Lead Hardware Engineer with 8+ years of direct electronics design experience, including high-speed digital design and 2+ years as a technical lead, is expected, with a bachelor's degree in EE/CE (or equivalent)
Required Qualifications
- Experience with high-speed digital design and multi-layer PCB design, including 25Gbps+ interfaces (e.g., differential pairs, SerDes)
- In-depth understanding of the full hardware product development cycle: requirements, architecture, schematic capture, PCB layout, signal integrity, verification, and manufacturing
- Backgroundin FPGA designs, including power/thermal design
- Hands-on debugging using scopes, VNAs,signal generators, and electronic loads;comfortable with optical test sets and GHz+ oscilloscopes for eye-diagram, phase-noise, and signal-quality analysis
- Familiaritywith ESD, EMI, and RF design considerations
Tools, languages and platforms
- Cadence OrCAD (CaptureCIS), Design Entry HDL, MentorGraphics DxDesigner, AltiumDesigner for schematic capture
- Agilent ADS, ANSYS HFSS, MATLAB/Simulink, Cadence PSpice, LTspicefor design and simulation
Technologies
- High-speeddevices and protocols: DDR3/4/QDR memory interfaces, PCIe Gen4, MIPI, Gigabit Ethernet, USB-C, HDMI, SerDes, JESD204B
- Analog/mixed-signal: complexdesigns combining analog,digital, RF, and power; high current/high voltage isolation from low-voltage logic; FPGAs (CPLD, SoC, MPSoC, RFSoC), DSPs, microprocessors
- Power: low-power/battery systems and chargers, power sequencing, switch-mode power supply design, timing budget calculations
- Compliance and lifecycle: EMI, EMC, ESD, RoHS; component obsolescence and cost-reduction re-design; regulatory approval strategy
