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TechInsights

Technical Fellow, Advanced Packaging Integration

Ottawa, ON, Canada

Expected salary range: $175,000 - $195,000 CAD · Full-time

Apply on techinsights.applytojob.com About employer

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Job details

Pay: Expected salary range: $175,000 - $195,000 CAD
Job type: Full-time
Apply by: Feb 9, 2027
Experience: A recognized expert in semiconductor packaging, interconnect, or processor design, with 10+ years of relevant industry experience.
Posting language: English
Posted: Nov 11, 2026

Original job description

OUR STORY

TechInsights is the information Platform for the semiconductor industry.

Regarded as the most trusted source of actionable, in-depth intelligence related to semiconductor innovation and surrounding markets, TechInsights’ content informs decision makers and professionals whose success depends on accurate knowledge of the semiconductor industry - past, present, or future.

Over 650 companies and 150,000 users access the TechInsights Platform, the world’s largest vertically integrated collection of unmatched reverse engineering, teardown, and market analysis in the semiconductor industry. This collection includes detailed circuit analysis, imagery, semiconductor process flows, device teardowns, illustrations, costing and pricing information, forecasts, market analysis, and expert commentary. TechInsights’ customers include the most successful technology companies who rely on TechInsights’ analysis to make informed business, design, and product decisions faster and with greater confidence. For more information, visit www.techinsights.com.

WHY WORK WITH US

Company-sponsored training and development opportunities
Comprehensive benefits package (health, dental, vision, wellness, RRSP/401K Matching, annual fitness reimbursement)
Flexible vacation policy
Trusted device reimbursement program
Community involvement opportunities through charitable alliances: https://www.techinsights.com/community-involvement
Wellness resources and support
Inclusive environment that prioritizes diversity, equity, and accessibility
High-growth company driven by high performance
Expected salary range: $175,000 - $195,000 CAD

THE OPPORTUNITY:

At TechInsights, we decode technology to reveal the innovations shaping our world. As the Technical Fellow, Advanced Packaging Integration, you’ll be a central figure in that mission, a recognized technical authority who bridges advanced packaging, processor architecture, and system-level performance.

This is a rare opportunity to shape the technical direction of two of TechInsights’ most dynamic product areas: Advanced Packaging and High Performance Computing. You will bring deep expertise in advanced packaging and interconnect innovation, from hybrid bonding to co-packaged optics (CPO) and extend that insight up the stack to processors, networking silicon, and full system integration.
Your leadership will help define how TechInsights connects device-level architecture to system-level performance, setting the foundation for next-generation compute analysis across the data center ecosystem.

WHAT YOU’LL DO

Lead with Technical Authority

Serve as TechInsights’ subject matter expert across advanced packaging, HPC processors, networking ASICs, and memory integration..
Provide authoritative insights on leading-edge and emerging packaging and system integration technologies, including:
- 2.5D/3D integration, hybrid bonding, fan-out, glass core substrates, and embedded passives.
- Co-packaged optics, chip-to-chip optical engines, and photonic-electronic IC integration (PIC + EIC).
- Hybrid bonded chiplet stacks, SRAM chiplets, and next-generation thermal and power delivery innovations.

Own and Evolve Technology Roadmaps

Shape and maintain TechInsights’ Advanced Packaging and HPC technology roadmaps, aligning analysis coverage with industry trends and customer value.
Identify and prioritize parts and systems for analysis across processors, accelerators, and networking platforms to capture market-defining innovations.
Help drive product evolution toward system-level analysis, including server performance testing, interconnect and power delivery characterization, and thermal benchmarking.

Accelerate Content Creation through AI and Innovation

Leverage AI-enabled tools and data workflows to increase the speed, accuracy, and scalability of analysis.
Create and apply new techniques that connect process flow, packaging design, and system performance metrics.
Assertively drive content velocity and analytical quality across teams.

