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Bilingual Intermediate Interior Designer
BGIS
Ottawa, Ontario
Full-time
The Bilingual Intermediate Interior Designer provides planning services to ensure optimal use of space and develops occupancy and logistical options to achieve client needs. They will…
Designer d'intérieurs intermédiaire (Bilingue)
BGIS
Ottawa, Ontario
Full-time
The Intermediate Interior Designer provides planning services to ensure optimal use of space and develops occupancy and logistical options to achieve client needs. They will develop design…
Principal Electrical Designer
Worley
Vancouver, BC
Full-time
Coordinate closely with other discipline leads and designers (piping, civil/structural, mechanical, instrumentation, and process) to ensure integrated, clash-free designs.
Principal Electrical Designer
Worley
Calgary, Alberta · Edmonton, Alberta
Full-time
Coordinate closely with other discipline leads and designers (piping, civil/structural, mechanical, instrumentation, and process) to ensure integrated, clash-free designs.
Intermediate Interior Designer - Future Opportunities
BGIS
Ottawa, Ontario
Full-time
The Intermediate Interior Designer provides planning services to ensure optimal use of space and develops occupancy and logistical options to achieve client needs. They will develop design…
Senior Interior Designer
BGIS
Toronto, ON
Full-time
The Senior Interior Designer provides planning services to ensure optimal use of space and develops occupancy and logistical options to achieve client needs. They will develop design…
Senior Interior Designer
BGIS
Toronto, ON
Full-time
The Senior Interior Designer provides planning services to ensure optimal use of space and develops occupancy and logistical options to achieve client needs. They will develop design…
Senior Interior Designer
BGIS
Toronto, ON
Full-time
The Senior Interior Designer provides planning services to ensure optimal use of space and develops occupancy and logistical options to achieve client needs. They will develop design…
Mid-Level Electrical Designer - Kiewit Power Engineering
Kiewit
Calgary, AB
Full-time
Mid-level role supporting EPC project design work for power generation projects. Designer are responsible for developing detailed raceway designs including cable tray and above ground…
Mid-Level Electrical Designer - Kiewit Power Engineering
Kiewit
Calgary, AB
Mid-level role supporting EPC project design work for power generation projects. Designer are responsible for developing detailed raceway designs including cable tray and above ground…
Electrical Engineer/FPGA Designer
Lumentum
Ottawa, Ontario
Full-time
Lumentum is seeking a talented and motivated Electrical Engineer/FPGA Designer to join our cutting-edge development team in Ottawa. The successful candidate will play a crucial role in…
E-plan Designer
Magna International
Brampton, ON
Full-time
· Ability to read and interpret electrical and mechanical drawings.
Principal Packaging Engineer
Semtech
Calgary, Alberta · Burlington, Ontario · Ottawa, Ontario · CAN - Ottawa, ON
Full-time
…will span 3D electrical signal integrity modeling, IC package layout, and cross-functional collaboration across design, manufacturing, quality, and reliability engineering…
Antenna Technician
Sinclair Technologies
Aurora, ON
45,000 to 60,000 CAD / year
Full-time
Sinclair Technologies, a division of Norsat International Inc., is a leading designer and manufacturer of antenna and RF signal conditioning products, systems, and coverage solutions.…
Antenna Technician
NORSAT INTERNATIONAL INC
Aurora, ON
45,000 to 60,000 CAD / year
Full-time
Sinclair Technologies, a division of Norsat International Inc., is a leading designer and manufacturer of antenna and RF signal conditioning products, systems, and coverage solutions.…
Piping Design Lead
Vista Projects
Calgary, Alberta
Full-time
Ability to work and collaborate within a multi-disciplinary team of engineers and designers including Process, Mechanical, Civil, Structural & Architectural, Electrical, Instrumentation &…
Industrial Engineer
JELD-WEN of Canada
Woodbridge, ON
Full-time
Draft and design layout of equipment, materials, and workspace to illustrate maximum efficiency, using drafting tools and computer
Industrial Engineer
Jeld-Wen Inc.
Woodbridge, ON
Draft and design layout of equipment, materials, and workspace to illustrate maximum efficiency, using drafting tools and computer

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Semtech

Principal Packaging Engineer

Calgary, AB, Canada
Burlington, ON, Canada
Ottawa, ON, Canada
CAN - Ottawa, ON, Canada

Full-time

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At a glance

Automatically prepared from the listing. Check the original description for the full requirements.

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Responsibilities

Lead the design and electrical characterization of advanced high-speed IC packages and Chip-On-Board solutions for datacenter connectivity. Perform 3D signal integrity modeling and collaborate with global manufacturing partners to drive products from concept through qualification.

Requirements

Requires a Bachelor's degree in Electrical or Physics Engineering with 8+ years of experience in IC package design or signal integrity. Proficiency in EDA tools like HFSS and ADS, and experience with RF measurement equipment is essential.

Experience

10+ years

Education

bachelor degree
postgraduate degree

Working hours

40 hours per week

Job type

Full-time

Work arrangement

On-site

Skills

IC Package Design
Signal Integrity Modeling
Power Integrity
3D Electrical Modeling
RF/SI Measurement
Transmission Line Theory
Keysight ADS
Cadence APD/SiP
Ansys HFSS
VNA
TDR
NPI Lifecycle
PCB Layout
High-Density Substrate Design
Optoelectronics Packaging
JEDEC JESD47H

Benefits

Competitive Compensation
Equity Participation

Minimum pay

US$150,000

Maximum pay

US$164,000

Pay currency

USD

Pay period

YEAR

Visa sponsorship

Not detected in the job text

Keywords

IC Packaging
Signal Integrity
Power Integrity
Datacenter Connectivity
S-parameters
TDR
VNA
2.5D Packaging
3D Packaging
Fan-Out
FOCOS
Silicon Bridge
Chip-On-Board
Optoelectronics
Photonic Integration
JEDEC
NPI
HFSS
Keysight ADS
Cadence APD
Transmission Line Theory
PDN Design
Crosstalk
Impedance Control
Return-Loss Optimization
Thermo-mechanical Simulation
Finite Element Analysis
Fabless Semiconductor
400G
800G

Original job description

Our Team

Semtech's Signal Integrity Products (SIP) Business Unit delivers high-performance mixed-signal ICs for the data communications and video broadcast industries - powering the interconnects that move data inside the world's largest hyperscaler data centers. Our Packaging Technology team sits at the heart of this mission, bridging the gap between silicon and system through world-class IC package design, signal integrity engineering, and close collaboration with a global network of advanced manufacturing partners.

