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Teledyne Technologies Incorporated

Hardware Technical Leader

Waterloo, ON, Canada
Canada - Waterloo, ON, Canada

$93,700.00-$124,900.000 · Full-time

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Job details

Pay: $93,700.00-$124,900.000
Job type: Full-time
Education: Bachelor’s degree
Experience: Required: Bachelor’s degree in electrical engineering or related discipline and typically 12+ years of relevant experience.
Posting language: English
Posted: Nov 3, 2026

Original job description

Be visionary

Teledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability. These markets include aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging and pharmaceutical research.

We are looking for individuals who thrive on making an impact and want the excitement of being on a team that wins.

Job Description

Teledyne Digital Imaging is a subsidiary of Teledyne Technologies Inc., a U.S. publicly listed enterprise, and specializes in the manufacture, design, research and development of high-performance CMOS and CCD image sensors and modular expandable cameras. Teledyne Digital Imaging's products are used worldwide in high-speed machine vision, document scanning, image capture, surveillance, process monitoring, manufacturing inspection, medical imaging, and multimedia.

Teledyne Digital Imaging is looking for a Hardware Technical Leader to help shape the electronics behind next-generation machine vision camera platforms. This is an opportunity to work at the intersection of advanced electronics, high-speed imaging, and real-world product performance.

If you enjoy solving difficult technical problems, setting architectural direction, and helping engineering teams turn ambitious ideas into robust products, this role offers the chance to make an impact across multiple platforms and programs.

What you’ll do

Set technical direction for electronics architectures across machine vision camera platforms.
Architect board-level solutions that improve performance, scalability, reliability, and product longevity.
Lead resolution of complex analog, digital, mixed-signal, power, and high-speed design challenges.
Establish design methodologies and engineering standards across teams.
Guide critical trade-offs involving performance, cost, manufacturability, and business needs.
Serve as a technical authority for design, production, and customer-impacting challenges.
Influence product roadmaps and future technology choices.
Mentor engineers and strengthen technical capability across multidisciplinary teams.

What you need

Required: Expert-level analog, digital, mixed-signal, power, and high-speed electronics design skills.
Required: Deep knowledge of PCB architecture, signal integrity, power integrity, and system integration.
Required: Experience with ADCs/DACs, SMPS/LDOs, op-amps, FPGAs, microcontrollers, fiber optics, and high-speed interfaces.
Required: Demonstrated ability to lead, influence, and mentor multidisciplinary engineering teams.
Required: Proven experience driving complex projects, architectural decisions, and technical innovation.
Required: Strong technical communication, proposal development, and stakeholder presentation skills.
Required: Bachelor’s degree in electrical engineering or related discipline and typically 12+ years of relevant experience.
Advantage: Master’s or PhD in Electrical Engineering.

What we offer

Work on sophisticated imaging technologies with real-world applications.
Deep technical challenges spanning electronics, imaging, and system integration.
Opportunities to collaborate across engineering disciplines and business functions.
An environment where technical leadership and innovation have meaningful product impact.
Opportunities to mentor others while continuing to grow your own technical depth.

What happens next

After you apply, the recruiting team will review your experience against the role. Selected candidates may progress through a recruiter screen followed by interviews with the hiring and engineering teams. Timelines may vary.

Teledyne is committed to attracting talented people who want to solve challenging technical problems and contribute to impactful technologies.

Salary Range:

$93,700.00-$124,900.000

The anticipated salary range listed for this role is only an estimate. Actual compensation for successful candidates is carefully determined based on several factors including, but not limited to, location, local regulations (such as minimum wage), education/training, work experience, key skills, and type of position.

Teledyne and all of our employees are committed to conducting business with the highest ethical standards. We require all employees to comply with all applicable laws, regulations, rules and regulatory orders. Our reputation for honesty, integrity and high ethics is as important to us as our reputation for making innovative sensing solutions.

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More about this job

Responsibilities

The Hardware Technical Leader will set the technical direction for electronics architectures across machine vision camera platforms and lead the resolution of complex design challenges. They will also mentor multidisciplinary engineering teams and establish engineering standards to ensure high-performance product development.

Requirements

Candidates must possess expert-level skills in analog, digital, and high-speed electronics design along with deep knowledge of PCB architecture and system integration. A bachelor's degree in electrical engineering and at least 12 years of relevant experience are required for this role.

Skills

Analog design
Digital design
Mixed-signal design
Power electronics
High-speed design
PCB architecture
Signal integrity
Power integrity
System integration
FPGA
Microcontrollers
Fiber optics
Technical leadership
Mentoring
Engineering standards
Product architecture

Visa sponsorship

Not detected in the job text

Keywords

Hardware Technical Leader
Machine vision
CMOS
CCD
Image sensors
Electronics design
PCB
Signal integrity
Power integrity
ADC
DAC
SMPS
LDO
Op-amps
FPGA
Microcontrollers
Fiber optics
System integration
Product roadmap
Engineering standards
Multidisciplinary teams
Technical innovation
Aerospace
Defense
Manufacturing
Medical imaging
Teledyne Digital Imaging
Architecture
Hardware engineering
Technical leadership

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