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Added 7 mins ago
LC
Sr Process Specialist/Engineer
LNG Canada
Calgary, AB
- Full-time
Added 22 mins ago
IP
Operational Excellence Analyst
InterPro Pipe + Steel
Camrose, AB
- Full-time
Industrial or Manufacturing Engineer, Engineering Technologist, other engineering disciplines will be considered, bachelor’s degree in engineering, preferred
Added 22 mins ago
DC
Senior Mechanical Engineer
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Concord, ON · CAN - Concord - AB Sciex LP
- $111,000 to $135,000 CAD / year
- Full-time
Added 22 mins ago
ST
Aircraft Loads Engineer
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Remote, Canada
- Contract
- Remote
…range of operating conditions. The role is well suited to an engineer who enjoys technically demanding analysis, model-based problem solving, and contributing to engineering outcomes that…
Added 22 mins ago
SE
Mine Planning Engineer
Suncor Energy
Fort McMurray, AB · Fort Hills
- Full-time
Join our team as a Mine Engineer and play a key role in shaping short-range mine plans that drive safe, efficient, and compliant operations, from design and scheduling to tailings planning…
Added 22 mins ago
GF
Industrial Engineer
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Winnipeg, MB
- Full-time
The Class 3 Power Engineer is responsible for the safe, efficient operation, maintenance, and monitoring of refrigeration, heating, cooling, and utility systems that support food storage…
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Operational Excellence Analyst
InterPro Pipe + Steel
AB · Edmonton, AB
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Added 22 mins ago
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Workforce Authentication Engineer
Wissen Technology
Montreal, QC
- Full-time
…industries, including Banking, E-commerce, Telecom, Healthcare, Manufacturing, and Energy. We help clients build world-class products. We have offices in the US, India (Bangalore,…
Added 37 mins ago
Mechatronics Engineer – Robotics & Grasping
Apera AI Inc
Vancouver, BC
We're looking for an Intermediate Mechatronics Engineer to join our Robotics & Grasping team, the team that turns Apera's vision into products that pick and place on the factory floor and…
Added 52 mins ago
GF
Industrial Engineer
Gordon Food Service - Canada
Winnipeg, MB
- Full-time
The Class 3 Power Engineer is responsible for the safe, efficient operation, maintenance, and monitoring of refrigeration, heating, cooling, and utility systems that support food storage…
Added 52 mins ago
UO
Design Engineer
University of Alberta
Edmonton, AB
- Full-time
Reporting to the Technical Services Supervisor, the Design Engineer is responsible for working with Researchers and students to assist in developing designs and drawing packages for…
Added 1 hour ago
FM
Sustaining Engineer – R&D
FluidAI Medical
Kitchener, ON
- $65,000 to $80,000 CAD / year
…technical investigations, flag recurring issues, and work with R&D, Manufacturing, and Quality to put fixes in place that…
Added 1 hour ago
FM
Research and Development Engineer (Junior)
FluidAI Medical
Kitchener, ON
- $65,000 to $80,000 CAD / year
Support current clinical research and product manufacturing/development activities.
Added 1 hour ago
FM
Research and Development Engineer (Intermediate)
FluidAI Medical
Kitchener, ON
- $75,000 to $90,000 CAD / year
Own current clinical research and product manufacturing/development activities.
Added 1 hour ago
Sales Applications Engineer (HVAC)
Oxygen8 Solutions Inc
Vancouver, BC · Toronto, ON
Added 1 hour ago
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Junior Thermal Mechanical Engineer
Ecolab
Calgary, AB · CAN-Calgary Office Quarry Park
- Full-time
As a Junior Thermal Mechanical Engineer, you will support the design, development, and validation of liquid cooling products, including passive cold plates, coolant distribution manifolds,…
Added 1 hour ago
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Sales Applications Engineer (HVAC)
Oxygen8
Vancouver, BC
- Full-time
Added 1 hour ago
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GNSS Software Engineer
Hexagon
Calgary, AB
- Full-time
GNSS Software Engineer to join our team in Calgary, AB, Canada. Reporting to the
Added 1 hour ago
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Sales Applications Engineer (HVAC)
Oxygen8
Toronto, ON
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Added 1 hour ago
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Design Convergence Lead
SEGULA Technologies
Windsor, ON
- Full-time
…VISA (CANADIAN CITIZENSHIP)**The Design Convergence Lead (DCL) Engineer is responsible for establishing, developing, and enforcing component- and system-level dimensional control…
Added 1 hour ago
ML
Engineering Manager
Maple Leaf Foods Inc
London, ON
- $122,000 to $172,000 CAD / year
- Full-time
…initiatives support safe, reliable, efficient, and sustainable manufacturing while maintaining compliance with food safety, regulatory, environmental, and corporate…
Added 1 hour ago
ML
Reliability Engineer
Maple Leaf Foods Inc
ON · Hannon, ON
- $71,000 to $103,000 CAD / year
- Full-time
Reporting to the Reliability Manager, this position will be responsible for developing and improving manufacturing equipment and processes by the application of engineering principles with…
Added 1 hour ago
Technical Support Specialist
Beyond Energy Services & Technology
Calgary, AB
The Technical Support Engineer/Specialist will support internal teams across MPD Engineering, Equipment Design Engineering, Operations, and Software. Working with experienced subject matter…
Added 1 hour ago
Manager - Engineering, NGL
Wolf Midstream
Calgary, AB
Registration as a professional Engineer with APEGA
Added 1 hour ago
3
Quality Engineer II
3f003dc7-1976-44db-b5e0-0c1851def895
ON
- $65,000 to $85,000 CAD / year
- Full-time
Pursuit Aerospace is seeking a Quality Engineer that would be responsible for ensuring assigned products meet customer purchase orders, drawings, and specifications related to the…

