Jobs in Canada

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Added 14 mins ago
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Added 14 mins ago
Sr Staff Advanced Package Design Engineer - 18918
Synopsys
Mississauga, ON
…Intelligence, from self-driving cars to learning machines. We lead in chip design, verification, and IP integration, empowering the creation of high-performance silicon chips and software…
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Project Superintendent (Civil & Earthworks)
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- Full-time
Added 29 mins ago
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Global Head of Cloud Platform Engineering
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- Full-time
…technology recovery and cloud economics. You will build and lead a high-leverage global engineering function that operates a secure, resilient and economical cloud estate and provides…
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Functional Analyst
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- Full-time
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- Full-time
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Synopsys

Sr Staff Advanced Package Design Engineer - 18918

Mississauga, ON, Canada

Apply on synopsys.avature.net About employer

Applications open in a new tab.

Job details

Experience: Minimum of 10 years’ relevant experience in advanced package design, model extraction, and analysis.
Posting language: English
Posted: Sep 22, 2026

Original job description

Descriptions & Requirements

Job Description and Requirements

We Are:

At Synopsys, we drive the innovations that shape the way we live and connect. Our technology is central to the Era of Pervasive Intelligence, from self-driving cars to learning machines. We lead in chip design, verification, and IP integration, empowering the creation of high-performance silicon chips and software content. Join us to transform the future through continuous technological innovation.

You Are:

You are a seasoned hardware engineering professional with a passion for advanced silicon package design and a proven track record in delivering innovative solutions for complex semiconductor challenges. With more than a decade of hands-on experience in package and interposer design, you possess a deep understanding of the latest advancements in 3DIC and multi-physics analysis. Your expertise spans across multiple advanced packaging technologies, and you are enthusiastic about pushing the boundaries of what’s possible in high-performance, energy-efficient chip design.

You thrive in a collaborative and fast-paced environment, working seamlessly with multidisciplinary teams and customers to solve technical challenges creatively and efficiently. Your strong analytical skills, coupled with your ability to communicate complex technical concepts clearly, make you a trusted advisor and mentor within your team. You are comfortable working with industry-leading EDA tools and have a solid foundation in both Windows and Linux environments.

Your commitment to continuous learning and innovation drives you to stay updated with emerging trends and technologies. You approach every project with a can-do attitude and demonstrate adaptability, resilience, and a relentless pursuit of excellence. You are excited by the opportunity to make a significant impact at Synopsys, contributing to groundbreaking products that shape the future of technology.

What You’ll Be Doing:

Collaborating with cross-functional teams during early design stages to optimize and define SIPI (Signal Integrity/Power Integrity) performance requirements, including bump mapping and power estimation.
Designing and developing advanced silicon package solutions such as silicon interposers, RDL fanout packages, and silicon bridge packages.
Modeling and analyzing advanced package designs to ensure optimal electrical, thermal, and mechanical performance.
Representing Synopsys on business unit projects as a technical leader and subject matter expert in advanced packaging.
Resolving a wide range of design and integration issues using creative, data-driven approaches.
Supporting customer engagements in exploring and implementing advanced package solutions with Synopsys IPs.
Collaborating with global teams to share best practices and drive innovation in advanced packaging methodologies.

The Impact You Will Have:

Empowering Synopsys and its customers to deliver next-generation, high-performance silicon solutions.
Accelerating the adoption of advanced packaging technologies that enable new levels of integration and energy efficiency.
Enhancing the performance, reliability, and manufacturability of Synopsys IP test chip packages.
Driving technical excellence and innovation in business unit projects that define Synopsys’ leadership in the semiconductor industry.
Mentoring and guiding engineering peers, fostering a culture of knowledge sharing and continuous improvement.
Setting new industry standards for quality, performance, and innovation in advanced package design.
Building and strengthening customer relationships through expert support and collaboration.

What You’ll Need:

Bachelor’s degree in Electrical or Electronic Engineering (Master’s or PhD preferred).
Minimum of 10 years’ relevant experience in advanced package design, model extraction, and analysis.
Expert knowledge of advanced circuit and transmission line theory.
Hands-on experience with TSMC, Intel, Samsung, or OSAT advanced package technologies.
Proficiency in multi-physics analysis (EMIR, Thermal, Thermal-Mechanical, Electromagnetic, etc.).
Familiarity with both Windows and Linux operating systems.
Experience with industry-standard EDA tools such as Cadence APD, Innovus, Integrity-3DIC, Synopsys ICC2, 3DIC Compiler, and Fusion Compiler.

Who You Are:

A creative problem solver with strong analytical and critical thinking skills.
An excellent communicator, able to explain technical concepts to diverse audiences.
A collaborative team player who values inclusivity, diversity, and shared success.
Adaptable, quick to learn, and enthusiastic about adopting new technologies and methodologies.
Detail-oriented, quality-driven, and committed to continuous improvement and innovation.
Self-motivated with a strong sense of ownership and accountability.

The Team You’ll Be A Part Of:

Join a global, highly skilled, and supportive team dedicated to advancing the forefront of package design and integration. Our team works closely with R&D, product management, and customer engineering groups to foster innovation, technical excellence, and open communication. Together, we tackle some of the most complex challenges in the semiconductor industry, supporting each other’s growth and celebrating our collective achievements.

Rewards and Benefits:

We offer a comprehensive range of health, wellness, and financial benefits to cater to your needs. Our total rewards include both monetary and non-monetary offerings. Your recruiter will provide more details about the salary range and benefits during the hiring process.

Synopsys Canada ULC values the diversity of our workforce. We are committed to provide access & opportunity to individuals with disabilities and will provide reasonable accommodation to individuals throughout the recruitment and employment process. Should you require an accommodation, please contact hr-help-canada@synopsys.com.

General Information

Job Title

Sr Staff Advanced Package Design Engineer - 18918

Job ID

18918

Country

Canada

City

Mississauga

State/Province

Mississauga

Date Posted

22-Sep-2026

Job Category

Engineering

Job Subcategory

Analog Design

Hire Type

Employee

Remote Eligible

Apply on synopsys.avature.net About employer

More about this job

Responsibilities

Collaborate with cross-functional teams to define and optimize advanced silicon package solutions including SIPI performance requirements. Represent the business unit as a technical leader while mentoring peers and supporting customer engagements.

Requirements

Requires a Bachelor's degree in Electrical or Electronic Engineering and at least 10 years of experience in advanced package design. Candidates must possess expert knowledge of circuit theory and proficiency in industry-standard EDA tools and multi-physics analysis.

Skills

Advanced package design
3DIC
Multi-physics analysis
Signal integrity
Power integrity
Silicon interposers
RDL fanout packages
Silicon bridge packages
EDA tools
Cadence APD
Innovus
Integrity-3DIC
Synopsys ICC2
3DIC Compiler
Fusion Compiler
Transmission line theory

Benefits

Health benefits
Wellness benefits
Financial benefits

Visa sponsorship

Not detected in the job text

Keywords

Advanced packaging
Silicon interposers
RDL fanout
Silicon bridge
3DIC
Signal integrity
Power integrity
Multi-physics analysis
EMIR
Thermal analysis
Electromagnetic analysis
EDA tools
Cadence APD
Innovus
Integrity-3DIC
Synopsys ICC2
3DIC Compiler
Fusion Compiler
Semiconductor
Hardware engineering
Transmission line theory
Bump mapping
Power estimation
Linux
Windows
Technical leadership
Mentoring
Cross-functional collaboration
IP integration
Chip design

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Jobs in Canada