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Added 1 month ago
TM
Product Development Engineering Specialist
Trudell Medical International
Waterloo, ON
- $80,000 to $95,000 CAD / year
- Full-time
With oversight from Senior, Principal Engineer or Product Development Project Lead, design mechanical or electromechanical solutions to support device design
Added 1 month ago
TM
Senior Product Development Engineering Specialist
Trudell Medical International
Waterloo, ON
- $105,000 to $125,000 CAD / year
- Full-time
…sub-systems to support product design. Acting as design responsible engineer (DRE) or as an advisor to more junior…
Added 1 month ago
TM
Product Development Engineering Specialist - Core Projects
Trudell Medical International
London, ON
- $80,000 to $95,000 CAD / year
- Full-time
With oversight from Senior, Principal Engineer or Product Development Project Lead, design mechanical or electromechanical solutions to support device design
Added 1 month ago
TM
Senior Product Development Engineering Specialist
Trudell Medical International
London, ON
- $105,000 to $125,000 CAD / year
- Full-time
…sub-systems to support product design.Acting as design responsible engineer (DRE) or as an advisor to more junior…
Added 1 month ago
H
Analog Validation & Characterization Engineer
HaiLa
Ottawa, ON
- Full-time
As an Analog Validation & Characterization Engineer, you will own the path from first silicon bring-up through high-volume production test, working closely with design, packaging, and…
Added 1 month ago
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Senior Manager, Data Products
Pelmorex
Oakville, ON
- Full-time
Establish the review process and documentation standards that let new data use cases move from idea to green light quickly and defensibly.
Added 1 month ago
DI
AKS Platform Engineer (1891) $85-95/hr
Direct IT Recruiting Inc.
Toronto, ON
- $85 to $95 CAD / hour
- Contract
Key Skills: 6+ years as a Platform Engineer, AKS, Azure DevOps, GitHub Actions, Helm, Jenkins, Key Vault, DevSecOps, Terraform, Bicep, ARM
Added 1 month ago
H
Analog Validation & Characterization Engineer
HaiLa
Montreal, QC
- Full-time
As an Analog Validation & Characterization Engineer, you will own the path from first silicon bring-up through high-volume production test, working closely with design, packaging, and…
Added 1 month ago
LE
Mechanical Engineer
LONGi Energy Storage
Burnaby, BC
- Full-time
We are seeking an experienced Mechanical Engineer to support the design, development, and production of utility-scale and C&I battery energy storage products. This role focuses on…
Added 1 month ago
S
Senior Design Engineer, Microelectronics and Advanced Packaging
Sanmina
Ottawa, ON
- $110,000 to $160,000 CAD / year
- Full-time
We are seeking a Senior Design Engineer, Microelectronics and Advanced Packaging to join our team to support and lead both technology and product development programs, from initial…
Added 1 month ago
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Senior Microelectronics Process Engineer
Sanmina
Ottawa, ON
- $145,000 to $165,000 CAD / year
- Full-time
Advanced Packaging Execution: Lead the hands-on development of critical process recipes, including Flip Chip, Underfill, Die Attach (epoxy & eutectic AuSn), and Wire Bonding (ball/wedge).
Added 1 month ago
TP
Maintenance Manager
Teva Pharmaceuticals
Whitchurch-Stouffville, ON
- Full-time
…fluid bed dryers, compactors, coating pans, encapsulators, packaging lines, and other pharmaceutical processing…
Added 1 month ago
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Project Engineer (Open to New Graduates)
Wonderbrands
Toronto, ON · Etobicoke, ON
- Other
Must have a valid driver’s license
Added 1 month ago
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Project Engineer
Wonderbrands
Toronto, ON · Etobicoke, ON
- Other
We are seeking a Project Engineer – Capital Projects to join our Engineering team in the Greater Toronto Area.
Added 1 month ago
O
Plant Engineer
O-I
Brampton, ON
- $120,000 to $160,000 CAD / year
- Full-time
O-I has more than a century of experience crafting pure, sustainable, brand-building glass packaging for many of the world’s best-known food and beverage brands. We are proud to provide…
Added 1 month ago
O
Semiconductor Packaging Modeling and Simulation Engineer
onsemi
Waterloo, ON
- Full-time
…located in Waterloo, Ontario N2V 1KB, Canada. As a semiconductor packaging modeling and simulation engineer, you will have the opportunities to support new power module development and new…
Added 1 month ago
D|
Senior Manager, Engineering
DECIEM | THE ABNORMAL BEAUTY COMPANY
Toronto, ON · Etobicoke, ON
- Full-time
Strong process equipment expertise in manufacturing, with deep technical knowledge of mixing, filling, and packaging technologies
Added 1 month ago
PI
Project Manager
Pack-Smart Inc.
Concord, ON
- $100,000 to $140,000 CAD / year
- Full-time
…a global leader in high-speed automation solutions for the packaging, print, and converting industries. For over two decades, we’ve been pushing the boundaries of engineering excellence…
Added 1 month ago
I
Photonic Product Validation & Characterization Engineer
Inpho
Ottawa, ON · Kanata, ON
- $100,000 to $150,000 CAD / year
- Full-time
…boundaries of innovation in integrated photonics and semiconductor…
Added 1 month ago
P5
Sr. Aseptic Filling Project Engineer
Pillar 5 Pharma inc.
Arnprior, ON
- Full-time
Pillar5 Pharma is seeking an experienced Senior Project Engineer / Senior Aseptic Filling Engineer to lead the implementation of new aseptic manufacturing and packaging capabilities within…
Added 1 month ago
EI
Plant Engineer
EPC Industries Limited
Amherst, NS
- Full-time
The Plant Engineer provides technical guidance and expertise and feedback to the Management team and to Engineering Project Coordinators as required. The Plant Engineer will have a primary…
Added 1 month ago
I
Senior Optical Engineer
Inpho
Ottawa, ON · Kanata, ON
- $175,000 to $200,000 CAD / year
- Full-time
…boundaries of innovation in integrated photonics and semiconductor…
Added 1 month ago
MS
Engineering student - Mechanical Design - Winter 2027
MDA Space
Sainte-Anne-de-Bellevue, QC
- Full-time
The student will integrate into a team working on either antenna design, payload design, electronics packaging design or tooling. The student may work on more than one project at a time.…
Added 1 month ago
LD
Senior Mechanical Engineer
Leonardo DRS
Ottawa, ON · Kanata, ON
- Full-time
The Senior Mechanical Engineer is responsible for the design and development of electronic enclosures for ruggedized hardware applications. This role leads mechanical design activities from…
Added 1 month ago
Senior Mechanical Engineer
Leonardo DRS, Inc.
Ottawa, ON · Kanata, ON
The Senior Mechanical Engineer is responsible for the design and development of electronic enclosures for ruggedized hardware applications. This role leads mechanical design activities from…

