectual Property
  • R&D
  • Materials Processing
  • Project Management
  • Technical Leadership
  • Electronics Cooling
  • Phase-change Materials
  • Dielectric Materials
  • Anisotropic Heat Conduction
  • Innovation
  • Product Development

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