Jobs in Ottawa, ON and nearby (18,716 jobs)

Jobs within 25 km of Ottawa, ON, Canada. Nearby towns and cities are included. Distances are straight-line, not driving distances.

18,716 listings · 2,584 employers Counted Nov 11, 2026. How we count

About these jobs

Employers hiring include University of Ottawa (1,737 listings), Loblaw Companies Limited (524 listings), Shoppers Drug Mart (391 listings).

Common roles: Retail sales associate, Project manager, Sales representative.

2,569 of these listings include employer-provided pay. Open a job to see its currency and pay period.

Advertised starting pay
Pay period	Median starting pay	Listings
CAD / hour	21.00	1,277
CAD / year	81,600.00	1,211

Employer-listed minimums from at least 10 listings per currency and pay period. These are advertised starting amounts, not employee salaries. Jobs without a minimum and unusual amounts are excluded.

Workplace classifications: 0% remote, 18% hybrid, 82% on-site, 0% not specified. Hybrid and on-site classifications may be inferred from descriptions. Check the original ad.

Based on the dated count above. Listings can change. How we count

Jobs in Ottawa, ON and nearby

Within 25 km

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Added 3 mins ago
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Staff AI Systems Thermal Engineer
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Broadcom

Staff AI Systems Thermal Engineer

Ottawa, ON, Canada

Full-time

Apply on LinkedIn About employer

Applications open in a new tab.

Job details

Job type: Full-time
Apply by: Dec 11, 2026
Experience: Experience: Bachelors plus 8+ years of experience or Masters plus 6+ years of experience.
Posting language: English
Posted: Nov 11, 2026

Original job description

Job Description:

We are looking for an experienced AI Systems Thermal Engineer to lead the end-to-end thermal design, simulation, optimization, and physical validation of Direct-to-Chip (D2C) liquid cooling solutions for next-generation AI accelerators and high-density compute platforms.

In this role, you will own the thermal-hydraulic performance of custom cold plates, interface materials, and fluid delivery subsystems - ensuring our high-power ASICs operate within safe thermal limits at peak workloads. You will collaborate closely with silicon package designers, board layout teams, mechanical housing engineers, and manufacturing partners from concept through mass production.

Key Responsibilities:

Thermal & CFD Modeling: Build and run detailed Computational Fluid Dynamics (CFD) and thermal-resistance network models to evaluate temperature distribution, pressure drop, and flow balancing across cold plates, trays, and racks.
Advanced Technology Implementation: Research advanced cooling technologies and develop integration and test plans to validate these technologies and convert them into production solutions.
Cold Plate Design & Optimization: Co-design high-performance liquid cold plates with strategic industry partners to cool high-heat-flux AI processors.
Thermal Interface Materials (TIM): Specify, select, and qualify thermal interface materials for large, high warpage, devices to minimize contact resistance between silicon dies and cold plates on large devices
System & Hydraulic Integration: Design coolant flow paths, quick-disconnects (QDs), hoses, and cold-plate retention/loading mechanisms in alignment with server chassis and OCP (Open Compute Project) standards.
Lab Validation & Testing: Plan and execute physical thermal testing in the lab - including thermocouple instrumentation, pressure/flow mapping, thermal test vehicle (TTV) bring-up, and simulation-to-test correlation.
Cross-Functional Collaboration: Partner with mechanical, electrical, firmware (thermal control algorithms), and supply chain teams to drive PCBA, tray and system level designs from NPI (New Product Introduction) to high-volume manufacturing.

Qualifications & Requirements:

Education: Bachelor’s or Master’s degree in Mechanical or Thermal Engineering (M.S. preferred), or equivalent.
Experience: Bachelors plus 8+ years of experience or Masters plus 6+ years of experience. Hands-on experience in thermal/mechanical design for high-power electronics, AI hardware, servers, or HPC systems.
Proven, direct experience designing and deploying Direct Liquid Cooling (DLC) systems, specifically liquid cold plates, coolant distribution units (CDUs), and manifold loops.

Technical Skills:

Electronics Cooling: Deep understanding of single-phase and/or two-phase heat transfer, fluid dynamics, pressure drop calculations, and electronics packaging interactions. Experience with air cooled systems also an asset.
Simulation Tools: High proficiency in CFD and thermal analysis software (preferably Flotherm, FloEFD, and MacroFlow.).
Lab Instrumentation: Experience with thermal data acquisition systems, flow meters, pressure transducers, and lab automation (Python, MATLAB, or LabVIEW).
CAD & Mechanical Design: Experience with electronics packaging and CAD platforms, preferably CREO, an asset.

Compensation And Benefits

The annual base salary range for this position is USD To USD

As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.

Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, RRSP participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company-paid holidays; and paid sick leave and vacation time. The company follows all applicable laws for leaves of absence.

R027822

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More about this job

Responsibilities

Lead thermal design, simulation, optimization, and physical validation of direct-to-chip liquid cooling systems for AI accelerators and high-density compute platforms. Develop cold plates and coolant delivery subsystems, validate performance through laboratory testing, and collaborate across engineering and manufacturing teams from concept through mass production.

Requirements

Requires a bachelor's degree or master's degree in mechanical or thermal engineering, or equivalent, with at least 8 years of experience for bachelor's graduates or 6 years for master's graduates. Candidates should have hands-on experience with high-power electronics or AI/server hardware, direct liquid cooling systems, CFD and thermal analysis tools, laboratory instrumentation, and mechanical CAD.

Skills

Thermal Engineering
Computational Fluid Dynamics
Thermal Modeling
Direct Liquid Cooling
Cold Plate Design
Thermal Interface Materials
Fluid Dynamics
Pressure Drop Analysis
Thermal Testing
Lab Instrumentation
Thermal Data Acquisition
Flow and Pressure Mapping
Simulation-to-Test Correlation
Electronics Cooling
CAD
Python

Benefits

Medical Insurance
Dental Insurance
Vision Insurance
RRSP With Company Matching
Employee Stock Purchase Program
Employee Assistance Program
Company-Paid Holidays
Paid Sick Leave
Paid Vacation
Discretionary Annual Bonus
Equity Awards

Visa sponsorship

Not detected in the job text

Keywords

Direct-to-Chip Cooling
Direct Liquid Cooling
Computational Fluid Dynamics
Thermal-Resistance Networks
Cold Plates
Thermal Interface Materials
Coolant Distribution Units
Manifold Loops
Single-Phase Heat Transfer
Two-Phase Heat Transfer
Pressure Drop
Flow Balancing
Flotherm
FloEFD
MacroFlow
Thermal Data Acquisition
Flow Meters
Pressure Transducers
Python
MATLAB
LabVIEW
CREO
Open Compute Project
AI Accelerators
High-Performance Computing
Thermal Test Vehicles
New Product Introduction
High-Volume Manufacturing
Quick-Disconnects
Electronics Packaging

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Work requirements

Jobs in Ottawa, ON and nearby