Sanmina

Senior Microelectronics Process Engineer

Ottawa, ON, Canada

$145,000 to $165,000 CAD / year · Full-time

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Job details

Pay: $145,000 to $165,000 CAD / year
Job type: Full-time
Experience: Minimum 8+ years of direct, hands-on experience in microelectronics packaging and process engineering.
Posting language: English
Posted: Sep 22, 2026

Original job description

Advanced Microsystems Technologies, AMT, is a technology division of Sanmina Corporation (Nasdaq: SANM), responsible for RF, Microelectronic, Optical components and Integrated Subsystems, providing services from design concept, through prototype design and testing, process development, assembly and test innovation, to volume manufacturing. We are extremely proud to partner with our customers enabling their product through the full product lifecycle.

At AMT, you will work on some of the most innovative programs and products that address emerging markets, including optical and RF communication, datacenter connectivity, quantum computing, automotive sensing systems, medical devices and diagnostics and test & measurement systems, to name a few.

Come and join us, and be part of a team that challenges you to be your best, where you will be empowered to make a difference and where we are extremely proud of what we deliver, together.

Job Purpose

We are seeking an industry expert to lead the process architecture and development for our next-generation optical and microelectronic process solutions.

In this pivotal role, you will act as the technical anchor for our product solutions team. You will not simply run processes; you will define the assembly strategy from the ground up. Bridging the gap between R&D and high-volume manufacturing, you will own the end-to-end process lifecycle - from initial concept and recipe development to equipment selection and final release-to-manufacturing.

If you are a hands-on expert in flip-chip, wire bonding, and advanced optical packaging who thrives on solving complex device physics challenges, we want you to lead our technical vision.

