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Added 2 hours ago
AMS Layout Engineer Intern - BS - 2027 Co-Op
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Added 8 hours ago
IC Packaging Design Intern
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Ottawa, ON
Full-time
As the Intern of the IC packaging design team, you will be involved with:
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Semtech

IC Packaging Design Intern

Ottawa, ON, Canada

Job type: Full-time
Apply by: Oct 24, 2026
Posting language: English
Posted: Sep 24, 2026

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Original job description

Location: Ottawa, ON

Our Team

Semtech’s Signal Integrity Products group designs high performance optical networking product platforms that enable hyperscale data center applications, enterprise networking, wireless infrastructure including 5G networks, and passive optical network/Fibre-to-the-X markets.

To put it simply, whenever you use your computer to browse the web or use your smartphone to make a video call, most likely, your data is passing through one of many high-speed component from Semtech. Our experience and expertise contribute to push the boundaries of networking speed, ensuring the best experience for our end users – you!

Join us, and together we will continue to build a faster, better, and more secure online world for everyone.

Job Summary

Our approach to internship is to make the successful candidate an integral part of our team. We understand that it is best to learn through direct involvement and we will provide you with tasks that enable you to learn and to be productive at the same time. The more you learn the more complex your tasks will become. The internship program is an important part of our recruiting strategy. This position is for a 12 – 16 month student IC packaging design internship at Semtech Canada with the Signal Integrity Products Group (SIP) in our Ottawa Design Centre

Responsibilities

As the Intern of the IC packaging design team, you will be involved with:

Design of IC chip carriers contained in either electronic components or pluggable modules
Using advanced CAD tools, support

circuit layout of mini-panels containing Semtech chips requiring a high density of high speed transmissions lines and sensitive power domains
physical assembly design and mechanical outlines

Support our signal integrity experts with layout generation to accelerate 3D electromagnetic simulations as well as thermo-mechanical analysis.
Semtech’s dynamic team environment and senior packaging engineers will provide mentoring and guidance throughout the internship term

Minimum Qualifications

Experience with advanced manufacturing in electronic would be a strong asset
Ability to learn quickly and work independently or in a team environment
Exposure to CAD tools would be an asset

Electrical card design tools (Cadence Allegro, Keysight ADS)
Mechanical design tools (Autocad, Draftsight, Solidworks)

Basic understanding of frequency analysis, and analog electronic circuit fundamentals would be an asset
Experience with tolerance analysis would be an asset
Enjoying team work
Desired start date May 2027, 12-16 month term

Career Growth Philosophy

At Semtech, we seek innovation and leadership from each and every member of our team. Our goal is to ensure that our talented professionals are equipped with support, resources, and the opportunity to excel. Our pay-for-performance philosophy provides recognition and prestige coupled with a competitive compensation package.

The intent of this job description is to describe the major duties and responsibilities performed by incumbents of this job. Incumbents may be required to perform job-related tasks other than those specifically included in this description.

All duties and responsibilities are essential job functions and requirements and are subject to possible modification to reasonably accommodate individuals with disabilities.

We may leverage Artificial Intelligence (AI) tools to enhance efficiency during candidate screening, assessment, and recruitment. Final hiring decisions remain with our Hiring Teams, not AI systems.

A reasonable estimate of the pay range for this position is $26 - $28.5 CAD. There are several factors taken into consideration in determining base salary, including but not limited to: job-related qualifications, skills, education and experience, as well as job location and the value of other elements of an employee’s total compensation package.

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More about this job

Responsibilities

Design IC chip carriers and use advanced CAD tools to support circuit layouts for mini-panels with high-speed transmission lines and sensitive power domains. Generate layouts to support 3D electromagnetic simulations and thermo-mechanical analysis, with guidance from senior packaging engineers.

Requirements

Candidates should learn quickly and be able to work independently and as part of a team; experience with advanced electronics manufacturing and CAD tools is an asset. Familiarity with electrical card design tools such as Cadence Allegro and Keysight ADS, mechanical design tools such as AutoCAD, DraftSight, and SolidWorks, frequency analysis, analog circuit fundamentals, and tolerance analysis is also an asset.

Skills

IC Packaging Design
Circuit Layout
CAD Tools
High-Speed Transmission Lines
Power Domain Design
Physical Assembly Design
Mechanical Outlines
3D Electromagnetic Simulation
Thermo-Mechanical Analysis
Frequency Analysis
Analog Electronics
Tolerance Analysis
Teamwork
Independent Work

Visa sponsorship

Not detected in the job text

Keywords

IC Packaging Design
IC Chip Carriers
Semiconductor Manufacturing
Signal Integrity
Circuit Layout
CAD Tools
Mini-Panels
High-Speed Transmission Lines
Power Domains
Physical Assembly Design
Mechanical Outlines
3D Electromagnetic Simulation
Thermo-Mechanical Analysis
Advanced Electronics Manufacturing
Cadence Allegro
Keysight ADS
AutoCAD
DraftSight
SolidWorks
Frequency Analysis
Analog Electronic Circuits
Tolerance Analysis
Optical Networking
Hyperscale Data Centers
5G Networks

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