Engage Globally and Lead by Influence

Represent TechInsights worldwide to present at conferences, lead customer technical discussions, and publish thought leadership that positions TechInsights at the forefront of semiconductor intelligence.
Mentor analysts, shape analytical methods, and foster cross-domain collaboration between packaging, logic, memory, and system analysis teams.
Travel internationally to meet with hyperscalers, foundries, fabless companies, and system manufacturers.

WHAT YOU’LL BRING

A recognized expert in semiconductor packaging, interconnect, or processor design, with 10+ years of relevant industry experience.
Master’s or PhD in Nanotechnology, Electrical Engineering, Materials Science, Applied Physics, or equivalent field experience.
Adept at connecting materials, process, and architecture to system-level performance in HPC or networking applications.
Deeply familiar with one or more of the following domains:
- Advanced packaging and assembly processes (TSVs, interposers, hybrid bonding, fan-out, glass core, embedded passives).
- Processor and chiplet architecture (CPU, GPU, DPU, TPU, FPGA, ASIC).
- System-level power, thermal, and performance analysis.
Demonstrated success applying AI and automation tools to accelerate technical content or workflow efficiency.
An effective communicator and storyteller comfortable engaging with engineers, executives, and customers alike.
Motivated by curiosity, collaboration, and a desire to define what comes next in semiconductor analysis.
Willing to travel globally (up to 25%) to build relationships and represent TechInsights at technical and industry events.

As part of the recruitment process for this position, you will be required to submit your latest citizenship and/or permanent residency information. This information will be used to comply with U.S. Export Control Laws and Regulations.

WORKING ARRANGEMENT

This role is on-site at our Ottawa office. Travel may be required up to 25% of the time.

Technology knows no bounds, and neither does TechInsights. Bringing together talented humans from different perspectives, backgrounds and abilities is something we take seriously. We’re committed to building an inclusive environment that welcomes you to be your authentic self and allows us to push past the boundaries together.

TechInsights is committed to meeting the needs of people with disabilities. Accommodations are available on request for candidates taking part in all aspects of the selection process.

AI technology may be used to assist in the screening and assessment of applications for this position. Our recruiters are involved at every stage, and all hiring decisions are made by People and hiring teams.

As part of any recruitment process, TechInsights collects and processes personal data relating to job applicants. We are committed to being transparent about how we collect and use that data and to meeting our data protection obligations. Our Privacy policy can be referenced here: https://www.techinsights.com/privacy-policy

Apply on techinsights.applytojob.com About employer

More about this job

Responsibilities

The Technical Fellow will serve as the subject matter expert for advanced packaging and high-performance computing, shaping technology roadmaps and analytical methods. They will lead global technical engagement, mentor analysts, and leverage AI-driven workflows to accelerate content creation and system-level analysis.

Requirements

Candidates must have 10+ years of industry experience in semiconductor packaging, interconnect, or processor design. A Master’s or PhD in Nanotechnology, Electrical Engineering, Materials Science, or Applied Physics is required.

Skills

Advanced packaging
Semiconductor industry
HPC processors
Networking ASICs
Memory integration
Hybrid bonding
System-level performance
Technical leadership
AI-enabled tools
Data workflows
Thermal benchmarking
Power delivery characterization
Interconnect innovation
System integration
Technical communication

Benefits

Health insurance
Dental insurance
Vision insurance
Wellness resources
RRSP/401K matching
Annual fitness reimbursement
Flexible vacation policy
Trusted device reimbursement program
Company-sponsored training and development

Visa sponsorship

Not detected in the job text

Keywords

Semiconductor
Advanced Packaging
HPC
Hybrid Bonding
2.5D/3D Integration
Co-packaged Optics
Chiplets
ASIC
FPGA
GPU
CPU
Thermal Analysis
Power Delivery
System Integration
Reverse Engineering
Data Center
Nanotechnology
Electrical Engineering
Materials Science
Applied Physics
AI
Automation
Interconnect
Photonic-electronic IC
Glass Core Substrates
Embedded Passives
Semiconductor Intelligence
Technical Roadmaps
Market Analysis
Device Teardowns

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Jobs in Canada