Semtech

Senior Package Layout Engineer

Calgary, AB, Canada
Burlington, ON, Canada
Ottawa, ON, Canada
CAN - Ottawa, ON, Canada

Full-time

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Job details

Job type: Full-time
Experience: 5 years of layout experience in high-speed package and/or advanced PCB technologies.
Posting language: English
Posted: Oct 28, 2026

Original job description

Our Team

Semtech Corporation designs innovative semiconductor solutions and intellectual property cores for the world’s most advanced consumer connectivity and datacenter products. The Signal Integrity Products business unit’s R&D hardware design team is home to this role.

Job Summary

We are looking for a motivated Package and PCB Layout Engineer to join our R&D hardware design team. The successful candidate will become a key member of the design engineering community of the Signal Integrity Products business unit, contributing innovative high-speed designs across a variety of interconnect technologies.

Responsibilities

Depending on the candidate’s strengths and interests, responsibilities may include any of the following areas of focus:
Perform package design feasibility assessments for the signal integrity experts, in conjunction with the manufacturing and thermo-mechanical engineering teams.
Develop multi-layer substrate and carrier layouts to support 2D, 2.5D, and 3D IC configurations.
Develop wafer-level interconnect layouts using wafer redistribution layers and wafer reconstruction technologies.

Minimum Qualifications

Bachelor’s degree in engineering, physics, or another discipline relevant to the position.

5 years of layout experience in high-speed package and/or advanced PCB technologies.

Solid knowledge of high-speed layout and electronic design.

Advanced knowledge of EDA layout tools.

Familiarity with PCB layout, as well as mechanical, thermal, and optical design.

Understanding of RF, analog, and digital circuits.

Ability to work in parallel with several cross-functional internal teams, while coordinating with local and international suppliers.

Excellent written and oral communication skills, and the ability to work well with other team members.

Ability to work independently with little supervision in a fast-paced environment.

Desired Qualifications

Advanced knowledge of Cadence APD and Allegro.

Knowledge of AI design acceleration features in EDA layout tools.

Additional degrees or certifications in mechatronics, photonics, or electronics manufacturing.

Familiarity with a variety of interconnect configurations, including chip-on-board, wirebond, flip-chip, optical assembly, and high-speed connectors.

Familiarity with industry standards such as JEDEC and IPC.

Experience troubleshooting PCBs and systems.

High degree of creativity, determination, and innovation.

What Success Looks Like

First 3 months: Become familiar with Semtech’s design flows, EDA tools, and supplier ecosystem, and complete [a first layout or feasibility assessment] under guidance.

First 6 months: Independently own [number/type] package or PCB layouts from feasibility through release to fabrication, meeting schedule and design-rule requirements.

First 12 months: Become a go-to contributor for [2.5D/3D IC, wafer-level, or another technology] and support [number] tape-outs or product releases.

Semtech is an equal opportunity employer and values the diversity, knowledge, and expertise of its workforce. Success, Ethics, Respect, and Alignment are the foundational values of our business and guide our relationships with employees, shareholders, customers, and other stakeholders.

The intent of this job description is to describe the major duties and responsibilities performed by incumbents of this job. Incumbents may be required to perform job-related tasks other than those specifically included in this description.

All duties and responsibilities are essential job functions and requirements and are subject to possible modification to reasonably accommodate individuals with disabilities.

We may leverage Artificial Intelligence (AI) tools to enhance efficiency during candidate screening, assessment, and recruitment. Final hiring decisions remain with our Hiring Teams, not AI systems.

A reasonable estimate of the pay range for this position is $105,000-$122,000 CAD. There are several factors taken into consideration in determining base salary, including but not limited to: job-related qualifications, skills, education and experience, as well as job location and the value of other elements of an employee’s total compensation package.

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More about this job

Responsibilities

The role involves performing package design feasibility assessments and developing multi-layer substrate and carrier layouts for advanced IC configurations. The engineer will collaborate with cross-functional teams to support high-speed interconnect technologies and wafer-level layouts.

Requirements

Candidates must hold a bachelor's degree in engineering or physics and possess at least 5 years of experience in high-speed package or PCB layout. Proficiency in EDA layout tools and a solid understanding of RF, analog, and digital circuit design are essential.

Skills

Package design
PCB layout
High-speed design
EDA layout tools
Cadence APD
Allegro
Signal integrity
Substrate layout
Wafer-level interconnect
RF circuits
Analog circuits
Digital circuits
Thermal design
Mechanical design
JEDEC standards
IPC standards

Visa sponsorship

Not detected in the job text

Keywords

Semiconductor
Package Layout
PCB Layout
Signal Integrity
R&D
Hardware Design
2.5D IC
3D IC
Wafer Redistribution Layers
Cadence APD
Allegro
RF
Analog
Digital
JEDEC
IPC
Interconnect
Flip-chip
Wirebond
Mechatronics
Photonics
Electronics Manufacturing
Tape-outs
Feasibility Assessment
Thermo-mechanical Engineering

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