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Huawei Technologies Canada Co., Ltd.

Engineer - 6G RF Packaging

303 Terry Fox Drive, Ottawa, ON, K2K 3J1, Canada

The total target annual compensation for this position ranges from $106,000 to $156,000 depending on education, experience, and demonstrated expertise. · Full-time

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Job details

Pay: The total target annual compensation for this position ranges from $106,000 to $156,000 depending on education, experience, and demonstrated expertise.
Job type: Full-time
Posting language: English
Posted: Sep 11, 2026

Original job description

Huawei Canada has an immediate permanent opening for an Engineer.

About the team:
Welcome to the Advanced Wireless Technology Wireless Lab, an epitome of innovation located in Ottawa, Canada. Here, amid the dynamic panorama of technological progress, our team consists mainly of seasoned graduate computer engineers and computer scientists. With diverse experiences ranging from fresh perspectives to decades-long industry immersion, we are united by our fervour for pioneering wireless solutions.

About the job:

Explore 2.5D/3D integration, wafer-level packaging, diverse interposers, and embedded passives.
Study low-loss die-to-die and die-to-package interfaces, including micro-bumps, vias, and waveguide structures.
Develop embedded shielding, isolation structures, and localized cooling for high-power RF arrays.
Investigate additively manufactured RF structures and engineered materials for prototyping advantages.
Perform full-wave EM simulations to quantify interconnect loss, leakage, coupling, and noise.
Design package transitions, antenna feeds, and grounding networks across die, substrate, and board boundaries.
Coordinate VNA, thermal, and OTA array measurements to evaluate system-level package performance.
Partner with internal specialists (RFIC, antenna, materials, manufacturing) to frame cross-disciplinary research.
Secure patents and invention disclosures while publishing papers and internal technical reports.

The total target annual compensation for this position ranges from $106,000 to $156,000 depending on education, experience, and demonstrated expertise.

About the ideal candidate:

5 years of relevant industry experiences.
PhD in Electrical Engineering, RF/Microwave Engineering, Packaging, or a related field (or equivalent advanced R&D experience).
Deep knowledge of RF/microwave principles.
Experience using full-wave EM and circuit simulation tools to model packages and correlate results with measure.
Hands-on experience designing test vehicles and directing microelectronics assembly (e.g., PCB, flip-chip, wire bonding, SMT, molding).
Proficiency with RF lab equipment (VNAs), probe station.
Working knowledge of thermal management, CTE mismatch, stress, warpage, and reliability testing.

Additional Information:

Huawei Canada is committed to a fair, inclusive, and accessible recruitment process. If you require accommodation during any stage of the hiring process, please let us know and we will work with you to meet your needs.

All applications for this position are reviewed directly by our hiring team, we do not use artificial intelligence tools to screen or select candidates.

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More about this job

Responsibilities

The engineer will develop advanced 6G RF packaging solutions, including 2.5D/3D integration, embedded shielding, and localized cooling for high-power arrays. They will also perform full-wave EM simulations and coordinate system-level performance evaluations using VNA and thermal measurements.

Requirements

Candidates must hold a PhD in Electrical Engineering, RF/Microwave Engineering, or a related field with at least 5 years of relevant industry experience. Proficiency in full-wave EM simulation tools, RF lab equipment, and microelectronics assembly processes is required.

Skills

6G RF Packaging
EM Simulation
RF/Microwave Engineering
Wafer-level Packaging
Antenna Design
VNA
Thermal Management
Microelectronics Assembly
Flip-chip
Wire Bonding
SMT
Waveguide Structures
Embedded Shielding
Reliability Testing
Circuit Simulation

Visa sponsorship

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Keywords

6G
RF Packaging
EM Simulation
Wafer-level Packaging
Interposers
Embedded Passives
Micro-bumps
Waveguide
RF Arrays
Antenna Feeds
Grounding Networks
VNA
Thermal Management
CTE Mismatch
Reliability Testing
Flip-chip
Wire Bonding
SMT
Microelectronics
PCB
RFIC
Materials Science
Prototyping
Wireless Solutions
Patent
Technical Reporting

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