Senior Opto-Mechanical Design Engineer
- Ottawa, ON, Canada
The compensation range for this position is $100,000-150,000 annually. · Full-time
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Job details
- Pay
- The compensation range for this position is $100,000-150,000 annually.
- Job type
- Full-time
- Apply by
- Experience
- 5+ years' experience in a product development role with a focus on transceiver design
- Posting language
- English
- Posted
Original job description
Advanced Microsystems Technologies, AMT, is a technology division of Sanmina Corporation (Nasdaq: SANM), responsible for RF, Microelectronic, Optical components and Integrated Subsystems, providing services from design concept, through prototype design and testing, process development, assembly and test innovation, to volume manufacturing. We are extremely proud to partner with our customers enabling their product through the full product lifecycle.
At AMT, you will work on some of the most innovative programs and products that address emerging markets, including optical and RF communication, datacenter connectivity, quantum computing, automotive sensing systems, medical devices and diagnostics and test & measurement systems, to name a few.
Come and join us, and be part of a team that challenges you to be your best, where you will be empowered to make a difference and where we are extremely proud of what we deliver, together.
Job Purpose
The Senior Opto-Mechanical Design Engineer, as part of the larger product solutions development team, provides mechanical design support of product development, NPI, and manufacturing of a variety of different optical product families.
We are looking for an experienced Opto-Mechanical Engineer, with a strong background in mechanical design, and a clear focus on the physical design, thermal management and packaging of high-speed optical modules, in small form factors such as QSFP, OSFP, to support product design and analysis within a worldwide end-to-end product development team developing advanced Opto/microelectronic components, modules and sub-systems.
Nature Of Duties / Responsibilities
- Physical design, thermal management and packaging of high-speed optical modules, in small form factors such as QSFP, OSFP. Experience with CPO design approaches and architectures an asset. Responsibilities include:
- Mechanical housing subassembly design and module integration, PCB packaging and flex circuit integration, optical fiber routing and interconnects
- Host system integration considerations of pluggables: insertion/extraction forces, mating cycles, air vs liquid cooling
- Design for manufacturability, assembly and test to ensure high volume product viability and reliability
- Design verification through prototyping and device test and characterization
- Tooling and fixturing requirements definition and design to support prototyping and volume production
- Supplier engagement to support prototyping and high volume production
- Work within a multidisciplinary development team to provide a broad range of mechanical design solutions and analysis support to meet design specifications. Product types, include, but are not limited to:
- Telecommunications and datacom components/modules/subsystems (transceivers, lasers, detectors, modulators, optical receivers, amplifiers, flip chip BGA modules, etc).
- Sensing / lidar optical components/systems.
- Medical, biomedical, military etc components.
- Coordinate activities within the multidisciplinary development team
- Work with process and test engineering teams to ensure alignment of designs with process and test capabilities
- Support new business development by interfacing with new customers to understand their requirements and defining proposals and quotations
- Support new technology research and development as part of AMTs Technology Roadmap
- Manage key technical elements of projects and their associated timelines in order to meet milestones on various customer projects.
- Minimum bachelors degree in Engineering
- 5+ years' experience in a product development role with a focus on transceiver design
- AutoCAD/SolidWorks design experience with an understanding of FEA using Solidworks / Ansys or similar software tools
- Experience in the design of RF/Microwave/Optical packages and multi-chip modules
- Experience in optical and microelectronic technologies, materials, components, assembly and test processes
- Experience in end-to-end product development, with product manufacturing implementation considered an asset
- Experience with DFM and FMEA would be an asset
- Ability to work well within a multidisciplinary development team in a fast-paced environment
- Strong written and verbal communication skills are required
- The compensation range for this position is $100,000-150,000 annually.
- This position is for an existing vacancy.
- The hiring process for this position does not use Artificial Intelligence (AI).
More about this job
Responsibilities
Design and integrate mechanical housings, PCB and flex-circuit packaging, fiber routing, and thermal solutions for high-speed optical modules, while supporting prototyping, verification, manufacturing, and supplier engagement. Coordinate with multidisciplinary, process, and test teams, manage technical project milestones, and contribute to customer proposals and technology development.
Requirements
Requires a bachelor's degree in engineering and at least five years of product development experience focused on transceiver design. Candidates should have AutoCAD or SolidWorks experience, familiarity with FEA tools, and experience with RF, microwave, or optical packages, multi-chip modules, and optical or microelectronic technologies.
Skills
- Opto-Mechanical Design
- Mechanical Design
- Thermal Management
- Optical Module Packaging
- QSFP and OSFP Design
- SolidWorks
- AutoCAD
- Finite Element Analysis
- ANSYS
- RF and Microwave Packaging
- Multi-Chip Module Design
- Optical and Microelectronic Technologies
- Design for Manufacturability
- Failure Mode and Effects Analysis
- Product Development
- Supplier Engagement
Visa sponsorship
Not detected in the job text
Categories
- Engineering
- Manufacturing
- Technology
- Management & Leadership
Keywords
- Opto-Mechanical Engineering
- High-Speed Optical Modules
- QSFP
- OSFP
- Co-Packaged Optics
- Thermal Management
- Mechanical Housing Design
- PCB Packaging
- Flex Circuits
- Optical Fiber Routing
- Host System Integration
- Design for Manufacturability
- Prototyping
- Device Testing
- Characterization
- Tooling and Fixturing
- SolidWorks
- AutoCAD
- Finite Element Analysis
- ANSYS
- RF and Microwave Packages
- Optical Packages
- Multi-Chip Modules
- Optical Transceivers
- Microelectronics
- Failure Mode and Effects Analysis
- New Product Introduction
- Volume Manufacturing
- Lidar
- Optical Interconnects