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Added 11 mins ago
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Semtech

Jr. Product Engineer

Burlington, ON, Canada

Job type: Full-time
Apply by: Nov 1, 2026
Experience: 2+ years of experience in semiconductor product engineering, test engineering, or design engineering; internship or co-op experience in relevant fields considered
Posting language: English
Posted: Oct 2, 2026

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Original job description

Location: Burlington, Canada- Hybrid Mon- Thurs in office.

Semtech's New Product Introduction (NPI) Product Engineering Team is the central engineering function behind every new product we bring to market. Our team of focused and talented engineers takes full ownership of new product development - driving each program from conception through end-of-life with a commitment to flawless execution. Working closely with all internal cross-functional teams, our engineers define and drive DfT testability requirements, test coverage, production characterization (across process, voltage, and temperature variations), ATE-to-bench correlation, cost and yield optimization, test time reduction, project logistics, and seamless transfer to full-volume manufacturing. We take pride in delivering high-quality products that exceed customer expectations and drive business success - and our versatile, results-driven team makes it happen.

Job Summary

We are looking for a Junior NPI Product Engineer to join our team. This role supports new product development activities - from early-stage development through production transfer - working closely with senior engineers and cross-functional teams to build foundational skills and contribute to program success. This is an excellent opportunity for a motivated engineer eager to develop deep technical expertise in high-performance optical, analog/mixed-signal semiconductor IC products in cutting-edge CMOS and BiCMOS technologies. Reporting to the Manager of NPI Product Engineering, the Junior NPI Product Engineer will support NPI activities across the full product development cycle under the guidance of senior engineers.

Responsibilities

NPI Program Support & Cross-Functional Collaboration (25%)
Support NPI activities from product concept through final product release, assisting in ensuring product conformance to specifications and seamless transfer to full-volume manufacturing
Collaborate with internal cross-functional teams including Project Lead, Design, Marketing, Validation, Test Engineering, Characterization, Quality & Reliability, Applications Engineering and Operations under the direction of senior engineers
Track backend NPI development through production transfer, and participate in milestone reviews of NPI program logistics, timelines and milestones
Support preparation of NPI production release deliverables and OSAT-related manufacturing documentation, ensuring accuracy and completeness
Receive technical mentorship from senior engineers and actively develop technical skills and product knowledge
Design for Testability/Manufacturability (35%)
Support the definition of Design for Testability (DfT) and Design for Manufacturability (DfM) requirements for NPI products under the guidance of senior engineers
Work alongside test engineers in the development, implementation, verification and optimization of ATE test programs.
Support product characterization, correlation, and release activities, contributing to execution and adherence to product specifications and quality standards
Assist in finalizing datasheet specifications and ATE production test limits under senior engineer direction, gaining exposure to data-driven, statistically validated limit-setting processes
Characterization, Data Analysis & Yield Optimization (30%)
Develop product characterization plans for wafer-level and bench characterization tests, building understanding of test coverage requirements across product specifications and operating conditions
Perform data analysis of ATE and bench characterization results across PVT variations, including ATE-to-bench correlation studies and process capability analysis, with guidance from senior engineers
Support yield modeling activities to develop foundational understanding of yield and quality drivers
Assist in planning and executing Design of Experiments (DOE) to support yield analysis, test time reduction, and test optimization efforts
Support product validation and reliability qualification activities in collaboration with Test, Characterization, Validation and Reliability Engineering teams
Assist in identifying yield loss Pareto opportunities and contribute to implementing targeted solutions under senior engineer direction
Manufacturing Quality, Failure Analysis & Continuous Improvement (10%)
Assist in monitoring yields and quality metrics across processing steps, learning to identify trends and anomalies
Support review of test coverage, test limits, and guard banding under the guidance of senior engineers
Assist in failure analysis and root cause investigation activities for field returns and RMA cases, contributing to corrective and preventive action (CAPA) development
Support collaboration with foundry process and packaging engineering teams in resolving issues during wafer fabrication, packaging, die sort, and final package test
Contribute to product life cycle monitoring activities, learning to identify opportunities for cost reduction and continuous improvement

Minimum Qualifications

BS in Electrical Engineering or a related field (MS a plus)
2+ years of experience in semiconductor product engineering, test engineering, or design engineering; internship or co-op experience in relevant fields considered
Basic familiarity with statistical theory and data analysis tools (e.g. Excel, JMP) for data interpretation and reporting
Foundational knowledge of semiconductor physics and analog/mixed-signal IC design principles
Exposure to or coursework in DFM, DFT, and ATE test methodologies is a plus
Familiarity with high-speed digital ATE test platforms (e.g. Advantest, Teradyne) or bench test equipment is a plus
Basic awareness of semiconductor qualification processes and reliability testing methodologies (JEDEC, HTOL, ESD, Latch-up) is a plus
Strong analytical, problem-solving, and communication skills with a eagerness to learn in a fast-paced engineering environment

The intent of this job description is to describe the major duties and responsibilities performed by incumbents of this job. Incumbents may be required to perform job-related tasks other than those specifically included in this description.

All duties and responsibilities are essential job functions and requirements and are subject to possible modification to reasonably accommodate individuals with disabilities.

We may leverage Artificial Intelligence (AI) tools to enhance efficiency during candidate screening, assessment, and recruitment. Final hiring decisions remain with our Hiring Teams, not AI systems.

A reasonable estimate of the pay range for this position is $75,000 - $84,000 CAD. There are several factors taken into consideration in determining base salary, including but not limited to: job-related qualifications, skills, education and experience, as well as job location and the value of other elements of an employee’s total compensation package

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More about this job

Responsibilities

Support new product introduction from concept through production transfer, collaborating with cross-functional teams and assisting with program milestones and release documentation. Contribute to testability and manufacturability, product characterization, data analysis, yield optimization, quality monitoring, and failure analysis under senior engineers’ guidance.

Requirements

A bachelor’s degree in Electrical Engineering or a related field is required, with a master’s degree considered a plus. The role asks for at least two years of relevant semiconductor, test, or design engineering experience (including relevant internship or co-op experience), foundational semiconductor and analog/mixed-signal knowledge, and basic familiarity with statistical analysis tools.

Skills

New Product Introduction
Semiconductor Product Engineering
Design for Testability
Design for Manufacturability
ATE Test Program Development
Product Characterization
ATE-to-Bench Correlation
Statistical Data Analysis
Yield Optimization
Design of Experiments
Failure Analysis
Root Cause Investigation
Analog/Mixed-Signal IC Design
Semiconductor Physics
Reliability Qualification
Cross-Functional Collaboration

Visa sponsorship

Not detected in the job text

Keywords

New Product Introduction
Semiconductor Product Engineering
CMOS
BiCMOS
Analog/Mixed-Signal IC
Design for Testability
Design for Manufacturability
ATE
Advantest
Teradyne
Product Characterization
PVT Analysis
ATE-to-Bench Correlation
JMP
Excel
Statistical Analysis
Process Capability Analysis
Yield Modeling
Design of Experiments
Test Time Reduction
OSAT
JEDEC
HTOL
ESD
Latch-Up
Failure Analysis
Root Cause Analysis
CAPA
Wafer Fabrication
Die Sort

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