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Added 1 min ago
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Mine Engineer/Planner - PL#43148
Peter Lucas Project Management Inc.
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Sanmina

Senior Opto-Mechanical Design Engineer

Ottawa, ON, Canada

The compensation range for this position is $100,000-150,000 annually. · Full-time

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Job details

Pay: The compensation range for this position is $100,000-150,000 annually.
Job type: Full-time
Apply by: Nov 27, 2026
Experience: 5+ years' experience in a product development role with a focus on transceiver design
Posting language: English
Posted: Oct 28, 2026

Original job description

Description

Advanced Microsystems Technologies, AMT, is a technology division of Sanmina Corporation (Nasdaq: SANM), responsible for RF, Microelectronic, Optical components and Integrated Subsystems, providing services from design concept, through prototype design and testing, process development, assembly and test innovation, to volume manufacturing. We are extremely proud to partner with our customers enabling their product through the full product lifecycle.

At AMT, you will work on some of the most innovative programs and products that address emerging markets, including optical and RF communication, datacenter connectivity, quantum computing, automotive sensing systems, medical devices and diagnostics and test & measurement systems, to name a few.

Come and join us, and be part of a team that challenges you to be your best, where you will be empowered to make a difference and where we are extremely proud of what we deliver, together.

Job Purpose

The Senior Opto-Mechanical Design Engineer, as part of the larger product solutions development team, provides mechanical design support of product development, NPI, and manufacturing of a variety of different optical product families.

We are looking for an experienced Opto-Mechanical Engineer, with a strong background in mechanical design, and a clear focus on the physical design, thermal management and packaging of high-speed optical modules, in small form factors such as QSFP, OSFP, to support product design and analysis within a worldwide end-to-end product development team developing advanced Opto/microelectronic components, modules and sub-systems.

Nature Of Duties / Responsibilities

Physical design, thermal management and packaging of high-speed optical modules, in small form factors such as QSFP, OSFP. Experience with CPO design approaches and architectures an asset. Responsibilities include:
- Mechanical housing subassembly design and module integration, PCB packaging and flex circuit integration, optical fiber routing and interconnects
- Host system integration considerations of pluggables: insertion/extraction forces, mating cycles, air vs liquid cooling
- Design for manufacturability, assembly and test to ensure high volume product viability and reliability
- Design verification through prototyping and device test and characterization
- Tooling and fixturing requirements definition and design to support prototyping and volume production
- Supplier engagement to support prototyping and high volume production
Work within a multidisciplinary development team to provide a broad range of mechanical design solutions and analysis support to meet design specifications. Product types, include, but are not limited to:
- Telecommunications and datacom components/modules/subsystems (transceivers, lasers, detectors, modulators, optical receivers, amplifiers, flip chip BGA modules, etc).
- Sensing / lidar optical components/systems.
- Medical, biomedical, military etc components.
Coordinate activities within the multidisciplinary development team
Work with process and test engineering teams to ensure alignment of designs with process and test capabilities
Support new business development by interfacing with new customers to understand their requirements and defining proposals and quotations
Support new technology research and development as part of AMTs Technology Roadmap
Manage key technical elements of projects and their associated timelines in order to meet milestones on various customer projects.

Education & Experience

Minimum bachelors degree in Engineering
5+ years' experience in a product development role with a focus on transceiver design
AutoCAD/SolidWorks design experience with an understanding of FEA using Solidworks / Ansys or similar software tools
Experience in the design of RF/Microwave/Optical packages and multi-chip modules
Experience in optical and microelectronic technologies, materials, components, assembly and test processes
Experience in end-to-end product development, with product manufacturing implementation considered an asset
Experience with DFM and FMEA would be an asset
Ability to work well within a multidisciplinary development team in a fast-paced environment
Strong written and verbal communication skills are required

Other Information

The compensation range for this position is $100,000-150,000 annually.
This position is for an existing vacancy.
The hiring process for this position does not use Artificial Intelligence (AI).

Sanmina welcomes and encourages applications from persons with disabilities. In accordance with the guidelines established under the Accessibility for Ontarians with Disabilities Act (AODA), accommodations are available on request for candidates taking part in all aspects of the selection process.

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More about this job

Responsibilities

Design and integrate mechanical housings, PCB and flex-circuit packaging, fiber routing, and thermal solutions for high-speed optical modules, while supporting prototyping, verification, manufacturing, and supplier engagement. Coordinate with multidisciplinary, process, and test teams, manage technical project milestones, and contribute to customer proposals and technology development.

Requirements

Requires a bachelor's degree in engineering and at least five years of product development experience focused on transceiver design. Candidates should have AutoCAD or SolidWorks experience, familiarity with FEA tools, and experience with RF, microwave, or optical packages, multi-chip modules, and optical or microelectronic technologies.

Skills

Opto-Mechanical Design
Mechanical Design
Thermal Management
Optical Module Packaging
QSFP and OSFP Design
SolidWorks
AutoCAD
Finite Element Analysis
ANSYS
RF and Microwave Packaging
Multi-Chip Module Design
Optical and Microelectronic Technologies
Design for Manufacturability
Failure Mode and Effects Analysis
Product Development
Supplier Engagement

Visa sponsorship

Not detected in the job text

Keywords

Opto-Mechanical Engineering
High-Speed Optical Modules
QSFP
OSFP
Co-Packaged Optics
Thermal Management
Mechanical Housing Design
PCB Packaging
Flex Circuits
Optical Fiber Routing
Host System Integration
Design for Manufacturability
Prototyping
Device Testing
Characterization
Tooling and Fixturing
SolidWorks
AutoCAD
Finite Element Analysis
ANSYS
RF and Microwave Packages
Optical Packages
Multi-Chip Modules
Optical Transceivers
Microelectronics
Failure Mode and Effects Analysis
New Product Introduction
Volume Manufacturing
Lidar
Optical Interconnects

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