You will be joining a highly integrated team of digital, analog, physical, and systems engineers who are passionate about solving hard problems at the intersection of speed, density, and reliability. If you thrive in a technically challenging, fast-moving environment where your work directly impacts next-generation Datacenter connectivity products - this is your team.

Job Summary

As a Principal Engineer in IC Package Design and Signal Integrity, you will lead the design and electrical characterization of advanced high-speed IC packages for Semtech's Datacenter connectivity product portfolio. Your primary responsibilities will span 3D electrical signal integrity modeling, IC package layout, and cross-functional collaboration across design, manufacturing, quality, and reliability engineering disciplines.

This role requires a deep understanding of high-speed transmission line behavior, advanced packaging architectures, and the full NPI lifecycle from concept through qualification. You will work closely with internal teams and external manufacturing partners, serving as a key technical authority on package-level signal and power integrity. The ideal candidate brings strong hands-on experience in EDA tooling, RF/SI measurement, and a track record of delivering complex package designs into high-volume production.

Responsibilities

Design high-speed IC packages and Chip-On-Board (COB) solutions to meet new product technical and financial requirements; develop robust solutions that achieve the highest levels of quality and reliability in fast-paced Datacenter connectivity environments.

Perform 3D signal integrity modeling at silicon, package, and system levels, including experimental validation via Scattering Parameter (S-parameter) and Time-Domain Reflectometer (TDR) measurements where required.

Prepare technical reports and application notes for internal teams and external customers/suppliers, covering Signal and Power Integrity (SI/PI), PCB layout guidance, and assembly process instructions.

Design and produce PCB and high-density substrate layouts for reliability qualification and electrical performance evaluation.

Serve as technical interface with manufacturing suppliers throughout new product introduction (NPI), package definition, and design phases; drive alignment between design intent and manufacturing capability.

Identify, evaluate, and launch projects with new strategic suppliers and emerging package technologies to advance Semtech's packaging roadmap.

Mentor junior packaging engineers and contribute to continuous improvement of design methodologies, tools, and workflows.

Minimum Qualifications

Bachelor's degree in Electrical Engineering, Physics Engineering, or a related field, with 8+ years of experience as an IC Package Design Engineer or Signal Integrity Engineer.
Deep expertise in high-speed transmission line theory, multi-domain power delivery network (PDN) design, and package-level signal integrity - including crosstalk, impedance control, and return-loss optimization.
Hands-on proficiency with industry-standard EDA tools: Keysight Advanced Design System (ADS), Cadence Advanced Package Designer (APD/SiP), and Ansys HFSS.
Demonstrated experience with RF/SI measurement equipment including Vector Network Analyzers (VNA) and Time-Domain Reflectometers (TDR).
Familiarity with multiple advanced packaging technologies: 2D, 2.5D, 3D, Fan-In, Fan-Out (FOCOS), high-density substrate, silicon bridge interconnects, and Chip-On-Board (COB).
Experience in optoelectronics package design or opto-electronic assembly is a strong asset.
Working knowledge of JEDEC specification JESD47H (Stress-Test-Driven Qualification of Integrated Circuits) and its design implications.
Proven ability to manage supplier relationships and drive technical alignment throughout NPI and package qualification phases.
Strong written and verbal communication skills, with the ability to produce high-quality technical documentation for both internal and customer-facing audiences.

Desired Qualifications

Master's degree or Ph.D. in Electrical Engineering, Physics, or a related discipline.
Experience with opto-electronic package assembly and photonic integration is highly desirable.
Background in Datacenter or high-speed communications product development (400G, 800G, 1.6T).
Familiarity with thermo-mechanical simulation tools and reliability engineering methodologies (e.g., finite element analysis for package stress modeling).
Experience working in a fabless semiconductor environment with global contract manufacturing partners.

Career Growth Philosophy

At Semtech, we seek innovation and leadership from each and every member of our team. Our goal is to ensure that our talented professionals are equipped with the support, resources, and opportunities they need to excel - both technically and professionally. Our pay-for-performance philosophy provides recognition and prestige coupled with a competitive compensation and benefits package, including equity participation. We invest in your growth because your success is our success.

The intent of this job description is to describe the major duties and responsibilities performed by incumbents of this job. Incumbents may be required to perform job-related tasks other than those specifically included in this description.

All duties and responsibilities are essential job functions and requirements and are subject to possible modification to reasonably accommodate individuals with disabilities.

We are proud to be an EEO employer M/F/D/V. We maintain a drug-free workplace.

We may leverage Artificial Intelligence (AI) tools to enhance efficiency during candidate screening, assessment, and recruitment. Final hiring decisions remain with our Hiring Teams, not AI systems.

A reasonable estimate of the pay range for this position is $150,000 - $164,000. There are several factors taken into consideration in determining base salary, including but not limited to: job-related qualifications, skills, education and experience, as well as job location and the value of other elements of an employee’s total compensation package.

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