Key Responsibilities

Process Architecture & Development

Define the Strategy: Conceptualize and develop comprehensive assembly strategies for complex optoelectronic modules, ensuring alignment with device physics, thermal requirements, and throughput goals.
Advanced Packaging Execution: Lead the hands-on development of critical process recipes, including Flip Chip, Underfill, Die Attach (epoxy & eutectic AuSn), and Wire Bonding (ball/wedge).
Equipment Leadership: Research, specify, and procure capital equipment. Oversee acceptance testing (SAT/FAT) to ensure new capabilities meet technological roadmaps.

NPI & Design for Manufacturability (DFx)

Design Partnership: Act as the primary feedback loop to the internal design team and external customers. Provide expert DFx (Design for Assembly/Manufacturing) guidance to optimize yield and reliability before prototypes are built.
Tooling & Fixturing: Conceptualize and drive the design of custom tooling and fixtures required for novel assembly techniques.
Customer Interface: Serve as the primary technical liaison for customers during the development phase, translating their requirements into viable manufacturing processes.

Quality, Analysis & Control

Rigorous Methodology: Implement robust process controls using PFMEA and Control Plans.
Root Cause Analysis: Lead complex troubleshooting efforts using methodical approaches (8D, etc.) to resolve yield excursions or performance issues.
Documentation: Author and approve high-level process assembly documentation and process qualification reports.

Mentorship & Leadership

Technical Mentorship: Act as a subject matter expert and mentor to junior and intermediate engineers, fostering a culture of technical excellence and best practices.
Project Management: Manage engineering timelines and milestones to ensure customer NPI builds are delivered on schedule.

Required Experience & Education:

Master’s Degree in Engineering (Materials, Electrical, Mechanical, or Physics).
Minimum 8+ years of direct, hands-on experience in microelectronics packaging and process engineering.
Core Competencies: deep expertise in Flip Chip and Wire Bonding (Chip & Wire) processes is non-negotiable.
Material Science: Strong understanding of material interactions, including underfills, epoxies, and gold-tin (AuSn) soldering/reflow processes.

Technical Skills:

Proficiency in programming automated assembly equipment (pick-and-place, dispensers, wire bonders).
Demonstrated experience driving Engineering Change Orders (ECOs) and process qualifications.
Strong background in statistical process control (SPC) and data analysis.

Preferred Assets:

Experience specifically within the Photonics/Microelectronics sector.
Proficiency with CAD tools (AutoCad, SolidWorks) for tooling design.
Knowledge of Lean Manufacturing and Six Sigma principles.

Why Join Us?

Impact: Work on cutting-edge technologies that are shaping the future of connectivity.
Location: Based in the heart of Canada’s tech hub in Kanata, ON.
Growth: A visible role with the opportunity to shape the engineering culture and technical roadmap of the organization.

OTHER INFORMATION

The compensation range for this position is $145,000 - $165,000 annually.
This position is for an existing vacancy.
The hiring process for this position does not use Artificial Intelligence (AI).

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More about this job

Responsibilities

The role involves leading the process architecture and development for next-generation optical and microelectronic solutions from concept to manufacturing. You will act as the technical anchor, defining assembly strategies and managing the end-to-end process lifecycle including equipment selection and NPI.

Requirements

Candidates must hold a Master’s degree in Engineering and possess at least 8 years of hands-on experience in microelectronics packaging. Deep expertise in Flip Chip and Wire Bonding processes is mandatory for this position.

Skills

Microelectronics
Flip Chip
Wire Bonding
Process Engineering
Optoelectronics
Material Science
DFx
PFMEA
Root Cause Analysis
Statistical Process Control
CAD
SolidWorks
Lean Manufacturing
Six Sigma
Project Management
Equipment Specification

Visa sponsorship

Not detected in the job text

Keywords

Microelectronics
Process Engineering
Flip Chip
Wire Bonding
Optoelectronics
Packaging
Material Science
AuSn
DFx
PFMEA
8D
SPC
NPI
CAD
SolidWorks
Lean Manufacturing
Six Sigma
Semiconductor
Photonics
Assembly Strategy
Equipment Procurement
SAT
FAT
Engineering Change Orders
Technical Mentorship

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Jobs in Canada