ePIC ASIC

ePIC ASIC provides end-to-end silicon design and semiconductor engineering services for advanced compute platforms, custom ASICs, and high-performance applications.

From early-stage architecture through tape-out and production, our team supports the complete chip development lifecycle, helping customers reduce technical risk, accelerate time to market, and optimize performance, power, and area (PPA).

Our capabilities include SoC architecture and microarchitecture, RTL development, IP integration, functional verification and validation, FPGA prototyping, physical design, floorplanning, place-and-route (PnR), analog and mixed-signal design, DRC/LVS, timing closure, signal-integrity analysis, power optimization, Design-for-Test (DFT), GDSII, tape-out, packaging, test, and silicon operations.

We bring particular expertise in high-performance computing (HPC), AI and data center infrastructure, high-bandwidth data movement, custom CPU architecture, specialized compute accelerators, and power-efficient silicon design. Our engineering workflows are designed for advanced process technologies and demanding compute workloads where performance, scalability, and efficiency are critical.

Beyond design, ePIC ASIC supports foundry coordination, wafer logistics, packaging and assembly, silicon validation, new product introduction (NPI), and the transition toward high-volume manufacturing - providing customers with a single engineering partner from concept to production-ready silicon.

Based in Toronto, Canada, our team brings decades of semiconductor experience across silicon architecture, ASIC design, verification, physical implementation, and manufacturing operations.

Turning ideas into silicon reality.