Archived listing. The details below describe a past opening.
MEMS Packaging Engineer
Sheba Microsystems is a Toronto-based high-technology company developing advanced MEMS-based micro-actuator solutions for high-performance camera applications. Our technology combines MEMS innovation, electronics, module assembly and precision manufacturing to enable next-generation imaging systems.
As Sheba Microsystems scales its industrialization, supplier network and customer delivery activities, we are looking for a MEMS Packaging Engineer to join our team.
This is a permanent, full-time position based at our Toronto, ON office.
Role and Responsibilities
· Develop, assemble, and evaluate MEMS packages and compact camera modules in accordance with engineering drawings, work instructions, specifications, and assembly procedures.
· Develop, optimize, and qualify MEMS packaging and assembly processes, including die attach, adhesive dispensing, wire bonding, lid sealing, and final assembly
· Investigate packaging, assembly, and reliability failures using structured root cause analysis and implement effective corrective and preventive actions.
· Applying various statistical methods to improve reproducibility and manufacturability through Failure Mode Effect Analysis (FMEA) , Control Plan and Gage R&R studies.
· Operating laboratory equipment according to SOPs, Manuals, Methods, and Risk Assessments
· You will test MEMS devices and the assembled products
· You will work with software engineers to calibrate and optimize the camera module.
· You will conduct dimensions measurements to ensure products are within the specification
· You will contribute to our product plans with ideas for new products and improvements.
· You will contribute to the business and technical plans, by helping to define all of our technical milestones.
Required Qualifications
· You have a Bachelor degree in Mechanical/Electrical Engineering or equivalent.
· 2+ years of experience in MEMS packaging, camera module assembly, or semiconductor packaging in a manufacturing environment.
· Hands-on experience with MEMS package assembly processes, including die attach, wire bonding, lid sealing, adhesive dispensing, and optical alignment.
· Experience investigating assembly, packaging, and reliability failures using structured root cause analysis and corrective actions
· Knowledge of package materials, adhesives, thermal management, stress control, contamination control, and clean manufacturing practices for MEMS devices
· You have an experience in validation, test, and characterization of compact camera module.
· You are familiar with 3D CAD software such as Fusion 360.
· Fluent verbal and written English language ability, including technical language.
Strong assets:
· Mandarin Chinese language skills.
· Previous experience in mass production of camera module assembly.
· Extensive experience in wirebonding process optimization.
· Familiarity with MEMS packaging/enclosures.
· Ability to travel frequently as required.
Interested candidates are encouraged to submit a complete résumé and cover letter to [email protected], clearly indicating the job title and reference ID.
