Hardware Technical Leader
- Waterloo, ON, Canada
- Canada - Waterloo, ON, Canada
$93,700.00-$124,900.000 · Full-time
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Job details
- Pay
- $93,700.00-$124,900.000
- Job type
- Full-time
- Education
- Bachelor’s degree
- Experience
- Required: Bachelor’s degree in electrical engineering or related discipline and typically 12+ years of relevant experience.
- Posting language
- English
- Posted
Original job description
Be visionary
Teledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability. These markets include aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging and pharmaceutical research.
We are looking for individuals who thrive on making an impact and want the excitement of being on a team that wins.
Job Description
Teledyne Digital Imaging is a subsidiary of Teledyne Technologies Inc., a U.S. publicly listed enterprise, and specializes in the manufacture, design, research and development of high-performance CMOS and CCD image sensors and modular expandable cameras. Teledyne Digital Imaging's products are used worldwide in high-speed machine vision, document scanning, image capture, surveillance, process monitoring, manufacturing inspection, medical imaging, and multimedia.
Teledyne Digital Imaging is looking for a Hardware Technical Leader to help shape the electronics behind next-generation machine vision camera platforms. This is an opportunity to work at the intersection of advanced electronics, high-speed imaging, and real-world product performance.
If you enjoy solving difficult technical problems, setting architectural direction, and helping engineering teams turn ambitious ideas into robust products, this role offers the chance to make an impact across multiple platforms and programs.
What you’ll do
- Set technical direction for electronics architectures across machine vision camera platforms.
- Architect board-level solutions that improve performance, scalability, reliability, and product longevity.
- Lead resolution of complex analog, digital, mixed-signal, power, and high-speed design challenges.
- Establish design methodologies and engineering standards across teams.
- Guide critical trade-offs involving performance, cost, manufacturability, and business needs.
- Serve as a technical authority for design, production, and customer-impacting challenges.
- Influence product roadmaps and future technology choices.
- Mentor engineers and strengthen technical capability across multidisciplinary teams.
What you need
- Required: Expert-level analog, digital, mixed-signal, power, and high-speed electronics design skills.
- Required: Deep knowledge of PCB architecture, signal integrity, power integrity, and system integration.
- Required: Experience with ADCs/DACs, SMPS/LDOs, op-amps, FPGAs, microcontrollers, fiber optics, and high-speed interfaces.
- Required: Demonstrated ability to lead, influence, and mentor multidisciplinary engineering teams.
- Required: Proven experience driving complex projects, architectural decisions, and technical innovation.
- Required: Strong technical communication, proposal development, and stakeholder presentation skills.
- Required: Bachelor’s degree in electrical engineering or related discipline and typically 12+ years of relevant experience.
- Advantage: Master’s or PhD in Electrical Engineering.
What we offer
- Work on sophisticated imaging technologies with real-world applications.
- Deep technical challenges spanning electronics, imaging, and system integration.
- Opportunities to collaborate across engineering disciplines and business functions.
- An environment where technical leadership and innovation have meaningful product impact.
- Opportunities to mentor others while continuing to grow your own technical depth.
What happens next
After you apply, the recruiting team will review your experience against the role. Selected candidates may progress through a recruiter screen followed by interviews with the hiring and engineering teams. Timelines may vary.
Teledyne is committed to attracting talented people who want to solve challenging technical problems and contribute to impactful technologies.
Salary Range:
$93,700.00-$124,900.000The anticipated salary range listed for this role is only an estimate. Actual compensation for successful candidates is carefully determined based on several factors including, but not limited to, location, local regulations (such as minimum wage), education/training, work experience, key skills, and type of position.
Teledyne and all of our employees are committed to conducting business with the highest ethical standards. We require all employees to comply with all applicable laws, regulations, rules and regulatory orders. Our reputation for honesty, integrity and high ethics is as important to us as our reputation for making innovative sensing solutions.
More about this job
Responsibilities
The Hardware Technical Leader will set the technical direction for electronics architectures across machine vision camera platforms and lead the resolution of complex design challenges. They will also mentor multidisciplinary engineering teams and establish engineering standards to ensure high-performance product development.
Requirements
Candidates must possess expert-level skills in analog, digital, and high-speed electronics design along with deep knowledge of PCB architecture and system integration. A bachelor's degree in electrical engineering and at least 12 years of relevant experience are required for this role.
Skills
- Analog design
- Digital design
- Mixed-signal design
- Power electronics
- High-speed design
- PCB architecture
- Signal integrity
- Power integrity
- System integration
- FPGA
- Microcontrollers
- Fiber optics
- Technical leadership
- Mentoring
- Engineering standards
- Product architecture
Visa sponsorship
Not detected in the job text
Categories
- Engineering
- Technology
- Management & Leadership
- Manufacturing
Keywords
- Hardware Technical Leader
- Machine vision
- CMOS
- CCD
- Image sensors
- Electronics design
- PCB
- Signal integrity
- Power integrity
- ADC
- DAC
- SMPS
- LDO
- Op-amps
- FPGA
- Microcontrollers
- Fiber optics
- System integration
- Product roadmap
- Engineering standards
- Multidisciplinary teams
- Technical innovation
- Aerospace
- Defense
- Manufacturing
- Medical imaging
- Teledyne Digital Imaging
- Architecture
- Hardware engineering
- Technical leadership