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Mechanical Design and Analysis Engineer

  • Ottawa, ON, Canada

The compensation range for this position is $100,000 - $150,000 annually. · Full-time

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Job details

Pay
The compensation range for this position is $100,000 - $150,000 annually.
Job type
Full-time
Apply by
Experience
Minimum 8 years' experience in a product development role, conducting both mechanical design and finite element analysis
Posting language
English
Posted

Original job description

Description

Advanced Microsystems Technologies, AMT, is a technology division of Sanmina Corporation (Nasdaq: SANM), responsible for RF, Microelectronic, Optical components and Integrated Subsystems, providing services from design concept, through prototype design and testing, process development, assembly and test innovation, to volume manufacturing. We are extremely proud to partner with our customers enabling their product through the full product lifecycle.

At AMT, you will work on some of the most innovative programs and products that address emerging markets, including optical and RF communication, datacenter connectivity, quantum computing, automotive sensing systems, medical devices and diagnostics and test & measurement systems, to name a few.

Come and join us, and be part of a team that challenges you to be your best, where you will be empowered to make a difference and where we are extremely proud of what we deliver, together.

Job Purpose

The Mechanical Design Team, as part of the larger product solutions development team, provides mechanical design and analysis support of product development, NPI, and manufacturing of a variety of different optical product families.

We are looking for an experienced Mechanical Engineer, with a strong background of both mechanical design and advanced thermal and structural finite element analysis, to support product design and analysis within a worldwide end-to-end product development team to develop advanced Opto/microelectronic components, modules and sub-systems.

Nature Of Duties / Responsibilities

  • As a key technical leader within the multidisciplinary development team, define and execute mechanical design solutions to meet design specifications. Design projects include, but are not limited to:
    • Telecommunications components/modules/subsystems (flip chip BGA modules, lasers, detectors, modulators, optical receivers, amplifiers, transceivers, etc)
    • Sensing / lidar optical components/systems
    • Medical, biomedical, military etc components
  • Define and perform finite element analysis to assess thermal and structural performance (over temperature) of the various product and assembly types noted above
  • Interpret mechanical standards and MSAs and design compliant mechanical components
  • Perform statistical tolerance analysis of your designs to ensure performance and manufacturability
  • Design microelectronic packages / modules, integrating optical, electrical (including RF) and thermomechanical elements
  • Support the definition and management of project plans to meet end deliverables and help coordinate activities within the multidisciplinary development team
  • Work with process and test engineering teams to ensure alignment of designs with process and test capabilities
  • Support new technology research and development as part of AMT’s Technology Roadmap
Education & Experience

  • Minimum Bachelors Degree in Engineering
  • Minimum 8 years' experience in a product development role, conducting both mechanical design and finite element analysis
  • AutoCAD/SolidWorks design experience and FEA using Ansys software tools
  • Experience in the design and analysis of RF/Microwave/Optical packages
  • Experience in optical and microelectronic technologies, materials, components, assembly and test processes
  • Experience in end-to-end product development, with product manufacturing implementation considered an asset
  • Experience with DFM and FMEA would be an asset
  • Ability to work well within a multidisciplinary development team in a fast-paced environment
  • Strong written and verbal communication skills are required

Other Information

  • The compensation range for this position is $100,000 - $150,000 annually.
  • This position is for an existing vacancy.
  • The hiring process for this position does not use Artificial Intelligence (AI).

Sanmina welcomes and encourages applications from persons with disabilities. In accordance with the guidelines established under the Accessibility for Ontarians with Disabilities Act (AODA), accommodations are available on request for candidates taking part in all aspects of the selection process.
More about this job

Responsibilities

Lead mechanical design and thermal and structural finite element analysis for optical, RF, and microelectronic components, modules, and subsystems. Coordinate product development activities with multidisciplinary teams and ensure designs meet specifications, manufacturing processes, and test capabilities.

Requirements

A bachelor's degree in engineering and at least eight years of product development experience involving both mechanical design and finite element analysis are required. Candidates should have AutoCAD or SolidWorks and Ansys experience, relevant RF, microwave, or optical package design experience, and knowledge of optical and microelectronic technologies and manufacturing processes.

Skills

  • Mechanical Design
  • Finite Element Analysis
  • Thermal Analysis
  • Structural Analysis
  • AutoCAD
  • SolidWorks
  • Ansys
  • RF/Microwave Package Design
  • Optical Package Design
  • Microelectronic Technologies
  • Statistical Tolerance Analysis
  • Design for Manufacturability
  • Failure Mode and Effects Analysis
  • Product Development
  • Project Planning
  • Cross-Functional Collaboration

Visa sponsorship

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Categories

  • Engineering
  • Manufacturing
  • Technology

Keywords

  • Mechanical Design
  • Finite Element Analysis
  • Thermal Performance
  • Structural Performance
  • Ansys
  • AutoCAD
  • SolidWorks
  • RF Packages
  • Microwave Packages
  • Optical Packages
  • Microelectronics
  • Optoelectronics
  • Flip Chip BGA
  • Lasers
  • Detectors
  • Modulators
  • Optical Receivers
  • Amplifiers
  • Transceivers
  • Lidar
  • Statistical Tolerance Analysis
  • Mechanical Standards
  • Manufacturing
  • New Product Introduction
  • Design for Manufacturability
  • Failure Mode and Effects Analysis
  • Project Planning
  • Process Development
  • Test Engineering
  • Product Lifecycle

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